CA2379337A1 - Circular or annular coating film forming method - Google Patents
Circular or annular coating film forming method Download PDFInfo
- Publication number
- CA2379337A1 CA2379337A1 CA002379337A CA2379337A CA2379337A1 CA 2379337 A1 CA2379337 A1 CA 2379337A1 CA 002379337 A CA002379337 A CA 002379337A CA 2379337 A CA2379337 A CA 2379337A CA 2379337 A1 CA2379337 A1 CA 2379337A1
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- Canada
- Prior art keywords
- substrate
- nozzle
- coating
- coating film
- circular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
- B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
A method of forming a circular or annular coating film on a substrate (W) using a device of simple structure without using coating liquid wastefully, comprising the steps of, using a painting device (A) formed of a rotatable table (1) suckingly holding the substrate (W) horizontally and a horizontally movable nozzle (10) liftable relative to the table (1) and having a delivery hole (10a) at the tip part thereof, rotating the table (1) and supplying coating liquid from the delivery hole (10a) in a linear state on to the substrate (W) while moving the nozzle (10) by a specified interval between the rotating center of the table (1) and an outward specified position in one direction with the nozzle (10) held at a specified height relative to the rotating table (1) so as to form a circular or annular coating film on the substrate (W).
Description
TITLE
CIRCULAR OR ANNULAR COATING FILM FORMING METHOD
TECHNICAL FIELD
The present invention relates to a method of forming a circular or an annular coating film on a substrate.
BACKGROUND OF THE INVENTION
Conventionally, coating methods by spin coater have been known, for example, as a method of applying resist liquid in a generally circular shape to a generally circular wafer. However, according to this method, most of the coating liquid (about 95~) would not be recycled but thrown away, resulting in a very poor yield.
Furthermore, a coating method by die coater has been proposed in Japanese Patent Laid-Open Publication No.lO-99764, in which resist liquid is applied in a circular shape to a wafer, by providing a shim (choke plate) within a slit of a die main body, the shim being advanceable and retreatable along the longitudinal direction of the slit, and by continuously advancing and retreating the shim during the coating process while traveling the die main body or the wafer (substrate) horizontally.
In this method, in order to prevent. the coating liquid from leaking through between the shim and the slit, the shim has to be held within the slit so as t.o be movable with precision and smoothness. Accordingly, when the shim arid the slit are manufactured and provided, not only quite a high level of precision is required, but a:Lso the shim has to be exchanged frequently due to heavy wear.
Moreover, in this method, since the movement of the shim results in nonuniformity of the supply pressure in the widthwise direction within the slit, uniform film thickness of the coating film in the widthwise direction can not be obtained.
Therefore, in recent years, a method is proposed in which a length of a slit of the die main body is made equal to a radius of the wafer such that coating liquid is applied without waste by positioning opposite ends of the slit at a center and an edge of the wafer, :respectively.
In this method, however, since an overlap portion of the slit is formed at the center of the wafer, involving an increased thickness of a coating film thickness at this overlap. portion, there is a problem that a.coating film of uniform thickness cannot be obtained.
Furthermore, in the foregoing coating method, there is a problem that an annular coating film cannot be formed.
CIRCULAR OR ANNULAR COATING FILM FORMING METHOD
TECHNICAL FIELD
The present invention relates to a method of forming a circular or an annular coating film on a substrate.
BACKGROUND OF THE INVENTION
Conventionally, coating methods by spin coater have been known, for example, as a method of applying resist liquid in a generally circular shape to a generally circular wafer. However, according to this method, most of the coating liquid (about 95~) would not be recycled but thrown away, resulting in a very poor yield.
Furthermore, a coating method by die coater has been proposed in Japanese Patent Laid-Open Publication No.lO-99764, in which resist liquid is applied in a circular shape to a wafer, by providing a shim (choke plate) within a slit of a die main body, the shim being advanceable and retreatable along the longitudinal direction of the slit, and by continuously advancing and retreating the shim during the coating process while traveling the die main body or the wafer (substrate) horizontally.
