JP4145468B2 - Method for forming circular coating film and annular coating film - Google Patents

Method for forming circular coating film and annular coating film Download PDF

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JP4145468B2
JP4145468B2 JP2000213639A JP2000213639A JP4145468B2 JP 4145468 B2 JP4145468 B2 JP 4145468B2 JP 2000213639 A JP2000213639 A JP 2000213639A JP 2000213639 A JP2000213639 A JP 2000213639A JP 4145468 B2 JP4145468 B2 JP 4145468B2
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substrate
coating
coating film
discharge hole
nozzle
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JP2001310155A (en
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卓也 横山
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Chugai Ro Co Ltd
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Chugai Ro Co Ltd
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Description

【０００１】
【発明の属する技術分野】
本発明は、基板上に円形塗布膜あるいは環状塗布膜を形成する方法に関するものである。
【０００２】
【従来の技術】
従来、たとえば、略円形のウエハ上に略円形にレジスト液を塗布する方法として、スピンコータによる塗布方法がある。しかしながら、この方法は、塗布液の大部分（約９５％）が再利用されることなく廃棄されるので歩留りが非常に悪いという課題を有する。
【０００３】
また、ダイコータによる塗布方法として、ダイ本体のスリット内にスリットの長手方向に進退可能なシム（閉塞板）を設け、塗布時に前記シムを連続的に進退させるとともにダイ本体もしくはウエハ（基板）を水平移動させ、ウエハ上にレジスト液を円形に塗布する方法が特開平１０−９９７６４号公報で提案されている。
【０００４】
しかし、この方法は、シムとスリットとの間から塗布液の漏れを防止するためにシムをスリット内に精密に、かつ、スムーズに移動できるように保持しなければならず、シムとスリットの製作および取付けに際して非常に高度な精度が要求されるばかりか、それだけ磨耗が激しいため頻繁にシムを交換しなければならなくなる。また、シムの移動によりスリット内の幅方向での供給圧が不均一になるため、幅方向における塗布膜厚を均一に形成できなくなるという課題を有する。
【０００５】
【発明が解決しようとする課題】
そこで、近年、ダイ本体のスリット長さを、ウエハの半径とほぼ同一長さとし、スリットの一端をウエハの中心に位置させ、他端をウエハの端部に合わせ、ウエハを回転することにより、塗布液を無駄なく塗布することが提案されているが、この方法ではウエハの中心にスリットの重複部が形成されるのでこの部分の塗布膜厚が厚くなり、均一な塗布膜厚が形成されないという課題を有する。
【０００６】
また、前述の塗布方法では環状塗布膜を形成できないという課題を有する。
【０００７】
したがって、本発明は簡単な構成で、塗布液を無駄にすることなく均一な膜厚の円形塗布膜あるいは環状塗布膜を形成することのできる円形塗布膜の形成方法を提供することを目的とする。
【０００８】
【課題を解決するための手段】
本発明は、前記目的を達成するために、基板を水平に吸引保持する回転可能なテーブルと、このテーブルに対して昇降可能に垂直に配置され、かつ、先端部に吐出孔を備えた水平移動可能なノズルとで構成される塗布装置を用いて、前記テーブルを回転させるとともに、前記ノズルをこの回転するテーブルに保持した基板の上方に保持した状態でテーブルの回転中心とこの回転中心からテーブルの径方向に離れた位置との間を前記テーブルが１回転する間に前記ノズルの吐出孔の幅以上の距離を一方向に移動させながら前記吐出孔から塗布液を線状態で前記基板上に供給し、前回の回転で形成した塗布膜の側面と吐出孔から供給する線状の塗布液の側面との間に隙間が形成されるようにすることにより、塗布液のレベリング性により前記基板上に均一な厚みの円形塗布膜を形成した後、前記テーブルを停止するようにしたものである。
【０００９】
また、基板を水平に吸引保持する回転可能なテーブルと、このテーブルに対して昇降可能に垂直に配置され、かつ、先端部に吐出孔を備えた水平移動可能なノズルとで構成される塗布装置を用いて、前記テーブルを回転させるとともに、前記ノズルをこの回転するテーブルに保持した基板の上方に保持した状態でテーブルの回転中心からテーブルの径方向に異なる距離だけ離れた２つの位置の間を前記テーブルが１回転する間に前記ノズルの吐出孔の幅以上の距離を一方向に移動させながら前記吐出孔から塗布液を線状態で前記基板上に供給し、前回の回転で形成した塗布膜の側面と吐出孔から供給する線状の塗布液の側面との間に隙間が形成されるようにすることにより、塗布液のレベリング性により前記基板上に均一な厚みの環状塗布膜を形成した後、前記テーブルを停止するようにしたものである。
【００１０】
【発明の実施の形態】
つぎに、本発明の実施の形態を図にしたがって説明する。
図は、本発明を実施するための塗布装置Ａを示す。
この塗布装置Ａは、図１に示すように大略、テーブル１とノズル１０とからなる。前記テーブル１は、図２に示すように、基台６を貫通して設けた中空軸４の一端に固定されており、前記基台６の貫通部に設けた軸受５を介して前記中空軸４とともに回転自在に保持されている。また、前記中空軸４の他端はロータリジョイント７を介して図示しない真空ポンプに接続されている。さらに、前記中空軸４の基台６下面側の突出部にはギヤ８が設けられ、このギヤ８と螺合するギヤ９をモータＭ1で駆動することにより、前記テーブル１を回転できるようになっている。
【００１１】
なお、前記テーブル１は、その表面が所定の平面度、たとえば２μｍ以下の平面度を有するとともに、その内部には前記中空軸４の空間４ａと連通するヘッダ２が放射状に設けてあり、各ヘッダ２からテーブル１の表面に貫通する多数の吸引孔３が設けてある。このため、前記真空ポンプを駆動することにより基板Ｗをテーブル１表面に吸引保持して基板Ｗの有するそりやうねりを矯正することができる。
【００１２】
さらに、図１ないし２に示すように、前記基台６の幅方向両側部に前記テーブル１を挟んで対向配置したレールＲ上へ図示しない水平移動機構により進退する架台１１を載置し、この架台１１上にステッピングモータＭ2とノンバックラッシュのボールネジ１２とからなる昇降機構１３を介してこの昇降機構１３に両側部を支持された梁１４を設ける。そして、この梁１４の所定位置、すなわち、前記架台１１の進退によりノズル１０の吐出孔１０ａが前記テーブル１の回転中心上部に位置することができる位置にノズル１０を保持する。
これにより、ノズル１０の吐出孔１０ａは前記テーブル１表面から所定高さを維持したままテーブル１の回転中心と外方の所定位置との間を一方向に進退することができる。
【００１３】
なお、前記ノズル１０の吐出孔１０ａは、図３に示すように、前記テーブル１上に吸引保持されている基板Ｗに対して塗布液を線状に供給するよう形成してある。
【００１４】
つぎに、前記構成の塗布装置Ａの使用方法を説明する。
まず、図示しない水平移動機構により架台１１を移動して、前記ノズル１０を図１に示すように基台６の一端側に位置させたのち、たとえば、ウエハからなる基板Ｗをテーブル１上に載置し、真空ポンプを駆動してテーブル１上に前記基板Ｗを吸引保持する。
【００１５】
その後、モータＭ1を駆動してテーブル１を回転させる一方、前記架台１１を水平移動機構により移動させて、図４に仮想線で示すようにノズル１０の吐出孔１０ａをテーブル１の回転中心上方に位置させる。
【００１６】
ついで、前記ステッピングモータＭ2、Ｍ2を駆動してノズル１０を下降させ、ノズル１０の先端とテーブル１の表面とが予め設定された所定距離（基準ギャップ）となるように調節する。
【００１７】
その後、図示しない塗布液供給装置を駆動してノズル１０に塗布液を供給し、塗布を開始するとともに前記架台１１（ノズル１０）を図４に示すように基板Ｗの外方の所定位置まで移動させる。
このとき、ノズル１０の移動量は、テーブル１が１回転する間にノズル１０の吐出孔１０ａの幅分（吐出された塗布液の幅分）だけ移動することを基本とするが、塗布液の性状により吐出孔１０ａの幅（吐出された塗布液の幅）以上の距離を移動してもよい。
【００１８】
