JP2001310155A - Method for forming circular coating film and annular coating film - Google Patents
Method for forming circular coating film and annular coating filmInfo
- Publication number
- JP2001310155A JP2001310155A JP2000213639A JP2000213639A JP2001310155A JP 2001310155 A JP2001310155 A JP 2001310155A JP 2000213639 A JP2000213639 A JP 2000213639A JP 2000213639 A JP2000213639 A JP 2000213639A JP 2001310155 A JP2001310155 A JP 2001310155A
- Authority
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- Japan
- Prior art keywords
- nozzle
- coating film
- substrate
- coating
- coating liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、基板上に円形塗布
膜あるいは環状塗布膜を形成する方法に関するものであ
る。The present invention relates to a method for forming a circular coating film or a circular coating film on a substrate.
【０００２】[0002]
【従来の技術】従来、たとえば、略円形のウエハ上に略
円形にレジスト液を塗布する方法として、スピンコータ
による塗布方法がある。しかしながら、この方法は、塗
布液の大部分（約９５％）が再利用されることなく廃棄
されるので歩留りが非常に悪いという課題を有する。2. Description of the Related Art Conventionally, for example, a method of applying a resist liquid in a substantially circular shape on a substantially circular wafer includes a coating method using a spin coater. However, this method has a problem that the yield is very poor because most (about 95%) of the coating liquid is discarded without being reused.
【０００３】また、ダイコータによる塗布方法として、
ダイ本体のスリット内にスリットの長手方向に進退可能
なシム（閉塞板）を設け、塗布時に前記シムを連続的に
進退させるとともにダイ本体もしくはウエハ（基板）を
水平移動させ、ウエハ上にレジスト液を円形に塗布する
方法が特開平１０−９９７６４号公報で提案されてい
る。[0003] As a coating method using a die coater,
A shim (closing plate) is provided in the slit of the die body, which is capable of moving back and forth in the longitudinal direction of the slit. The shim is continuously moved forward and backward during coating, and the die body or wafer (substrate) is horizontally moved. Has been proposed in JP-A-10-99764.
【０００４】しかし、この方法は、シムとスリットとの
間から塗布液の漏れを防止するためにシムをスリット内
に精密に、かつ、スムーズに移動できるように保持しな
ければならず、シムとスリットの製作および取付けに際
して非常に高度な精度が要求されるばかりか、それだけ
磨耗が激しいため頻繁にシムを交換しなければならなく
なる。また、シムの移動によりスリット内の幅方向での
供給圧が不均一になるため、幅方向における塗布膜厚を
均一に形成できなくなるという課題を有する。However, in this method, in order to prevent the coating solution from leaking from between the shim and the slit, it is necessary to hold the shim precisely and smoothly in the slit. Not only is a very high degree of precision required in the production and installation of the slits, but also the wear is so great that the shims have to be changed frequently. In addition, since the supply pressure in the width direction in the slit becomes non-uniform due to the movement of the shim, there is a problem that the coating film thickness in the width direction cannot be formed uniformly.
【０００５】[0005]
【発明が解決しようとする課題】そこで、近年、ダイ本
体のスリット長さを、ウエハの半径とほぼ同一長さと
し、スリットの一端をウエハの中心に位置させ、他端を
ウエハの端部に合わせ、ウエハを回転することにより、
塗布液を無駄なく塗布することが提案されているが、こ
の方法ではウエハの中心にスリットの重複部が形成され
るのでこの部分の塗布膜厚が厚くなり、均一な塗布膜厚
が形成されないという課題を有する。Therefore, in recent years, the slit length of the die body has been made substantially the same as the radius of the wafer, one end of the slit is positioned at the center of the wafer, and the other end is aligned with the end of the wafer. By rotating the wafer,
Although it has been proposed to apply the coating liquid without waste, in this method, since an overlapping portion of the slit is formed at the center of the wafer, the coating film thickness in this portion is increased, and a uniform coating film thickness is not formed. Have issues.