In this method, in order to prevent. the coating liquid from leaking through between the shim and the slit, the shim has to be held within the slit so as t.o be movable with precision and smoothness. Accordingly, when the shim arid the slit are manufactured and provided, not only quite a high level of precision is required, but a:Lso the shim has to be exchanged frequently due to heavy wear.
Moreover, in this method, since the movement of the shim results in nonuniformity of the supply pressure in the widthwise direction within the slit, uniform film thickness of the coating film in the widthwise direction can not be obtained.
Therefore, in recent years, a method is proposed in which a length of a slit of the die main body is made equal to a radius of the wafer such that coating liquid is applied without waste by positioning opposite ends of the slit at a center and an edge of the wafer, :respectively.
In this method, however, since an overlap portion of the slit is formed at the center of the wafer, involving an increased thickness of a coating film thickness at this overlap. portion, there is a problem that a.coating film of uniform thickness cannot be obtained.
Furthermore, in the foregoing coating method, there is a problem that an annular coating film cannot be formed.
SUNll~IARY OF THE INVENTION
The present invention having been accomplished with a view to eliminating these and other problems, an object of the invention is to provide a method of forming a circular or an annular coating film which makes it possible to obtain uniform film thickness by equipment of simple construction without wasting the coating fluid.
In order to achieve the above object, in the present invention, by using a coating apparatus constructed by a rotatable table on which a substrate is held horizontally through evacuation and, a nozzle which is movable vertically and horizontally above .the table and.
provided, at its distal end portion, with a discharge hole, in which a coating liquid is supplied linearly from the discharge hole to the substrate by moving the :nozzle in one direction in a predetermined interval between a rotational center of the table and a predetermined outer :position in a state where the table is rotated and the nozzle is held at a predetermined height from the rotating table.
According to the present invention, a circular or an annular coating film can be formed only by linearly moving the nozzle relative to the rotating substrate without providing any complex mechanisms in the coating apparatus and irrespectively of the substrate configuration. Additionally, according to the invention, there can be produced effects such as elimination of wasteful use of the coating liquid.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 is a plan view of a coating apparatus used for the present invention;
Fig. 2 is a sectional view taken a:Long the line II - II of Fig. 1;
Fig. 3 is a view taken along the line III - III
direction in Fig. 2; and Fig. 4 is a side view showing a move of the nozzle of the coating apparatus.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
An embodiment of the present invention is described below with reference to the accompanying drawings.
The drawings show a coating apparatus A for performing the present invention.
As shown in Fig. 1, this coating apparatus A is composed roughly of a table 1 and a nozzle 10: As shown in Fig. 2, the table 1 is fixed to one end of a hollow shaft 4 penetrating a base 6, and held by a bearing ~ provided at the penetrating portion of the base 6 so as to be rotatable together with the hollow shaft 4. The other end of the hollow shaft 4 is connected to an unshown vacuum pump via a rotary joint 7. A gear 8 is provided at a protruding portion of the hollow shaft 4 on the lower face' side of the base 6, such that the table 1 is rotated by dz~iving a gear 9 engaging with the gear 8 by a motor Ml.
The table 1 has a surface of a predetermined flatness, for example, a flatness of 2 ~.im or :Less. Inside the table 1, headers 2 are provided radial.ly so as to communicate with a space 4a in the hollow sh,3ft 4, and a multiplicity of evacuating holes 3 are provided so as to penetrate from each of the headers 2 to the surface of the table 1. Therefore, camber and undulation of <~ substrate W
can be corrected by driving the vacuum pump so that the substrate W is held .through evacuating on the surface of the table 1.
As shown in Figs. 1 and 2, a pedestal 11 moving to and fro by an unshown mechanism for horizontal transfer is mounted on two rails R which are disposed at opposite sides of a width of the base 6 so as to confront each other through the table 1. Further, a beam 14 is provided on the pedestal 11 through lifters 13 supporting both end portions of the beam 14, each lifter 13 being composed of a stepping motor MZ and a non-backlash ball screw 12. The nozzle 10 is held at a predetermined position of the beam 14, that is, such a position in which a discharge hole 10a of the nozzle 10 passes through the rotational center of the table 1 when the pedestal 11 moves to and fro.
The present invention having been accomplished with a view to eliminating these and other problems, an object of the invention is to provide a method of forming a circular or an annular coating film which makes it possible to obtain uniform film thickness by equipment of simple construction without wasting the coating fluid.
In order to achieve the above object, in the present invention, by using a coating apparatus constructed by a rotatable table on which a substrate is held horizontally through evacuation and, a nozzle which is movable vertically and horizontally above .the table and.
provided, at its distal end portion, with a discharge hole, in which a coating liquid is supplied linearly from the discharge hole to the substrate by moving the :nozzle in one direction in a predetermined interval between a rotational center of the table and a predetermined outer :position in a state where the table is rotated and the nozzle is held at a predetermined height from the rotating table.
According to the present invention, a circular or an annular coating film can be formed only by linearly moving the nozzle relative to the rotating substrate without providing any complex mechanisms in the coating apparatus and irrespectively of the substrate configuration. Additionally, according to the invention, there can be produced effects such as elimination of wasteful use of the coating liquid.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 is a plan view of a coating apparatus used for the present invention;
Fig. 2 is a sectional view taken a:Long the line II - II of Fig. 1;
Fig. 3 is a view taken along the line III - III
direction in Fig. 2; and Fig. 4 is a side view showing a move of the nozzle of the coating apparatus.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
An embodiment of the present invention is described below with reference to the accompanying drawings.
The drawings show a coating apparatus A for performing the present invention.
As shown in Fig. 1, this coating apparatus A is composed roughly of a table 1 and a nozzle 10: As shown in Fig. 2, the table 1 is fixed to one end of a hollow shaft 4 penetrating a base 6, and held by a bearing ~ provided at the penetrating portion of the base 6 so as to be rotatable together with the hollow shaft 4. The other end of the hollow shaft 4 is connected to an unshown vacuum pump via a rotary joint 7. A gear 8 is provided at a protruding portion of the hollow shaft 4 on the lower face' side of the base 6, such that the table 1 is rotated by dz~iving a gear 9 engaging with the gear 8 by a motor Ml.
The table 1 has a surface of a predetermined flatness, for example, a flatness of 2 ~.im or :Less. Inside the table 1, headers 2 are provided radial.ly so as to communicate with a space 4a in the hollow sh,3ft 4, and a multiplicity of evacuating holes 3 are provided so as to penetrate from each of the headers 2 to the surface of the table 1. Therefore, camber and undulation of <~ substrate W
can be corrected by driving the vacuum pump so that the substrate W is held .through evacuating on the surface of the table 1.
As shown in Figs. 1 and 2, a pedestal 11 moving to and fro by an unshown mechanism for horizontal transfer is mounted on two rails R which are disposed at opposite sides of a width of the base 6 so as to confront each other through the table 1. Further, a beam 14 is provided on the pedestal 11 through lifters 13 supporting both end portions of the beam 14, each lifter 13 being composed of a stepping motor MZ and a non-backlash ball screw 12. The nozzle 10 is held at a predetermined position of the beam 14, that is, such a position in which a discharge hole 10a of the nozzle 10 passes through the rotational center of the table 1 when the pedestal 11 moves to and fro.
As a result, it becomes possible for the discharge hole 10a of the nozzle 10 to move to and fro maintaining at a predetermined height from the surface of the table 1 along one direction between thES rotational center of the table 1 and the predetermined outer position on the substrate W.
Meanwhile, as shown in Fig. 3, the discharge hole 10a of the nozzle 10 is formed so as to supply the coating liquid linearly to the substrate W, which is held on the table 1 through evacuating.
Then, a method for using the coating apparatus A
having the above structure is. described.
Firstly, the pedestal 11 is transferred by the unshown mechanism for horizontal transfer :~o that the nozzle 10 is positioned on one end portion of the base 6 as shown in Fig. 1. Thereafter, the substrate W, which is a wafer for example, is disposed on the table 1, and by driving the vacuum pump, the substrate W is held onto the table 1 through evacuating.
Further, while the table 1 is rotate~~ by driving the motor Ml, the pedestal 11 is moved by the mechanism for the horizontal transfer so that the discharge hole 10a of the nozzle 10 is positioned above the rotational center of the table 1 as shown by two-dot chain line in Fig. 4.