たとえば塗布液の性状としてレベリング性について見てみると、レベリング性の悪い塗布液を塗布する場合、塗布液が慣らされ難い（広がり難い）のでテーブル１が１回転する間に吐出孔１０ａの幅分だけ移動するようにし、前回の回転で形成した塗布膜の側面に吐出孔１０ａから供給する線状の塗布液の側面が接するようにすれば良いし、また、レベリング性の良い塗布液を塗布する場合、塗布液が慣らされ易い（広がり易い）のでテーブル１が１回転する間に吐出孔１０ａの幅以上の距離を移動するようにし、前回の回転で形成した塗布膜の側面と吐出孔１０ａから供給する線状の塗布液の側面との間に隙間が形成されるようにすれば良い。
【００１９】
なお、塗布液のレベリング性とは塗布液自体の流動性のことであり、塗布液のレベリング性が良ければ基板へ塗布を施したのち、所定時間が経過すると形成された塗布膜が塗布液自体の流動性で慣らされ、スジ、ムラのない良好な塗布状態となる。このため、一般的には、塗布液の粘度が低いほどレベリング性は高いということになる。しかし、塗布液の粘度が低くても、たとえば揮発性の非常に高い溶剤を用いた塗布液を塗布したような場合、塗布膜が塗布液自体の流動性で慣らされる前に溶剤が揮発して乾燥してしまい、スジ、ムラ等が発生することがある。このような塗布液は粘度が低くてもレベリング性は良くないということになる。
【００２０】
このように、吐出孔１０ａから流下する線状の塗布液は、基板Ｗが回転しているため、あたかもレコード面の溝に相当する部分のように流下し、基板Ｗの回転に基づく遠心力と塗布液のレベリング性により基板Ｗ上に円形の均一な厚みの塗布膜を形成することになる。
【００２１】
前記のようにして、所望の円形塗布膜の半径分だけノズル１０を水平移動したら、塗布液の供給を停止するとともに、次にテーブル１の回転を停止し、その後、ステッピングモータＭ2、Ｍ2を回転させてノズル１０を所定位置まで上昇させるとともに、水平移動機構を駆動してノズル１０を基台６の所定位置に後退させ、次の工程に備える（図１）。
【００２２】
前述のようにして基板Ｗ上に円形塗布膜が形成されると、真空ポンプを停止し、図示しない手段で基板Ｗを次工程に移送し、つぎの基板Ｗをテーブル１に載置し、再び前記塗布工程を行うものである。
【００２３】
なお、前記説明では基板Ｗを円形のウエハとしたが、基板Ｗはウエハに限定するものではなく、かつ、基板の形状も円形に限定するものではない。また、吐出孔１０ａの断面形状は、円形、方形のいずれでも良い。
【００２４】
さらに、前記説明では、ノズル１０をテーブル１の回転中心から基板Ｗの外方に向って直線的に移動させたが、逆に、基板Ｗ外方の所定位置から回転中心に向って移動させても良い。
【００２５】
また、前記塗布工程において、ノズル１０の位置がテーブル１の中心から外方に、あるいは外方から中心に移動するにつれて、吐出孔１０ａ下の基板Ｗの周速が変化するため、この周速の変化に合わせて塗布液の供給量を徐々に増加あるいは減少しても良いし、テーブル１の回転数を変化させて塗布位置での周速が常に一定となるようにしてもよい。
【００２６】
ところで、前述の説明では、塗布膜の形状を円形としたが、テーブルの回転中心と外方所定位置との間の所定区間を一方向に移動させながら前記吐出孔から塗布液を線状態で前記基板上に供給することにより、環状の塗布膜を形成することができる。さらに、同一基板上に任意の間隔で環状塗布膜を形成することにより、縞状の塗布膜を形成することもできる。
【００２７】
実施例
以下の条件の下で、本発明に係る方法を適用した結果、膜厚１０μｍの良好な塗布膜が形成された。

Figure 0004145468
【００２８】
【発明の効果】
以上の説明で明らかなように、本発明によれば、塗布装置に複雑な機構を設けることなく、回転する基板に対してノズルを直線移動させるだけで基板の形状に関係なく、円形塗布膜あるいは環状塗布膜を形成することができる。しかも、塗布液の無駄も殆どない等の効果を奏する。
【図面の簡単な説明】
【図１】 本発明に使用する塗布装置の平面図。
【図２】 図１のII−II線断面図。
【図３】 図２のIII−III線矢視図。
【図４】 塗布装置のノズルの移動を示す側面図。
【符号の説明】
１〜テーブル、３〜吸引孔、４〜中空軸、６〜基台、１０〜ノズル、１０ａ〜吐出孔、１１〜架台、１３〜昇降装置、Ｍ１〜モータ、Ｍ２〜ステッピングモータ、Ｒ〜レール、Ｗ〜基板。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for forming a circular coating film or an annular coating film on a substrate.
[0002]
[Prior art]
Conventionally, for example, as a method of applying a resist solution in a substantially circular shape on a substantially circular wafer, there is a coating method using a spin coater. However, this method has a problem that the yield is very poor because most of the coating solution (about 95%) is discarded without being reused.
[0003]
In addition, as a coating method using a die coater, a shim (blocking plate) capable of moving back and forth in the longitudinal direction of the slit is provided in the slit of the die body, and the shim is continuously advanced and retracted during coating and the die body or wafer (substrate) is horizontally disposed. Japanese Laid-Open Patent Publication No. 10-99764 proposes a method of moving and applying a resist solution in a circle on a wafer.
[0004]
However, in this method, in order to prevent the coating liquid from leaking between the shim and the slit, the shim must be held in the slit so that it can be moved precisely and smoothly. In addition, not only a very high degree of accuracy is required for installation, but the shims must be replaced frequently due to the excessive wear. Further, since the supply pressure in the width direction in the slit becomes non-uniform due to the movement of the shim, there is a problem that the coating film thickness in the width direction cannot be formed uniformly.
[0005]
[Problems to be solved by the invention]
Therefore, in recent years, the slit length of the die body is made substantially the same as the radius of the wafer, one end of the slit is positioned at the center of the wafer, the other end is aligned with the edge of the wafer, and the wafer is rotated. Although it has been proposed to apply the liquid without waste, this method has a problem that an overlapping portion of the slit is formed at the center of the wafer, so that the coating film thickness of this portion becomes thick and a uniform coating film thickness cannot be formed. Have
[0006]
Further, there is a problem that an annular coating film cannot be formed by the above-described coating method.
[0007]
SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method for forming a circular coating film that can form a circular coating film or a circular coating film having a uniform film thickness with a simple configuration without wasting a coating liquid. .
[0008]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a rotatable table that sucks and holds a substrate horizontally, and a horizontal movement that is vertically disposed so as to be movable up and down with respect to the table and that has a discharge hole at the tip. possible using constituted coating apparatus with a nozzle table, along with rotating the table, the nozzle and the rotation center of the table while retained above the substrate held on the table to the rotation from the rotation center The coating liquid is linearly applied from the discharge holes onto the substrate while moving the distance more than the width of the discharge holes of the nozzles in one direction while the table rotates once between the positions separated from each other in the radial direction. supplied by such a gap is formed between the side surface of the line-shaped coating liquid supplied from the side and the discharge hole of the coating film formed in the previous rotation, the substrate by the leveling of the coating solution After forming the circular coating film having a uniform thickness, it is obtained so as to stop the table.
