CA2026437C - Method of manufacturing heat pipe semiconductor cooling apparatus - Google Patents
Method of manufacturing heat pipe semiconductor cooling apparatusInfo
- Publication number
- CA2026437C CA2026437C CA002026437A CA2026437A CA2026437C CA 2026437 C CA2026437 C CA 2026437C CA 002026437 A CA002026437 A CA 002026437A CA 2026437 A CA2026437 A CA 2026437A CA 2026437 C CA2026437 C CA 2026437C
- Authority
- CA
- Canada
- Prior art keywords
- heat pipe
- heat
- holes
- hole
- elongated member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 38
- 239000004065 semiconductor Substances 0.000 title claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 66
- 239000002184 metal Substances 0.000 claims abstract description 66
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 5
- 238000011282 treatment Methods 0.000 claims description 5
- 230000001680 brushing effect Effects 0.000 claims description 3
- 235000012438 extruded product Nutrition 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000005554 pickling Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims 1
- 238000012545 processing Methods 0.000 description 12
- 235000010210 aluminium Nutrition 0.000 description 9
- 238000007796 conventional method Methods 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 3
- 239000000543 intermediate Substances 0.000 description 3
- 229910020159 Pb—Cd Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000002203 pretreatment Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001192 hot extrusion Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C23/00—Extruding metal; Impact extrusion
- B21C23/02—Making uncoated products
- B21C23/04—Making uncoated products by direct extrusion
- B21C23/14—Making other products
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/24—Safety or protection arrangements; Arrangements for preventing malfunction for electrical insulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49353—Heat pipe device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49373—Tube joint and tube plate structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49393—Heat exchanger or boiler making with metallurgical bonding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2702589 | 1989-02-06 | ||
| JP1-27025 | 1989-02-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2026437A1 CA2026437A1 (en) | 1990-08-07 |
| CA2026437C true CA2026437C (en) | 1992-12-22 |
Family
ID=12209540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002026437A Expired - Lifetime CA2026437C (en) | 1989-02-06 | 1990-02-06 | Method of manufacturing heat pipe semiconductor cooling apparatus |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5084966A (de) |
| EP (1) | EP0539583B1 (de) |
| KR (1) | KR930005490B1 (de) |
| CA (1) | CA2026437C (de) |
| DE (1) | DE69023925T2 (de) |
| WO (1) | WO1990009036A1 (de) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6935409B1 (en) | 1998-06-08 | 2005-08-30 | Thermotek, Inc. | Cooling apparatus having low profile extrusion |
| US7147045B2 (en) * | 1998-06-08 | 2006-12-12 | Thermotek, Inc. | Toroidal low-profile extrusion cooling system and method thereof |
| US7305843B2 (en) | 1999-06-08 | 2007-12-11 | Thermotek, Inc. | Heat pipe connection system and method |
| US6981322B2 (en) | 1999-06-08 | 2006-01-03 | Thermotek, Inc. | Cooling apparatus having low profile extrusion and method of manufacture therefor |
| US6462949B1 (en) | 2000-08-07 | 2002-10-08 | Thermotek, Inc. | Electronic enclosure cooling system |