Meanwhile, as shown in Fig. 3, the discharge hole 10a of the nozzle 10 is formed so as to supply the coating liquid linearly to the substrate W, which is held on the table 1 through evacuating.
Then, a method for using the coating apparatus A
having the above structure is. described.
Firstly, the pedestal 11 is transferred by the unshown mechanism for horizontal transfer :~o that the nozzle 10 is positioned on one end portion of the base 6 as shown in Fig. 1. Thereafter, the substrate W, which is a wafer for example, is disposed on the table 1, and by driving the vacuum pump, the substrate W is held onto the table 1 through evacuating.
Further, while the table 1 is rotate~~ by driving the motor Ml, the pedestal 11 is moved by the mechanism for the horizontal transfer so that the discharge hole 10a of the nozzle 10 is positioned above the rotational center of the table 1 as shown by two-dot chain line in Fig. 4.
Subsequently, by driving the stepping motors MZ, MZ, the nozzle 10 is moved downward so that the distal end of the nozzle 10 and the surface of the viable l are adjusted so as to be spaced from each other by a predetermined distance (reference gap).
Thereafter, by driving an unshown device for supplying coating liquid to supply the coating liquid to the nozzle 10, coating process is started. Thus, while coating is performed, the pedestal 11 (nozzle 10) is moved to a predetermined outer position on the sut~strate W as shown in Fig. 4.
In his case, the nozzle 10 is, basically, moved by the same distance as the width of the discharge hole 10a of the nozzle 10 (i.e., the width of discharged coating liquid) during one rotation of the table 1. However, the nozzle 10 may be moved by a distance larger than the width of the discharge hole 10a (i.e., the width of discharged coating liquid) depending on the properties of the coating liquid.
For example, leveling property is described here in properties of the coating liquid. When a coating liquid of poor leveling property is applied, the coating liquid is less likely to diffuse on the substrate surfa~~e, in which case it is advisable that the nozzle 10 is moved by the same distance as the width of the discharge hole 10a during one rotation of the table 1 so that a side face of the linear coating liquid supplied from the discharge hole 10a makes into contact with a side face of a coating film formed by the preceding rotation. In contrast to this, when a coating liquid of good leveling propert~~r is applied, the coating liquid is more likely to diffuse on the substrate surface, in which case it is advisable that the table 1 is moved by a distance larger than the width of the discharge hole 10a during one rotation of the table 1 so that a gap is formed between a side face of the coating film formed by the preceding rotation and a side face of the linear coating liquid supplied from the d~_scharge hole 10a.
Meanwhile, the leveling property of coating liquid means the fluidity of the coating liquid itself.
Therefore, in the case of good leveling pro~~erty of the coating liquid, when a predetermined time elapsed after the coating on the substrate, the formed coating film is diffused uniformly on the substrate surface by the fluidity of the coating liquid itself, resulting in a successful coating state free from streaks and nonuniformities. Thus, generally, the lower the viscosity of a coatin<~ liquid, the higher the leveling property of the coating liquid.
However, even though the viscosity of the coat~_ng liquid is low, for example, if the coating liquid using a solvent _ g _ having a very high volatility is applied to the substrate, it may occur that the solvent volatilizes and dries before the coating film is diffused uniformly on the substrate surface by the fluidity of the coating liquid itself, thereby resulting in streaks, nonuniformities or the like.
Such coating liquids are not good regarding leveling property in spite of low viscosity.
That is, since the substrate W is rotating, the linear coating fluid flows down from the discharge hole 10a as if it were flowing along a groove on a phonograph record surface, so that a coating film of circular shape and uniform_thickness.is formed ori.the substrate W by virtue of the centrifugal force based on the rotation of the substrate W and the leveling property of the coating liquid.
Then, after the nozzle 10 is moved horizontally through a distance equal to a radius of a desired circular coating film, the supply of the coating liquid is stopped and besides the rotation of the table 1 is stopped.
Subsequently, the stepping motors M2, MZ are rotated such that the nozzle 10 is lifted up to a ~~redetermined position, and further the horizontal transfer mechanism is driven such that the nozzle 10 is retreated to a predetermined position of the base 6, thus the nozzle 10 is set on standby for the succeeding step (see Fi~~. 1).