[0009]
Also, a coating apparatus comprising: a rotatable table that horizontally sucks and holds a substrate; and a horizontally movable nozzle that is vertically disposed so as to be movable up and down with respect to the table and that has a discharge hole at the tip. using, it rotates the said table, during the different distances apart two positions from the center of rotation of the table while retained in the radial direction of the table above the substrate holding the nozzle on the table of the rotary While the table is rotated once, the coating liquid is supplied to the substrate in a linear state from the discharge holes while moving a distance greater than the width of the discharge holes of the nozzles in one direction, and formed by the previous rotation. by such a gap is formed between the side surface and the side surface of the line-shaped coating liquid supplied from the ejection hole of the membrane, an annular coating film having a uniform thickness on the substrate by the leveling of the coating solution After formation, it is obtained so as to stop the table.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings.
The figure shows a coating apparatus A for carrying out the present invention.
As shown in FIG. 1, the coating apparatus A generally includes a table 1 and a nozzle 10. As shown in FIG. 2, the table 1 is fixed to one end of a hollow shaft 4 provided through a base 6, and the hollow shaft is interposed via a bearing 5 provided in a through portion of the base 6. 4 is rotatably held together. The other end of the hollow shaft 4 is connected to a vacuum pump (not shown) via a rotary joint 7. Moreover, said the protruding portion of the base 6 the lower surface side of the hollow shaft fourth gear 8 is provided, by driving the gear 9 engaged with the gear 8 by the motor M 1, so that it can rotate the table 1 It has become.
[0011]
The table 1 has a surface having a predetermined flatness, for example, a flatness of 2 μm or less, and headers 2 communicating with the spaces 4a of the hollow shaft 4 are provided radially therein. A number of suction holes 3 penetrating from 2 to the surface of the table 1 are provided. For this reason, by driving the vacuum pump, the substrate W can be sucked and held on the surface of the table 1 to correct the warpage or undulation of the substrate W.
[0012]
Further, as shown in FIGS. 1 and 2, a pedestal 11 that is advanced and retracted by a horizontal movement mechanism (not shown) is placed on rails R arranged opposite to each other across the table 1 on both sides of the base 6 in the width direction. A beam 14 supported on both sides of the lifting mechanism 13 is provided on a gantry 11 via a lifting mechanism 13 including a stepping motor M 2 and a non-backlash ball screw 12. And the nozzle 10 is hold | maintained in the predetermined position of this beam 14, ie, the position where the discharge hole 10a of the nozzle 10 can be located in the rotation center upper part of the said table 1 by the advance / retreat of the said base 11. FIG.
Thereby, the discharge hole 10a of the nozzle 10 can advance and retreat in one direction between the rotation center of the table 1 and a predetermined position outside the table 1 while maintaining a predetermined height from the surface of the table 1.
[0013]
As shown in FIG. 3, the discharge hole 10 a of the nozzle 10 is formed so as to supply the coating liquid in a linear manner to the substrate W sucked and held on the table 1.
[0014]
Below, the usage method of the coating device A of the said structure is demonstrated.
First, the gantry 11 is moved by a horizontal movement mechanism (not shown), and the nozzle 10 is positioned on one end side of the base 6 as shown in FIG. 1, and then, for example, a substrate W made of a wafer is placed on the table 1. The substrate W is sucked and held on the table 1 by driving a vacuum pump.
[0015]
Thereafter, the motor M 1 is driven to rotate the table 1, while the gantry 11 is moved by a horizontal movement mechanism so that the discharge hole 10 a of the nozzle 10 is positioned above the rotation center of the table 1 as indicated by a virtual line in FIG. To be located.
[0016]
Next, the stepping motors M 2 and M 2 are driven to lower the nozzle 10 so that the tip of the nozzle 10 and the surface of the table 1 are adjusted to a predetermined distance (reference gap) set in advance.
[0017]
Thereafter, a coating liquid supply device (not shown) is driven to supply the coating liquid to the nozzle 10 to start coating, and the platform 11 (nozzle 10) is moved to a predetermined position outside the substrate W as shown in FIG. Let
At this time, the movement amount of the nozzle 10 is basically moved by the width of the discharge hole 10a of the nozzle 10 (the width of the discharged coating liquid) while the table 1 makes one rotation. Depending on the properties, a distance greater than the width of the discharge hole 10a (the width of the discharged coating liquid) may be moved.
