CA2078955A1 - Protected conductive foil assemblage and procedure for preparing same using static electrical forces - Google Patents

Protected conductive foil assemblage and procedure for preparing same using static electrical forces

Info

Publication number
CA2078955A1
CA2078955A1 CA002078955A CA2078955A CA2078955A1 CA 2078955 A1 CA2078955 A1 CA 2078955A1 CA 002078955 A CA002078955 A CA 002078955A CA 2078955 A CA2078955 A CA 2078955A CA 2078955 A1 CA2078955 A1 CA 2078955A1
Authority
CA
Canada
Prior art keywords
foil
film
set forth
film layer
plastic film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002078955A
Other languages
English (en)
French (fr)
Inventor
Jamie H. Chamberlain
Rolland D. Savage
John P. Callahan
David P. Burgess
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gould Electronics Inc
Gould Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2078955A1 publication Critical patent/CA2078955A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B2037/1063—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using an electrostatic force
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/021—Treatment by energy or chemical effects using electrical effects
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Insulating Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CA002078955A 1991-10-01 1992-09-23 Protected conductive foil assemblage and procedure for preparing same using static electrical forces Abandoned CA2078955A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US770,038 1985-08-27
US77003891A 1991-10-01 1991-10-01

Publications (1)

Publication Number Publication Date
CA2078955A1 true CA2078955A1 (en) 1993-04-02

Family

ID=25087283

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002078955A Abandoned CA2078955A1 (en) 1991-10-01 1992-09-23 Protected conductive foil assemblage and procedure for preparing same using static electrical forces

Country Status (10)

Country Link
EP (1) EP0535868A1 (OSRAM)
JP (1) JPH05217446A (OSRAM)
KR (1) KR930009482A (OSRAM)
CN (1) CN1070868A (OSRAM)
AU (1) AU2527292A (OSRAM)
BR (1) BR9203895A (OSRAM)
CA (1) CA2078955A1 (OSRAM)
IL (1) IL103285A0 (OSRAM)
MX (1) MX9205636A (OSRAM)
TW (1) TW200629B (OSRAM)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3319650B2 (ja) * 1994-03-30 2002-09-03 三井金属鉱業株式会社 銅張積層板用銅箔
EP0771181B1 (en) * 1994-07-08 2001-12-05 Metallized Products Inc. Sheets with high temperature stable protective coating
AU7225896A (en) * 1995-10-26 1997-05-15 Metallized Products Inc Method of protecting the surface of a foil, releasably adhering protective film and film-coated foil
US6921451B2 (en) * 2002-06-28 2005-07-26 Metallized Products, Inc. Method of and apparatus for protecting thin copper foil and other shiny substrates during handling and rigorous processing, as pcb manufacture and the like, by electric-charge adherence thereto of thin release-layered plastic films and the like, and improved products produced thereby
US6805048B2 (en) 2002-08-30 2004-10-19 3M Innovative Properties Company Method of marking a substrate using an electret stencil
US20040112516A1 (en) * 2002-12-13 2004-06-17 Metallized Products, Inc. Method and apparatus for electric-charge adhering of thin release-layered plastic firlms to thin copper foil substrates and the like and improved products thereby produced
JP2007160845A (ja) * 2005-12-16 2007-06-28 Bridgestone Corp 樹脂フィルムの接合方法
KR100787840B1 (ko) * 2006-03-25 2007-12-27 장용순 피씨비 스크래치 방지 코팅 방법 및 그 물품
JP5893461B2 (ja) * 2011-04-07 2016-03-23 日産自動車株式会社 位置検出装置および位置検出方法
CN104586307A (zh) * 2012-07-27 2015-05-06 金红叶纸业集团有限公司 薄型材料及其复合方法
EP2692528A1 (de) * 2012-07-30 2014-02-05 Technische Universität Darmstadt Ablage von Folien
CN107635385B (zh) * 2017-07-31 2024-04-30 武汉芯宝科技有限公司 Esd全屏蔽功能箔、全屏蔽功能箔电路板及制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1778825A1 (de) * 1968-06-10 1971-08-26 Licentia Gmbh Verfahren zur Herstellung von kupferkaschierten Schichtstoffen bzw.Schichtpressstoffen
US5167997A (en) * 1989-05-05 1992-12-01 Gould Inc. Protected conductive foil assemblage and procedure for preparing same using static electrical forces
EP0395871A3 (en) * 1989-05-05 1991-09-18 Gould Electronics Inc. Protected conductive foil and procedure for protecting an electrodeposited metallic foil during further processing

Also Published As

Publication number Publication date
CN1070868A (zh) 1993-04-14
IL103285A0 (en) 1993-02-21
BR9203895A (pt) 1993-05-04
JPH05217446A (ja) 1993-08-27
AU2527292A (en) 1993-04-08
KR930009482A (ko) 1993-05-22
TW200629B (OSRAM) 1993-02-21
MX9205636A (es) 1993-05-01
EP0535868A1 (en) 1993-04-07

Similar Documents

Publication Publication Date Title
US5167997A (en) Protected conductive foil assemblage and procedure for preparing same using static electrical forces
US5120590A (en) Protected conductive foil and procedure for protecting an electrodeposited metallic foil during further processing
CA2078955A1 (en) Protected conductive foil assemblage and procedure for preparing same using static electrical forces
CA2116662C (en) Component of printed circuit boards
KR100447820B1 (ko) 수지/구리/금속 적층물 및 이의 제조 방법
EP0395871A2 (en) Protected conductive foil and procedure for protecting an electrodeposited metallic foil during further processing
EP1375134B1 (en) Releasing laminated film
US20170313029A1 (en) Poly-supported copper foil
US20180077804A1 (en) Poly-based burr suppressor
US20030127187A1 (en) Production of laminates for printed wiring boards using protective carrier
JP2002052614A (ja) 積層板の製造方法
WO1997025841A1 (en) Component for and method of making copper clad substrates
JP2002326309A (ja) 耐熱性フレキシブル積層板
JP3829657B2 (ja) 多層積層板の製造方法
US20020197433A1 (en) Component for use in manufacture of printed circuit boards and laminates
JP2001310344A (ja) 積層板の製造方法
JP3776259B2 (ja) 寸法安定性に優れたカバーレイフィルムの製造方法
US11453204B2 (en) Poly-supported copper foil
CN114311938B (zh) 一种避免发电玻璃层压不均的装置
JP3943735B2 (ja) ビルドアップ型多層プリント配線板の製造方法
JPS61160230A (ja) 積層板の製造方法
JPH04158593A (ja) 積層板の製造方法
JP2002064259A (ja) 耐熱性フレキシブル基板の製造方法
JP2005306040A (ja) 耐熱性フレキシブル基板の製造方法
JP2002096392A (ja) 積層板の製造方法

Legal Events

Date Code Title Description
EEER Examination request
FZDE Discontinued