A circular coating film is form~ad on the substrate W by following the above steps, thereafter the vacuum pump is stopped and the substrate W is transferred to the succeeding process by an unshown means. Then, the next substrate W is disposed on the table 1, and the foregoing coating process is repeated again.
In the above description, the substrate W has been assumed to be a circular wafer. However, the substrate W is not limited to wafers, and the substrate configuration is not limited to circular shape, either.
Furthermore, the cross-sectional configuration of the discharge hole 10a may. be either circular or rectangular.
shape.
Furthermore, in the above description,, the nozzle 10 has been moved linearly from the rotational center of the table 1 toward an outer position on the :substrate W.
Conversely, the nozzle 10 may also be moved from a predetermined outer position on the substrate ~a toward the rotational center.
In the foregoing coating process, as the position of the nozzle 10 moves outward from the center ~~f the table 1 to an outer position on the substrate W or moves inward from the outer position to center position, the substrate W
under the discharge hole 10a varies in peripheral speed.
Therefore, the supply amount of the coating 1~_quid may be gradually increased or decreased in accordance with this variation in peripheral speed. Further, the peripheral speed at coating positions may be maintained constant at all times by varying the rotating speed of the table 1.
Meanwhile, the above-described configuration of the coating film is a circular shape. However, an annular coating film can be formed by supplying the coating liquid in a linear state onto the substrate from the discharge hole while the nozzle 10 is moved through a predetermined interval between the rotational center of the gable 1 and a predetermined outer position on the substrate in one direction. Moreover, striped-pattern coating films can also be formed by forming annular coating films at any arbitrary intervals on the same substrate.
Example:
As a result of applying the method according to the present invention under the following c~~nditions, a satisfactory coating film having a film thickness of 10 ~.un was formed:
(1) Substrate:
Diameter: 200 mm Rotating speed: 60 rpm (2) Nozzle:
Inner diameter: 1.0 mm Moving speed: 1.0 mm/sec.
Moving direction: toward center of substrate Moving range: from position of diameter 192 mm of substrate to substrate center ( diameter 0 mm ) Gap: 60 ~.un (distance between substrate and distal end of nozzle) Discharge amount: 100 at coating start position 0~ at coating end position (3) coating liquid Viscosity: 10 p (1000 cp)
Thereafter, by driving an unshown device for supplying coating liquid to supply the coating liquid to the nozzle 10, coating process is started. Thus, while coating is performed, the pedestal 11 (nozzle 10) is moved to a predetermined outer position on the sut~strate W as shown in Fig. 4.
In his case, the nozzle 10 is, basically, moved by the same distance as the width of the discharge hole 10a of the nozzle 10 (i.e., the width of discharged coating liquid) during one rotation of the table 1. However, the nozzle 10 may be moved by a distance larger than the width of the discharge hole 10a (i.e., the width of discharged coating liquid) depending on the properties of the coating liquid.
For example, leveling property is described here in properties of the coating liquid. When a coating liquid of poor leveling property is applied, the coating liquid is less likely to diffuse on the substrate surfa~~e, in which case it is advisable that the nozzle 10 is moved by the same distance as the width of the discharge hole 10a during one rotation of the table 1 so that a side face of the linear coating liquid supplied from the discharge hole 10a makes into contact with a side face of a coating film formed by the preceding rotation. In contrast to this, when a coating liquid of good leveling propert~~r is applied, the coating liquid is more likely to diffuse on the substrate surface, in which case it is advisable that the table 1 is moved by a distance larger than the width of the discharge hole 10a during one rotation of the table 1 so that a gap is formed between a side face of the coating film formed by the preceding rotation and a side face of the linear coating liquid supplied from the d~_scharge hole 10a.
Meanwhile, the leveling property of coating liquid means the fluidity of the coating liquid itself.
Therefore, in the case of good leveling pro~~erty of the coating liquid, when a predetermined time elapsed after the coating on the substrate, the formed coating film is diffused uniformly on the substrate surface by the fluidity of the coating liquid itself, resulting in a successful coating state free from streaks and nonuniformities. Thus, generally, the lower the viscosity of a coatin<~ liquid, the higher the leveling property of the coating liquid.