[0018]
For example, when looking at leveling properties as the properties of the coating solution, when applying a coating solution with poor leveling properties, the coating solution is difficult to be used (difficult to spread). And the side surface of the linear coating solution supplied from the discharge hole 10a may be in contact with the side surface of the coating film formed by the previous rotation, or a coating solution having a good leveling property may be applied. In this case, since the coating liquid is easily acclimatized (spreads easily), the table 1 is moved by a distance more than the width of the discharge hole 10a during one rotation, and from the side surface of the coating film formed by the previous rotation and the discharge hole 10a. What is necessary is just to make it a clearance gap form between the side surfaces of the linear coating liquid to supply.
[0019]
The leveling property of the coating solution is the fluidity of the coating solution itself. If the leveling property of the coating solution is good, the coating film formed after a predetermined time has passed after the application to the substrate. It becomes accustomed by the fluidity of the film and becomes a good coating state without streaks and unevenness. For this reason, generally, the lower the viscosity of the coating solution, the higher the leveling property. However, even if the viscosity of the coating solution is low, for example, when a coating solution using a very volatile solvent is applied, the solvent is volatilized before the coating film is accustomed by the fluidity of the coating solution itself. It may dry out and cause streaks, unevenness, etc. Even if such a coating liquid has a low viscosity, it means that the leveling property is not good.
[0020]
Thus, since the substrate W is rotating, the linear coating liquid flowing down from the discharge hole 10a flows down as if it is a portion corresponding to the groove on the record surface, and the centrifugal force based on the rotation of the substrate W Due to the leveling property of the coating liquid, a circular coating film having a uniform thickness is formed on the substrate W.
[0021]
As described above, when the nozzle 10 is moved horizontally by the radius of the desired circular coating film, the supply of the coating liquid is stopped and the rotation of the table 1 is then stopped, and then the stepping motors M 2 and M 2 are stopped. Is rotated to raise the nozzle 10 to a predetermined position, and the horizontal movement mechanism is driven to retract the nozzle 10 to a predetermined position on the base 6 to prepare for the next step (FIG. 1).
[0022]
When the circular coating film is formed on the substrate W as described above, the vacuum pump is stopped, the substrate W is transferred to the next process by means not shown, the next substrate W is placed on the table 1, and again. The coating process is performed.
[0023]
In the above description, the substrate W is a circular wafer. However, the substrate W is not limited to a wafer, and the shape of the substrate is not limited to a circle. Further, the cross-sectional shape of the discharge hole 10a may be either a circle or a square.
[0024]
Further, in the above description, the nozzle 10 is linearly moved from the rotation center of the table 1 toward the outside of the substrate W. Conversely, the nozzle 10 is moved from a predetermined position outside the substrate W toward the rotation center. Also good.
[0025]
Further, in the coating step, as the position of the nozzle 10 moves from the center of the table 1 to the outside or from the outside to the center, the peripheral speed of the substrate W under the discharge hole 10a changes. The supply amount of the coating liquid may be gradually increased or decreased in accordance with the change, or the rotational speed of the table 1 may be changed so that the peripheral speed at the coating position is always constant.
[0026]
By the way, in the above description, the shape of the coating film is circular, but the coating liquid is linearly moved from the discharge hole while moving in a predetermined direction between the rotation center of the table and a predetermined outer position. By supplying on the substrate, an annular coating film can be formed. Furthermore, a striped coating film can be formed by forming an annular coating film at an arbitrary interval on the same substrate.
[0027]
Example As a result of applying the method according to the present invention under the following conditions, a good coating film having a thickness of 10 μm was formed.
Figure 0004145468
[0028]
【The invention's effect】
As is apparent from the above description, according to the present invention, a circular coating film or a film can be formed by simply moving the nozzle linearly relative to the rotating substrate without providing a complicated mechanism in the coating apparatus. An annular coating film can be formed. In addition, there are effects such as almost no waste of the coating liquid.
[Brief description of the drawings]
FIG. 1 is a plan view of a coating apparatus used in the present invention.