【０００６】また、前述の塗布方法では環状塗布膜を形
成できないという課題を有する。Another problem is that the above-mentioned coating method cannot form an annular coating film.
【０００７】したがって、本発明は簡単な構成で、塗布
液を無駄にすることなく均一な膜厚の円形塗布膜あるい
は環状塗布膜を形成することのできる円形塗布膜の形成
方法を提供することを目的とする。Accordingly, the present invention provides a method for forming a circular coating film having a simple structure and capable of forming a circular coating film or a circular coating film having a uniform thickness without wasting the coating liquid. Aim.
【０００８】[0008]
【課題を解決するための手段】本発明は、前記目的を達
成するために、基板を水平に吸引保持する回転可能なテ
ーブルと、このテーブルに対して昇降可能で、かつ、先
端部に吐出孔を備えた水平移動可能なノズルとで構成さ
れる塗布装置を用いて、前記テーブルを回転させるとと
もに、前記ノズルをこの回転するテーブルに対して所定
高さに保持した状態でテーブルの回転中心と外方所定位
置との間を一方向に移動させながら前記吐出孔から塗布
液を線状態で前記基板上に供給するようにしたものであ
る。SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a rotatable table for horizontally sucking and holding a substrate, a vertically movable table with respect to the table, and a discharge port at the tip. The table is rotated using a coating apparatus including a horizontally movable nozzle having a nozzle. The nozzle is held at a predetermined height with respect to the rotating table, and the table is rotated with respect to the center of rotation of the table. The coating liquid is supplied from the discharge hole to the substrate in a linear state while moving in one direction between the predetermined position and the predetermined position.
【０００９】また、基板を水平に吸引保持する回転可能
なテーブルと、このテーブルに対して昇降可能で、か
つ、先端部に吐出孔を備えた水平移動可能なノズルとで
構成される塗布装置を用いて、前記テーブルを回転させ
るとともに、前記ノズルをこの回転するテーブルに対し
て所定高さに保持した状態でテーブルの回転中心と外方
所定位置との間の所定区間を一方向に移動させながら前
記吐出孔から塗布液を線状態で前記基板上に供給するよ
うにしたものである。Further, there is provided a coating apparatus comprising a rotatable table for horizontally sucking and holding a substrate, and a horizontally movable nozzle having a discharge hole at a tip end thereof which can be moved up and down with respect to the table. While rotating the table, while moving the predetermined section between the rotation center of the table and a predetermined outside position in one direction while holding the nozzle at a predetermined height with respect to the rotating table, The coating liquid is supplied onto the substrate in a linear state from the discharge hole.
【００１０】[0010]
【発明の実施の形態】つぎに、本発明の実施の形態を図
にしたがって説明する。図は、本発明を実施するための
塗布装置Ａを示す。この塗布装置Ａは、図１に示すよう
に大略、テーブル１とノズル１０とからなる。前記テー
ブル１は、図２に示すように、基台６を貫通して設けた
中空軸４の一端に固定されており、前記基台６の貫通部
に設けた軸受５を介して前記中空軸４とともに回転自在
に保持されている。また、前記中空軸４の他端はロータ
リジョイント７を介して図示しない真空ポンプに接続さ
れている。さらに、前記中空軸４の基台６下面側の突出
部にはギヤ８が設けられ、このギヤ８と螺合するギヤ９
をモータＭ1で駆動することにより、前記テーブル１を
回転できるようになっている。Next, an embodiment of the present invention will be described with reference to the drawings. The figure shows a coating apparatus A for carrying out the present invention. The coating apparatus A generally includes a table 1 and nozzles 10 as shown in FIG. As shown in FIG. 2, the table 1 is fixed to one end of a hollow shaft 4 provided through the base 6, and the hollow shaft 4 is provided via a bearing 5 provided at a penetrating portion of the base 6. 4 and rotatably held together. The other end of the hollow shaft 4 is connected via a rotary joint 7 to a vacuum pump (not shown). Further, a gear 8 is provided at a protruding portion of the hollow shaft 4 on the lower surface side of the base 6, and a gear 9 screwed with the gear 8 is provided.