However, even though the viscosity of the coat~_ng liquid is low, for example, if the coating liquid using a solvent _ g _ having a very high volatility is applied to the substrate, it may occur that the solvent volatilizes and dries before the coating film is diffused uniformly on the substrate surface by the fluidity of the coating liquid itself, thereby resulting in streaks, nonuniformities or the like.
Such coating liquids are not good regarding leveling property in spite of low viscosity.
That is, since the substrate W is rotating, the linear coating fluid flows down from the discharge hole 10a as if it were flowing along a groove on a phonograph record surface, so that a coating film of circular shape and uniform_thickness.is formed ori.the substrate W by virtue of the centrifugal force based on the rotation of the substrate W and the leveling property of the coating liquid.
Then, after the nozzle 10 is moved horizontally through a distance equal to a radius of a desired circular coating film, the supply of the coating liquid is stopped and besides the rotation of the table 1 is stopped.
Subsequently, the stepping motors M2, MZ are rotated such that the nozzle 10 is lifted up to a ~~redetermined position, and further the horizontal transfer mechanism is driven such that the nozzle 10 is retreated to a predetermined position of the base 6, thus the nozzle 10 is set on standby for the succeeding step (see Fi~~. 1).
A circular coating film is form~ad on the substrate W by following the above steps, thereafter the vacuum pump is stopped and the substrate W is transferred to the succeeding process by an unshown means. Then, the next substrate W is disposed on the table 1, and the foregoing coating process is repeated again.
In the above description, the substrate W has been assumed to be a circular wafer. However, the substrate W is not limited to wafers, and the substrate configuration is not limited to circular shape, either.
Furthermore, the cross-sectional configuration of the discharge hole 10a may. be either circular or rectangular.
shape.
Furthermore, in the above description,, the nozzle 10 has been moved linearly from the rotational center of the table 1 toward an outer position on the :substrate W.
Conversely, the nozzle 10 may also be moved from a predetermined outer position on the substrate ~a toward the rotational center.
In the foregoing coating process, as the position of the nozzle 10 moves outward from the center ~~f the table 1 to an outer position on the substrate W or moves inward from the outer position to center position, the substrate W
under the discharge hole 10a varies in peripheral speed.
Therefore, the supply amount of the coating 1~_quid may be gradually increased or decreased in accordance with this variation in peripheral speed. Further, the peripheral speed at coating positions may be maintained constant at all times by varying the rotating speed of the table 1.
Meanwhile, the above-described configuration of the coating film is a circular shape. However, an annular coating film can be formed by supplying the coating liquid in a linear state onto the substrate from the discharge hole while the nozzle 10 is moved through a predetermined interval between the rotational center of the gable 1 and a predetermined outer position on the substrate in one direction. Moreover, striped-pattern coating films can also be formed by forming annular coating films at any arbitrary intervals on the same substrate.
Example:
As a result of applying the method according to the present invention under the following c~~nditions, a satisfactory coating film having a film thickness of 10 ~.un was formed:
(1) Substrate:
Diameter: 200 mm Rotating speed: 60 rpm (2) Nozzle:
Inner diameter: 1.0 mm Moving speed: 1.0 mm/sec.
Moving direction: toward center of substrate Moving range: from position of diameter 192 mm of substrate to substrate center ( diameter 0 mm ) Gap: 60 ~.un (distance between substrate and distal end of nozzle) Discharge amount: 100 at coating start position 0~ at coating end position (3) coating liquid Viscosity: 10 p (1000 cp)
Claims
1. Method of forming a circular or an annular coating film by using a coating apparatus constructed by a rotatable table on which a substrate is held horizontally through evacuating and, a nozzle which is movable vertically and horizontally above the table and provided, at its distal end portion, with a discharge hole, in which a coating liquid is supplied linearly from the discharge hole to the substrate by moving the nozzle in one direction in a predetermined interval between a rotational center of the table and a predetermined outer position in a state where the table is rotated and the nozzle is held at a predetermined height from the rotating table
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21515299 | 1999-07-29 | ||
| JP11/215152 | 1999-07-29 | ||
| JP2000044317 | 2000-02-22 | ||
| JP2000/44317 | 2000-02-22 | ||
| PCT/JP2000/004789 WO2001008814A1 (en) | 1999-07-29 | 2000-07-17 | Circular or annular coating film forming method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2379337A1 true CA2379337A1 (en) | 2001-02-08 |
Family
ID=26520706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002379337A Abandoned CA2379337A1 (en) | 1999-07-29 | 2000-07-17 | Circular or annular coating film forming method |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1205258A1 (en) |
| KR (1) | KR20020048376A (en) |
| CN (1) | CN1365302A (en) |
| CA (1) | CA2379337A1 (en) |
| WO (1) | WO2001008814A1 (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3655576B2 (en) | 2001-07-26 | 2005-06-02 | 株式会社東芝 | Liquid film forming method and semiconductor device manufacturing method |
| JP5089969B2 (en) * | 2006-12-04 | 2012-12-05 | 武蔵エンジニアリング株式会社 | Liquid material discharge device |
| CN101543810B (en) * | 2008-03-28 | 2012-04-18 | 汉能科技有限公司 | Device and method for fuel battery coating |
| EP2161303B1 (en) * | 2008-09-08 | 2016-07-27 | Tecnocap S.p.A. | A plastisol composition, and a method and a plant for applying the composition to container-closing capsules for creating a seal, and capsules constructed using the composition, the method and the plant |
| CN102698926B (en) * | 2012-05-03 | 2014-06-04 | 信华精机有限公司 | Automatic oil coating device for UV (Ultra Violet) lens lantern ring |
| CN104014940B (en) * | 2014-05-29 | 2016-03-16 | 大族激光科技产业集团股份有限公司 | The coating boring method of ceramic substrate, coating sol and coating unit |
| JP6764713B2 (en) * | 2016-07-05 | 2020-10-07 | 株式会社Ｓｃｒｅｅｎホールディングス | Application method |
| CN108212690A (en) * | 2018-03-29 | 2018-06-29 | 苏州浦灵达自动化科技有限公司 | A kind of robot coating device |
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| CN108890122B (en) * | 2018-07-28 | 2020-10-30 | 翔声科技（厦门）有限公司 | Scribing method of ceramic substrate |
| CN109482429A (en) * | 2018-12-20 | 2019-03-19 | 东莞市微应变传感科技有限公司 | A kind of equal glue machine of automatic centrifugal |
| CN110090771A (en) * | 2019-06-05 | 2019-08-06 | 舜宇光学(中山)有限公司 | Camera lens component automatic oiling device |
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| CN115007402B (en) * | 2022-04-13 | 2024-05-31 | 深圳市安优达自控设备有限公司 | Automatic dispensing and mounting device and method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH047816A (en) * | 1990-04-26 | 1992-01-13 | Sony Corp | Resist coating method |
| JPH0555134A (en) * | 1991-08-26 | 1993-03-05 | Mitsubishi Electric Corp | Production of semiconductor element |
| JPH05335298A (en) * | 1992-05-29 | 1993-12-17 | Tanaka Kikinzoku Kogyo Kk | Method for applying liquid photosensitive resist |
| SG93216A1 (en) * | 1993-03-25 | 2002-12-17 | Tokyo Electron Ltd | Method of forming coating film and apparatus therefor |
-
2000
- 2000-07-17 EP EP00944438A patent/EP1205258A1/en not_active Withdrawn
- 2000-07-17 KR KR1020027000855A patent/KR20020048376A/en not_active Application Discontinuation
- 2000-07-17 CN CN 00810892 patent/CN1365302A/en active Pending
- 2000-07-17 WO PCT/JP2000/004789 patent/WO2001008814A1/en not_active Application Discontinuation
- 2000-07-17 CA CA002379337A patent/CA2379337A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN1365302A (en) | 2002-08-21 |
| EP1205258A1 (en) | 2002-05-15 |
| KR20020048376A (en) | 2002-06-22 |
| WO2001008814A1 (en) | 2001-02-08 |
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Legal Events
| Date | Code | Title | Description |
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| FZDE | Discontinued |