FIG. 2 is a cross-sectional view taken along the line II-II in FIG.
3 is a view taken along the line III-III in FIG.
FIG. 4 is a side view showing movement of a nozzle of a coating apparatus.
[Explanation of symbols]
1 to table, 3 to suction hole, 4 to hollow shaft, 6 to base, 10 to nozzle, 10a to discharge hole, 11 to mount, 13 to lifting device, M1 to motor, M2 to stepping motor, R to rail, W to substrate.

Claims (2)

基板を水平に吸引保持する回転可能なテーブルと、このテーブルに対して昇降可能に垂直に配置され、かつ、先端部に吐出孔を備えた水平移動可能なノズルとで構成される塗布装置を用いて、前記テーブルを回転させるとともに、前記ノズルをこの回転するテーブルに保持した基板の上方に保持した状態でテーブルの回転中心とこの回転中心からテーブルの径方向に離れた位置との間を前記テーブルが１回転する間に前記ノズルの吐出孔の幅以上の距離を一方向に移動させながら前記吐出孔から塗布液を線状態で前記基板上に供給し、前回の回転で形成した塗布膜の側面と吐出孔から供給する線状の塗布液の側面との間に隙間が形成されるようにすることにより、塗布液のレベリング性により前記基板上に均一な厚みの円形塗布膜を形成した後、前記テーブルを停止することを特徴とする円形塗布膜の形成方法。Using a coating device comprising a rotatable table that horizontally sucks and holds a substrate, and a horizontally movable nozzle that is vertically arranged so as to be movable up and down with respect to the table and that has a discharge hole at the tip. Te, along with rotating the table, between a position away the nozzle from the rotation center and the rotation center of the table in the radial direction of the table while retained above the substrate held on the table to this rotation the While the table is rotated once, the coating liquid is supplied to the substrate in a linear state from the discharge hole while moving a distance greater than the width of the discharge hole of the nozzle in one direction, and the coating film formed by the previous rotation by such a gap between the side surface of the line-shaped coating liquid supplied from the side and the discharge hole is formed, to form a circular coating film having a uniform thickness on the substrate by the leveling of the coating solution The method of forming a circular coating film, characterized in that to stop the table. 基板を水平に吸引保持する回転可能なテーブルと、このテーブルに対して昇降可能に垂直に配置され、かつ、先端部に吐出孔を備えた水平移動可能なノズルとで構成される塗布装置を用いて、前記テーブルを回転させるとともに、前記ノズルをこの回転するテーブルに保持した基板の上方に保持した状態でテーブルの回転中心からテーブルの径方向に異なる距離だけ離れた２つの位置の間を前記テーブルが１回転する間に前記ノズルの吐出孔の幅以上の距離を一方向に移動させながら前記吐出孔から塗布液を線状態で前記基板上に供給し、前回の回転で形成した塗布膜の側面と吐出孔から供給する線状の塗布液の側面との間に隙間が形成されるようにすることにより、塗布液のレベリング性により前記基板上に均一な厚みの環状塗布膜を形成した後、前記テーブルを停止することを特徴とする環状塗布膜の形成方法。Using a coating device comprising a rotatable table that horizontally sucks and holds a substrate, and a horizontally movable nozzle that is vertically arranged so as to be movable up and down with respect to the table and that has a discharge hole at the tip. Te, along with rotating the table, between the different distance away two positions from the center of rotation of the table while retained in the radial direction of the table above the substrate holding the nozzle on the table of the rotation the While the table is rotated once, the coating liquid is supplied to the substrate in a linear state from the discharge hole while moving a distance greater than the width of the discharge hole of the nozzle in one direction, and the coating film formed by the previous rotation by such a gap between the side surface of the line-shaped coating liquid supplied from the side and the discharge hole is formed, forming an annular coating layer having a uniform thickness on the substrate by the leveling of the coating solution After, the method of forming the annular coating film, characterized in that to stop the table.
JP2000213639A 1999-07-29 2000-07-14 Method for forming circular coating film and annular coating film Expired - Lifetime JP4145468B2 (en)

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