The by driving a motor M 1, and can be rotated to the table 1.
【００１１】なお、前記テーブル１は、その表面が所定
の平面度、たとえば２μｍ以下の平面度を有するととも
に、その内部には前記中空軸４の空間４ａと連通するヘ
ッダ２が放射状に設けてあり、各ヘッダ２からテーブル
１の表面に貫通する多数の吸引孔３が設けてある。この
ため、前記真空ポンプを駆動することにより基板Ｗをテ
ーブル１表面に吸引保持して基板Ｗの有するそりやうね
りを矯正することができる。The surface of the table 1 has a predetermined flatness, for example, a flatness of 2 μm or less, and a header 2 communicating with the space 4 a of the hollow shaft 4 is provided radially inside the table 1. A large number of suction holes 3 penetrating from each header 2 to the surface of the table 1 are provided. Therefore, by driving the vacuum pump, the substrate W can be suction-held on the surface of the table 1 to correct the warp or undulation of the substrate W.
【００１２】さらに、図１ないし２に示すように、前記
基台６の幅方向両側部に前記テーブル１を挟んで対向配
置したレールＲ上へ図示しない水平移動機構により進退
する架台１１を載置し、この架台１１上にステッピング
モータＭ2とノンバックラッシュのボールネジ１２とか
らなる昇降機構１３を介してこの昇降機構１３に両側部
を支持された梁１４を設ける。そして、この梁１４の所
定位置、すなわち、前記架台１１の進退によりノズル１
０の吐出孔１０ａが前記テーブル１の回転中心上部に位
置することができる位置にノズル１０を保持する。これ
により、ノズル１０の吐出孔１０ａは前記テーブル１表
面から所定高さを維持したままテーブル１の回転中心と
外方の所定位置との間を一方向に進退することができ
る。Further, as shown in FIGS. 1 and 2, a gantry 11 which is moved forward and backward by a horizontal moving mechanism (not shown) is placed on both sides of the base 6 in the width direction on rails R opposed to each other with the table 1 interposed therebetween. and, the pedestal 11 on the stepping motor M 2 and the non-backlash through the lifting mechanism 13 comprising a ball screw 12. providing a beam 14 that the side portions are supported on the lifting mechanism 13. Then, the nozzle 1 is moved by a predetermined position of the beam 14, that is, by the reciprocation of the gantry 11.
The nozzle 10 is held at a position where the zero discharge hole 10a can be positioned above the rotation center of the table 1. Thus, the discharge hole 10a of the nozzle 10 can move in one direction between the center of rotation of the table 1 and a predetermined outside position while maintaining a predetermined height from the surface of the table 1.
【００１３】なお、前記ノズル１０の吐出孔１０ａは、
図３に示すように、前記テーブル１上に吸引保持されて
いる基板Ｗに対して塗布液を線状に供給するよう形成し
てある。The discharge hole 10a of the nozzle 10 is
As shown in FIG. 3, the coating liquid is supplied linearly to the substrate W suction-held on the table 1.
【００１４】つぎに、前記構成の塗布装置Ａの使用方法
を説明する。まず、図示しない水平移動機構により架台
１１を移動して、前記ノズル１０を図１に示すように基
台６の一端側に位置させたのち、たとえば、ウエハから
なる基板Ｗをテーブル１上に載置し、真空ポンプを駆動
してテーブル１上に前記基板Ｗを吸引保持する。Next, a method of using the coating apparatus A having the above configuration will be described. First, the gantry 11 is moved by a horizontal moving mechanism (not shown) to position the nozzle 10 at one end of the base 6 as shown in FIG. 1, and then, for example, a substrate W made of a wafer is placed on the table 1. The substrate W is suction-held on the table 1 by driving the vacuum pump.
【００１５】その後、モータＭ1を駆動してテーブル１
を回転させる一方、前記架台１１を水平移動機構により
移動させて、図４に仮想線で示すようにノズル１０の吐
出孔１０ａをテーブル１の回転中心上方に位置させる。[0015] Then, table 1 by driving the motor M 1
While rotating the table 11, the gantry 11 is moved by the horizontal movement mechanism so that the discharge hole 10a of the nozzle 10 is positioned above the rotation center of the table 1 as shown by the imaginary line in FIG.
【００１６】ついで、前記ステッピングモータＭ2、Ｍ2
を駆動してノズル１０を下降させ、ノズル１０の先端と
テーブル１の表面とが予め設定された所定距離（基準ギ
ャップ）となるように調節する。Next, the stepping motors M 2 , M 2
Is driven to lower the nozzle 10 so that the tip of the nozzle 10 and the surface of the table 1 are adjusted to a predetermined distance (reference gap) set in advance.
【００１７】その後、図示しない塗布液供給装置を駆動
してノズル１０に塗布液を供給し、塗布を開始するとと
もに前記架台１１（ノズル１０）を図４に示すように基
板Ｗの外方の所定位置まで移動させる。このとき、ノズ
ル１０の移動量は、テーブル１が１回転する間にノズル
１０の吐出孔１０ａの幅分（吐出された塗布液の幅分）
だけ移動することを基本とするが、塗布液の性状により
吐出孔１０ａの幅（吐出された塗布液の幅）以上の距離
を移動してもよい。Thereafter, a coating liquid supply device (not shown) is driven to supply the coating liquid to the nozzle 10 to start coating, and the gantry 11 (nozzle 10) is moved to a predetermined position outside the substrate W as shown in FIG. Move to the position. At this time, the moving amount of the nozzle 10 is equal to the width of the discharge hole 10a of the nozzle 10 during the rotation of the table 1 (the width of the discharged application liquid).
However, the distance may be greater than the width of the discharge hole 10a (the width of the discharged coating liquid) depending on the properties of the coating liquid.
【００１８】たとえば塗布液の性状としてレベリング性
について見てみると、レベリング性の悪い塗布液を塗布
する場合、塗布液が慣らされ難い（広がり難い）のでテ
ーブル１が１回転する間に吐出孔１０ａの幅分だけ移動
するようにし、前回の回転で形成した塗布膜の側面に吐
出孔１０ａから供給する線状の塗布液の側面が接するよ
うにすれば良いし、また、レベリング性の良い塗布液を
塗布する場合、塗布液が慣らされ易い（広がり易い）の
でテーブル１が１回転する間に吐出孔１０ａの幅以上の
距離を移動するようにし、前回の回転で形成した塗布膜
の側面と吐出孔１０ａから供給する線状の塗布液の側面
との間に隙間が形成されるようにすれば良い。For example, looking at the leveling property as a property of the coating liquid, when a coating liquid having poor leveling property is applied, the coating liquid is hard to be used (hard to spread). And the side surface of the linear coating liquid supplied from the discharge hole 10a may be in contact with the side surface of the coating film formed by the previous rotation, or the coating liquid having a good leveling property. Is applied, the coating liquid is easily adapted (easily spread), so that the table 1 is moved a distance equal to or greater than the width of the discharge hole 10a during one rotation so that the side of the coating film formed by the previous rotation is discharged. A gap may be formed between the side surface of the linear coating solution supplied from the hole 10a.
【００１９】なお、塗布液のレベリング性とは塗布液自
体の流動性のことであり、塗布液のレベリング性が良け
れば基板へ塗布を施したのち、所定時間が経過すると形
成された塗布膜が塗布液自体の流動性で慣らされ、ス
ジ、ムラのない良好な塗布状態となる。このため、一般
的には、塗布液の粘度が低いほどレベリング性は高いと
いうことになる。しかし、塗布液の粘度が低くても、た
とえば揮発性の非常に高い溶剤を用いた塗布液を塗布し
たような場合、塗布膜が塗布液自体の流動性で慣らされ
る前に溶剤が揮発して乾燥してしまい、スジ、ムラ等が
発生することがある。このような塗布液は粘度が低くて
もレベリング性は良くないということになる。The leveling property of the coating liquid is the fluidity of the coating liquid itself. If the leveling property of the coating liquid is good, the coating is applied to the substrate, and after a lapse of a predetermined time, the formed coating film is formed. The coating liquid itself is used in the fluidity, and a good coating state without streaks or unevenness is obtained. For this reason, generally, the lower the viscosity of the coating liquid, the higher the leveling property. However, even when the viscosity of the coating solution is low, for example, when a coating solution using a very volatile solvent is applied, the solvent is volatilized before the coating film is used by the fluidity of the coating solution itself. Drying may cause streaks, unevenness, and the like. This means that such a coating liquid has a low leveling property even if the viscosity is low.
【００２０】このように、吐出孔１０ａから流下する線
状の塗布液は、基板Ｗが回転しているため、あたかもレ
コード面の溝に相当する部分のように流下し、基板Ｗの
回転に基づく遠心力と塗布液のレベリング性により基板
Ｗ上に円形の均一な厚みの塗布膜を形成することにな
る。As described above, since the substrate W is rotating, the linear coating solution flowing down from the discharge hole 10a flows down as if it were a portion corresponding to the groove on the record surface, and is based on the rotation of the substrate W. Due to the centrifugal force and the leveling property of the coating liquid, a circular coating film having a uniform thickness is formed on the substrate W.
【００２１】前記のようにして、所望の円形塗布膜の半
径分だけノズル１０を水平移動したら、塗布液の供給を
停止するとともに、次にテーブル１の回転を停止し、そ
の後、ステッピングモータＭ2、Ｍ2を回転させてノズル
１０を所定位置まで上昇させるとともに、水平移動機構
を駆動してノズル１０を基台６の所定位置に後退させ、
次の工程に備える（図１）。As described above, when the nozzle 10 is moved horizontally by the radius of the desired circular coating film, the supply of the coating liquid is stopped, the rotation of the table 1 is stopped, and then the stepping motor M 2 to rotate the M 2 with increasing the nozzle 10 to a predetermined position, to retract the nozzle 10 by driving the horizontal movement mechanism to a predetermined position of the base 6,
Prepare for the next step (FIG. 1).
【００２２】前述のようにして基板Ｗ上に円形塗布膜が
形成されると、真空ポンプを停止し、図示しない手段で
基板Ｗを次工程に移送し、つぎの基板Ｗをテーブル１に
載置し、再び前記塗布工程を行うものである。When the circular coating film is formed on the substrate W as described above, the vacuum pump is stopped, the substrate W is transferred to the next step by means not shown, and the next substrate W is placed on the table 1. Then, the coating step is performed again.
【００２３】なお、前記説明では基板Ｗを円形のウエハ
としたが、基板Ｗはウエハに限定するものではなく、か
つ、基板の形状も円形に限定するものではない。また、
吐出孔１０ａの断面形状は、円形、方形のいずれでも良
い。In the above description, the substrate W is a circular wafer. However, the substrate W is not limited to a wafer, and the shape of the substrate is not limited to a circle. Also,
The cross-sectional shape of the discharge hole 10a may be either circular or square.
【００２４】さらに、前記説明では、ノズル１０をテー
ブル１の回転中心から基板Ｗの外方に向って直線的に移
動させたが、逆に、基板Ｗ外方の所定位置から回転中心
に向って移動させても良い。Further, in the above description, the nozzle 10 is linearly moved from the rotation center of the table 1 toward the outside of the substrate W, but conversely, from a predetermined position outside the substrate W toward the rotation center. You may move it.
【００２５】また、前記塗布工程において、ノズル１０
の位置がテーブル１の中心から外方に、あるいは外方か
ら中心に移動するにつれて、吐出孔１０ａ下の基板Ｗの
周速が変化するため、この周速の変化に合わせて塗布液
の供給量を徐々に増加あるいは減少しても良いし、テー
ブル１の回転数を変化させて塗布位置での周速が常に一
定となるようにしてもよい。In the coating step, the nozzle 10
As the position moves from the center of the table 1 to the outside or from the outside to the center, the peripheral speed of the substrate W below the ejection holes 10a changes. May be gradually increased or decreased, or the rotational speed of the table 1 may be changed so that the peripheral speed at the application position is always constant.
【００２６】ところで、前述の説明では、塗布膜の形状
を円形としたが、テーブルの回転中心と外方所定位置と
の間の所定区間を一方向に移動させながら前記吐出孔か
ら塗布液を線状態で前記基板上に供給することにより、
環状の塗布膜を形成することができる。さらに、同一基
板上に任意の間隔で環状塗布膜を形成することにより、
縞状の塗布膜を形成することもできる。In the above description, the shape of the coating film is circular. However, the coating liquid is drawn from the discharge hole while moving in one direction a predetermined section between the center of rotation of the table and a predetermined outer position. By supplying on the substrate in a state,
An annular coating film can be formed. Furthermore, by forming an annular coating film at an arbitrary interval on the same substrate,
A striped coating film can also be formed.
【００２７】実施例 以下の条件の下で、本発明に係る方法を適用した結果、
膜厚１０μｍの良好な塗布膜が形成された。 （１）基板 直径：２００ｍｍ 回転数：６０ｒｐｍ （２）ノズル 内径：１．０ｍｍ 移動速度：１．０ｍｍ／ｓｅｃ 移動方向：基板の中心に向かう方向 移動範囲：基板の直径１９２ｍｍの位置〜基板の中心
（直径０ｍｍ） ギャップ：６０μｍ（基板とノズル先端との間の距離） （３）塗布液 粘度：１０ｐ（１０００ｃｐ）Example As a result of applying the method according to the present invention under the following conditions,
A good coating film having a thickness of 10 μm was formed. (1) Substrate diameter: 200 mm Number of revolutions: 60 rpm (2) Nozzle inner diameter: 1.0 mm Moving speed: 1.0 mm / sec Moving direction: Direction toward the center of substrate Moving range: From the position of the substrate diameter of 192 mm to the center of the substrate (Diameter 0 mm) Gap: 60 μm (distance between substrate and nozzle tip) (3) Coating liquid viscosity: 10p (1000cp)
【００２８】[0028]
【発明の効果】以上の説明で明らかなように、本発明に
よれば、塗布装置に複雑な機構を設けることなく、回転
する基板に対してノズルを直線移動させるだけで基板の
形状に関係なく、円形塗布膜あるいは環状塗布膜を形成
することができる。しかも、塗布液の無駄も殆どない等
の効果を奏する。As is apparent from the above description, according to the present invention, the nozzle is moved linearly with respect to the rotating substrate without providing a complicated mechanism in the coating apparatus, regardless of the shape of the substrate. , A circular coating film or an annular coating film can be formed. In addition, there is an effect that there is almost no waste of the coating liquid.
【図１】 本発明に使用する塗布装置の平面図。FIG. 1 is a plan view of a coating apparatus used in the present invention.
【図２】 図１のII−II線断面図。FIG. 2 is a sectional view taken along line II-II of FIG.
【図３】 図２のIII−III線矢視図。FIG. 3 is a view taken along line III-III in FIG. 2;
【図４】 塗布装置のノズルの移動を示す側面図。FIG. 4 is a side view showing movement of a nozzle of the coating apparatus.
１〜テーブル、３〜吸引孔、４〜中空軸、６〜基台、１
０〜ノズル、１０ａ〜吐出孔、１１〜架台、１３〜昇降
装置、Ｍ１〜モータ、Ｍ２〜ステッピングモータ、Ｒ〜
レール、Ｗ〜基板。1-table, 3-suction hole, 4-hollow shaft, 6-base, 1
0 to nozzle, 10a to discharge hole, 11 to base, 13 to lifting device, M1 to motor, M2 to stepping motor, R to
Rails, W to board.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｌ 21/027 Ｈ０１Ｌ 21/30 ５６４Ｄ Ｆターム(参考） 2H025 AB16 EA05 4D075 AC08 AC79 AC88 AC93 AC94 CA47 DA08 DB14 DC22 EA45 4F041 AA06 AB01 BA05 BA22 BA56 4F042 AA07 BA05 BA08 CB02 DD18 EB09 EB18 EB29 5F046 JA02 JA16 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification code FI Theme coat ゛ (Reference) H01L 21/027 H01L 21/30 564D F-term (Reference) 2H025 AB16 EA05 4D075 AC08 AC79 AC88 AC93 AC94 CA47 DA08 DB14 DC22 EA45 4F041 AA06 AB01 BA05 BA22 BA56 4F042 AA07 BA05 BA08 CB02 DD18 EB09 EB18 EB29 5F046 JA02 JA16
Claims (2)
ーブルと、このテーブルに対して昇降可能で、かつ、先
端部に吐出孔を備えた水平移動可能なノズルとで構成さ
れる塗布装置を用いて、前記テーブルを回転させるとと
もに、前記ノズルをこの回転するテーブルに対して所定
高さに保持した状態でテーブルの回転中心と外方所定位
置との間を一方向に移動させながら前記吐出孔から塗布
液を線状態で前記基板上に供給することを特徴とする円
形塗布膜の形成方法。1. A coating apparatus comprising: a rotatable table for horizontally sucking and holding a substrate; and a horizontally movable nozzle capable of ascending and descending with respect to the table and having a discharge hole at a tip end. The discharge port is rotated while moving the table in one direction between the center of rotation of the table and a predetermined outside position while holding the nozzle at a predetermined height with respect to the rotating table. Supplying a coating liquid in a linear state from above to the substrate.
ーブルと、このテーブルに対して昇降可能で、かつ、先
端部に吐出孔を備えた水平移動可能なノズルとで構成さ
れる塗布装置を用いて、前記テーブルを回転させるとと
もに、前記ノズルをこの回転するテーブルに対して所定
高さに保持した状態でテーブルの回転中心と外方所定位
置との間の所定区間を一方向に移動させながら前記吐出
孔から塗布液を線状態で前記基板上に供給することを特
徴とする環状塗布膜の形成方法。2. A coating apparatus comprising: a rotatable table for horizontally sucking and holding a substrate; and a horizontally movable nozzle having a discharge hole at a tip end thereof, the nozzle being movable up and down with respect to the table. While rotating the table, while moving the predetermined section between the rotation center of the table and a predetermined outside position in one direction while holding the nozzle at a predetermined height with respect to the rotating table, A method of forming an annular coating film, comprising supplying a coating liquid in a linear state from the discharge hole onto the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000213639A JP4145468B2 (en) | 1999-07-29 | 2000-07-14 | Method for forming circular coating film and annular coating film |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21515299 | 1999-07-29 | ||
| JP11-215152 | 2000-02-22 | ||
| JP2000044317 | 2000-02-22 | ||
| JP2000-44317 | 2000-02-22 | ||
| JP2000213639A JP4145468B2 (en) | 1999-07-29 | 2000-07-14 | Method for forming circular coating film and annular coating film |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005172674A Division JP2005305440A (en) | 1999-07-29 | 2005-06-13 | Method for forming circular coating film and annular coating film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001310155A true JP2001310155A (en) | 2001-11-06 |
| JP4145468B2 JP4145468B2 (en) | 2008-09-03 |
Family
ID=27329722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000213639A Expired - Lifetime JP4145468B2 (en) | 1999-07-29 | 2000-07-14 | Method for forming circular coating film and annular coating film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4145468B2 (en) |
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