AU2002230844A1 - Method and apparatus for distributing power to integrated circuits - Google Patents

Method and apparatus for distributing power to integrated circuits

Info

Publication number
AU2002230844A1
AU2002230844A1 AU2002230844A AU3084402A AU2002230844A1 AU 2002230844 A1 AU2002230844 A1 AU 2002230844A1 AU 2002230844 A AU2002230844 A AU 2002230844A AU 3084402 A AU3084402 A AU 3084402A AU 2002230844 A1 AU2002230844 A1 AU 2002230844A1
Authority
AU
Australia
Prior art keywords
integrated circuits
distributing power
distributing
power
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002230844A
Inventor
Michael C. Freda
Ali Hassanzadeh
Istvan Novak
Larry D. Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sun Microsystems Inc
Original Assignee
Sun Microsystems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sun Microsystems Inc filed Critical Sun Microsystems Inc
Publication of AU2002230844A1 publication Critical patent/AU2002230844A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
AU2002230844A 2000-10-30 2001-10-30 Method and apparatus for distributing power to integrated circuits Abandoned AU2002230844A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US24439700P 2000-10-30 2000-10-30
US60/244,397 2000-10-30
US09/809,837 US6794581B2 (en) 2000-10-30 2001-03-16 Method and apparatus for distributing power to integrated circuits
US09/809,837 2001-03-16
PCT/US2001/048337 WO2002037909A2 (en) 2000-10-30 2001-10-30 Method and apparatus for distributing power to integrated circuits

Publications (1)

Publication Number Publication Date
AU2002230844A1 true AU2002230844A1 (en) 2002-05-15

Family

ID=26936503

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002230844A Abandoned AU2002230844A1 (en) 2000-10-30 2001-10-30 Method and apparatus for distributing power to integrated circuits

Country Status (3)

Country Link
US (1) US6794581B2 (en)
AU (1) AU2002230844A1 (en)
WO (1) WO2002037909A2 (en)

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US6954984B2 (en) * 2002-07-25 2005-10-18 International Business Machines Corporation Land grid array structure
US7405364B2 (en) * 2002-12-30 2008-07-29 Intel Corporation Decoupled signal-power substrate architecture
US6992899B2 (en) * 2003-03-21 2006-01-31 Intel Corporation Power delivery apparatus, systems, and methods
US7536781B2 (en) * 2003-06-06 2009-05-26 Hewlett-Packard Development Company, L.P. Method of assembling an application specific integrated circuit (ASIC) assembly with attach hardware
TW200513784A (en) * 2003-10-01 2005-04-16 Delta Electronics Inc Light-shielding and heat-dissipating mask for a projector
JP4493981B2 (en) * 2003-10-31 2010-06-30 エスペック株式会社 Semiconductor device mounting member, semiconductor device mounting structure, and semiconductor device driving apparatus
US8520402B1 (en) * 2005-10-25 2013-08-27 Xilinx, Inc. Decoupling capacitor circuit assembly
US8018738B2 (en) * 2008-06-02 2011-09-13 Oracle America, Inc., Voltage regulator attach for high current chip applications
US9196564B2 (en) * 2013-03-14 2015-11-24 Futurewei Technologies, Inc. Apparatus and method for a back plate for heat sink mounting
US9136624B1 (en) * 2013-03-28 2015-09-15 Juniper Networks, Inc. Orthogonal cross-connecting of printed circuit boards without a midplane board
US9996120B1 (en) * 2015-05-22 2018-06-12 EMC IP Holding Company LLC PCB module for increased connectivity
JP2017191902A (en) * 2016-04-15 2017-10-19 ルネサスエレクトロニクス株式会社 Electronic device
US11710726B2 (en) * 2019-06-25 2023-07-25 Microsoft Technology Licensing, Llc Through-board power control arrangements for integrated circuit devices
US20200411495A1 (en) * 2019-06-25 2020-12-31 Microsoft Technology Licensing, Llc Through-board decoupling capacitance arrangements for integrated circuit devices
US11758697B2 (en) * 2019-09-26 2023-09-12 Ohio State Innovation Foundation Low inductance power module with vertical power loop structure and insulated baseplates
WO2023022981A1 (en) * 2021-08-19 2023-02-23 Tesla, Inc. Computing system with vertical clock delivery architecture

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1246836B (en) 1966-07-21 1967-08-10 Zuse K G Elektronische Rechena Pluggable module in the form of a printed circuit card
US3574630A (en) * 1969-06-04 1971-04-13 Eastman Kodak Co Stabilization of aqueous solutions of certain dyes
US3626081A (en) 1969-12-22 1971-12-07 Comcet Inc Sandwich-type voltage and ground plane
US3670208A (en) 1970-07-13 1972-06-13 Logic Dynamics Inc Microelectronic package, buss strip and printed circuit base assembly
US4628411A (en) 1984-03-12 1986-12-09 International Business Machines Corporation Apparatus for directly powering a multi-chip module from a power distribution bus
DE4002901A1 (en) 1989-04-01 1991-08-08 Manfred Haller CIRCUIT BOARD FOR THE OPTIMAL DECOUPLING OF CIRCUITS WITH DIGITAL IC'S
US5079069A (en) 1989-08-23 1992-01-07 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5235211A (en) * 1990-06-22 1993-08-10 Digital Equipment Corporation Semiconductor package having wraparound metallization
JPH04118984A (en) 1990-09-10 1992-04-20 Fujitsu Ltd Mounting structure for electronic component
US5261153A (en) 1992-04-06 1993-11-16 Zycon Corporation In situ method for forming a capacitive PCB
US5800575A (en) 1992-04-06 1998-09-01 Zycon Corporation In situ method of forming a bypass capacitor element internally within a capacitive PCB
US5854534A (en) * 1992-08-05 1998-12-29 Fujitsu Limited Controlled impedence interposer substrate
US5480309A (en) 1994-05-23 1996-01-02 Kel Corporation Universal multilayer base board assembly for integrated circuits
US5574630A (en) * 1995-05-11 1996-11-12 International Business Machines Corporation Laminated electronic package including a power/ground assembly
US5694297A (en) 1995-09-05 1997-12-02 Astec International Limited Integrated circuit mounting structure including a switching power supply
US5691041A (en) 1995-09-29 1997-11-25 International Business Machines Corporation Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer
US6175509B1 (en) 1997-05-14 2001-01-16 Hewlett-Packard Company Space efficient local regulator for a microprocessor
US5847936A (en) * 1997-06-20 1998-12-08 Sun Microsystems, Inc. Optimized routing scheme for an integrated circuit/printed circuit board
US6075285A (en) * 1997-12-15 2000-06-13 Intel Corporation Semiconductor package substrate with power die
US6081026A (en) * 1998-11-13 2000-06-27 Fujitsu Limited High density signal interposer with power and ground wrap
US6239485B1 (en) * 1998-11-13 2001-05-29 Fujitsu Limited Reduced cross-talk noise high density signal interposer with power and ground wrap
US6351393B1 (en) * 1999-07-02 2002-02-26 International Business Machines Corporation Electronic package for electronic components and method of making same
US6373717B1 (en) * 1999-07-02 2002-04-16 International Business Machines Corporation Electronic package with high density interconnect layer

Also Published As

Publication number Publication date
US20020129974A1 (en) 2002-09-19
WO2002037909A2 (en) 2002-05-10
US6794581B2 (en) 2004-09-21
WO2002037909A3 (en) 2003-01-23

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