| US9113577B2 (en) | 2001-11-27 | 2015-08-18 | Thermotek, Inc. | Method and system for automotive battery cooling |
| US7198096B2 (en) * | 2002-11-26 | 2007-04-03 | Thermotek, Inc. | Stacked low profile cooling system and method for making same |
| US6834712B2 (en) * | 2001-11-27 | 2004-12-28 | Thermotek, Inc. | Stacked low profile cooling system and method for making same |
| US7857037B2 (en) * | 2001-11-27 | 2010-12-28 | Thermotek, Inc. | Geometrically reoriented low-profile phase plane heat pipes |
| TWM247810U (en) * | 2003-12-05 | 2004-10-21 | Tai Sol Electronics Co Ltd | Liquid/gas phase heat dissipation apparatus with seal structure |
| US20090050297A1 (en) * | 2005-09-08 | 2009-02-26 | Neobulb Technologies, Inc. | Dissipating Module Structure for Heat Generating Device |
| US20080149307A1 (en) * | 2006-12-20 | 2008-06-26 | Cheng Home Electronics Co., Ltd. | Heat transfer duct fastening structure |
| EP2162247A1 (de) * | 2007-07-05 | 2010-03-17 | Alcoa Inc. | Metallelemente mit mikrohohlräumen sowie vorrichtung und verfahren in zusammenhang damit |
| US20150075761A1 (en) * | 2013-09-04 | 2015-03-19 | Ingersoll-Rand Company | Heat sink attachment to tube |
| JP2018173193A (ja) * | 2017-03-31 | 2018-11-08 | 古河電気工業株式会社 | ヒートシンク |
| DE102018124053B4 (de) | 2018-09-28 | 2023-10-12 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Hochvolt (HV)-Batterie mit einer Kühleinrichtung zum Kühlen elektrischer Module derselben |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2928166A (en) * | 1955-02-17 | 1960-03-15 | Lummus Co | Tube welding |
| GB1478015A (en) * | 1973-07-27 | 1977-06-29 | Delanair Ltd | Heat exchanger |
| JPS55116092A (en) * | 1979-02-26 | 1980-09-06 | Fujitsu Ltd | Connecting method for heat pipe |
| JPS56100293A (en) * | 1980-01-14 | 1981-08-12 | Oki Densen Kk | Cooler device |
| JPS56108098A (en) * | 1980-01-29 | 1981-08-27 | Matsushita Electric Ind Co Ltd | Heat pipe |
| JPS5941858A (ja) * | 1982-04-21 | 1984-03-08 | Hitachi Cable Ltd | 半導体放熱器用ヒ−トパイプ及びヒ−トパイプに入熱部を形成する方法 |
| JPS5971072A (ja) * | 1982-10-15 | 1984-04-21 | Canon Inc | 定着装置 |
| JPS5971072U (ja) * | 1982-10-26 | 1984-05-14 | 三菱電機株式会社 | ヒ−トパイプ |
| JPS6057956A (ja) * | 1983-09-09 | 1985-04-03 | Furukawa Electric Co Ltd:The | 半導体用ヒ−トパイプ放熱器 |
| JPS61113265A (ja) * | 1984-11-08 | 1986-05-31 | Mitsubishi Electric Corp | 半導体素子等の冷却装置 |
| JPS61138092A (ja) * | 1984-12-10 | 1986-06-25 | Matsushita Refrig Co | ヒ−トパイプ式放熱装置の製造方法 |
| JPS62117352A (ja) * | 1985-11-18 | 1987-05-28 | Toshiba Corp | 電力用半導体素子冷却器 |
| JPS63254755A (ja) * | 1987-04-10 | 1988-10-21 | Mitsubishi Electric Corp | 電子素子体の冷却装置の製造方法 |
| US4932469A (en) * | 1989-10-04 | 1990-06-12 | Blackstone Corporation | Automotive condenser |
-
1990
- 1990-02-06 EP EP90902689A patent/EP0539583B1/de not_active Expired - Lifetime
- 1990-02-06 DE DE69023925T patent/DE69023925T2/de not_active Expired - Fee Related
- 1990-02-06 KR KR1019900702192A patent/KR930005490B1/ko not_active IP Right Cessation
- 1990-02-06 US US07/582,194 patent/US5084966A/en not_active Expired - Lifetime
- 1990-02-06 WO PCT/JP1990/000145 patent/WO1990009036A1/ja active IP Right Grant
- 1990-02-06 CA CA002026437A patent/CA2026437C/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE69023925D1 (de) | 1996-01-11 |
| KR930005490B1 (ko) | 1993-06-22 |
| US5084966A (en) | 1992-02-04 |
| WO1990009036A1 (fr) | 1990-08-09 |
| EP0539583A1 (de) | 1993-05-05 |
| EP0539583B1 (de) | 1995-11-29 |
| KR910700544A (ko) | 1991-03-15 |
| DE69023925T2 (de) | 1996-05-23 |
| CA2026437A1 (en) | 1990-08-07 |
| EP0539583A4 (de) | 1992-04-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |