CA2004796A1 - Composition inhibee et methode pour enlever l'etain, le plomb ou l'alliage etain/plomb des surfaces de cuivre - Google Patents
Composition inhibee et methode pour enlever l'etain, le plomb ou l'alliage etain/plomb des surfaces de cuivreInfo
- Publication number
- CA2004796A1 CA2004796A1 CA2004796A CA2004796A CA2004796A1 CA 2004796 A1 CA2004796 A1 CA 2004796A1 CA 2004796 A CA2004796 A CA 2004796A CA 2004796 A CA2004796 A CA 2004796A CA 2004796 A1 CA2004796 A1 CA 2004796A1
- Authority
- CA
- Canada
- Prior art keywords
- tin
- lead
- stripping
- copper surfaces
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US386,887 | 1989-07-28 | ||
US07/386,887 US4921571A (en) | 1989-07-28 | 1989-07-28 | Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2004796A1 true CA2004796A1 (fr) | 1991-01-28 |
CA2004796C CA2004796C (fr) | 1993-12-21 |
Family
ID=23527485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002004796A Expired - Fee Related CA2004796C (fr) | 1989-07-28 | 1989-12-06 | Composition inhibee et methode pour enlever l'etain, le plomb ou l'alliage etain/plomb des surfaces de cuivre |
Country Status (6)
Country | Link |
---|---|
US (1) | US4921571A (fr) |
EP (1) | EP0438535B1 (fr) |
JP (1) | JPH04501138A (fr) |
CA (1) | CA2004796C (fr) |
DE (1) | DE68926622T2 (fr) |
WO (1) | WO1991001894A1 (fr) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5531549A (en) * | 1989-07-28 | 1996-07-02 | Great Bay Tool Corporation | Auto-lock drill chuck |
US5305670A (en) * | 1989-07-28 | 1994-04-26 | Gregory Fossella | Adjustable wrench |
US5037482A (en) * | 1990-02-16 | 1991-08-06 | Macdermid, Incorporated | Composition and method for improving adhesion of coatings to copper surfaces |
US5017267A (en) * | 1990-07-17 | 1991-05-21 | Macdermid, Incorporated | Composition and method for stripping tin or tin-lead alloy from copper surfaces |
US5219484A (en) * | 1991-04-25 | 1993-06-15 | Applied Electroless Concepts Inc. | Solder and tin stripper compositions |
US5129962A (en) * | 1991-10-22 | 1992-07-14 | International Business Machines Corporation | Tacky, no-clean thermally dissipated soldering flux |
US5244539A (en) * | 1992-01-27 | 1993-09-14 | Ardrox, Inc. | Composition and method for stripping films from printed circuit boards |
US5234542A (en) * | 1992-03-04 | 1993-08-10 | Macdermid, Incorporated | Composition and process for stripping tin from copper surfaces |
DE4335716C2 (de) * | 1993-04-30 | 2001-07-26 | Ami Doduco Gmbh | Verwendung eines Additives aus einem Emulgator und einem oder mehreren Inhibitoren zu einem Bad zum Entfernen von Schichten aus Nickel, Zinn, Blei oder Zinn-Blei von Oberflächen aus Kupfer oder Kupferlegierungen |
US5531889A (en) * | 1994-03-08 | 1996-07-02 | Atotech Usa, Inc. | Method and apparatus for removing resist particles from stripping solutions for printed wireboards |
US5741432A (en) * | 1995-01-17 | 1998-04-21 | The Dexter Corporation | Stabilized nitric acid compositions |
US5512201A (en) * | 1995-02-13 | 1996-04-30 | Applied Chemical Technologies, Inc. | Solder and tin stripper composition |
US5505872A (en) * | 1995-05-23 | 1996-04-09 | Applied Electroless Concepts, Inc. | Solder stripper recycle and reuse |
US5911907A (en) * | 1995-08-30 | 1999-06-15 | Surface Tek Specialty Products, Inc. | Composition and method for stripping tin and tin-lead from copper surfaces |
KR100269830B1 (ko) * | 1996-04-18 | 2000-10-16 | 포만 제프리 엘 | 구리표면 보호용 유기금속계 복합 피복물 |
JP3345569B2 (ja) * | 1997-07-14 | 2002-11-18 | 株式会社キッツ | バルブ・管継手等の銅合金製配管器材の鉛溶出防止法及びその銅合金製配管器材 |
US6083419A (en) * | 1997-07-28 | 2000-07-04 | Cabot Corporation | Polishing composition including an inhibitor of tungsten etching |
GB2334969B (en) * | 1998-03-05 | 2003-03-12 | British Steel Plc | Coated metal products |
DE60000499T2 (de) * | 2000-03-17 | 2003-03-27 | Ruvaris S R L | Verfahren und Bad zur selektiven Bleientfernung von Sanitärkomponenten aus Kupferlegierungen |
EP1302569A3 (fr) * | 2001-10-11 | 2004-03-03 | Shipley Co. L.L.C. | Solution d'enlèvement |
KR101088568B1 (ko) * | 2005-04-19 | 2011-12-05 | 아반토르 퍼포먼스 머티리얼스, 인크. | 갈바닉 부식을 억제하는 비수성 포토레지스트 스트립퍼 |
US8344084B2 (en) | 2005-06-14 | 2013-01-01 | Basf Construction Polymers Gmbh | Liquid admixture composition |
US20080017078A1 (en) * | 2005-06-14 | 2008-01-24 | Manfred Bichler | Liquid admixture composition |
US8349979B2 (en) * | 2005-06-14 | 2013-01-08 | Basf Construction Polymers Gmbh | Liquid admixture composition |
ES2348361T3 (es) * | 2005-10-25 | 2010-12-03 | Atotech Deutschland Gmbh | Método para adhesión mejorada de materiales polímeros a superficies de cobre o aleaciones de cobre. |
TWI568859B (zh) * | 2010-04-15 | 2017-02-01 | 恩特葛瑞斯股份有限公司 | 廢棄印刷電路板之回收利用方法 |
JP2014507815A (ja) * | 2011-03-11 | 2014-03-27 | フジフィルム・エレクトロニック・マテリアルズ・ユーエスエイ・インコーポレイテッド | 新規なエッチング組成物 |
AP2014007781A0 (en) | 2011-12-15 | 2014-07-31 | Advanced Tech Materials | Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment |
PL408674A1 (pl) * | 2014-06-26 | 2016-01-04 | Ecoback Spółka Z Ograniczoną Odpowiedzialnością | Sposób odzyskiwania materiału cynowego ze złomu elektronicznego i elektrolityczny materiał cynowy otrzymywany tym sposobem |
CN109423557A (zh) * | 2017-09-04 | 2019-03-05 | 中节能(汕头)循环经济有限公司 | 一种从废弃的锡包铜金属中分离铜、锡的方法 |
CN109440109A (zh) * | 2018-11-13 | 2019-03-08 | 南通赛可特电子有限公司 | 一种退锡液及其制备方法 |
CN114369831B (zh) * | 2021-12-27 | 2024-05-07 | 广东臻鼎环境科技有限公司 | 一种可循环再生硝酸型退锡废液用添加剂及其应用 |
KR102634267B1 (ko) * | 2022-07-05 | 2024-02-06 | 주식회사 호진플라텍 | 주석 박리액 및 이를 이용한 주석 합금층 형성방법 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3677949A (en) * | 1970-09-04 | 1972-07-18 | Enthone | Selectively stripping tin and/or lead from copper substrates |
US3926699A (en) * | 1974-06-17 | 1975-12-16 | Rbp Chemical Corp | Method of preparing printed circuit boards with terminal tabs |
US4004956A (en) * | 1974-08-14 | 1977-01-25 | Enthone, Incorporated | Selectively stripping tin or tin-lead alloys from copper substrates |
US3990982A (en) * | 1974-12-18 | 1976-11-09 | Rbp Chemical Corporation | Composition for stripping lead-tin solder |
US4306933A (en) * | 1980-02-11 | 1981-12-22 | Chemline Industries | Tin/tin-lead stripping solutions |
US4297257A (en) * | 1980-04-17 | 1981-10-27 | Dart Industries Inc. | Metal stripping composition and method |
JPS57164984A (en) * | 1981-04-06 | 1982-10-09 | Metsuku Kk | Exfoliating solution for tin or tin alloy |
DE3208124A1 (de) * | 1981-08-17 | 1983-09-08 | Elget Ing.-Büro für grafische und elektronische Technik, 8501 Oberasbach | Stripper |
IT1144797B (it) * | 1981-10-14 | 1986-10-29 | Alfachimici Spa | Soluzione per l asportazione di stagno o lega stagno piombo da un substrato mediante operazione a spruzzo |
US4397753A (en) * | 1982-09-20 | 1983-08-09 | Circuit Chemistry Corporation | Solder stripping solution |
JPS59232601A (ja) * | 1983-06-15 | 1984-12-27 | Yamatoya Shokai:Kk | ハンダ剥離液 |
US4545850A (en) * | 1984-08-20 | 1985-10-08 | Psi Star | Regenerative copper etching process and solution |
US4632727A (en) * | 1985-08-12 | 1986-12-30 | Psi Star | Copper etching process and solution |
US4673521A (en) * | 1986-01-21 | 1987-06-16 | Enthone, Incorporated | Process for regenerating solder stripping solutions |
US4687545A (en) * | 1986-06-18 | 1987-08-18 | Macdermid, Incorporated | Process for stripping tin or tin-lead alloy from copper |
US4713144A (en) * | 1986-08-01 | 1987-12-15 | Ardrox Inc. | Composition and method for stripping films from printed circuit boards |
DE3738307A1 (de) * | 1987-11-11 | 1989-05-24 | Ruwel Werke Gmbh | Badloesungen und verfahren zum entfernen von blei/zinn-, blei- bzw. zinnschichten auf kupfer- oder nickeloberflaechen |
US4957653A (en) * | 1989-04-07 | 1990-09-18 | Macdermid, Incorporated | Composition containing alkane sulfonic acid and ferric nitrate for stripping tin or tin-lead alloy from copper surfaces, and method for stripping tin or tin-lead alloy |
-
1989
- 1989-07-28 US US07/386,887 patent/US4921571A/en not_active Expired - Lifetime
- 1989-11-20 EP EP90901203A patent/EP0438535B1/fr not_active Expired - Lifetime
- 1989-11-20 WO PCT/US1989/005184 patent/WO1991001894A1/fr active IP Right Grant
- 1989-11-20 DE DE68926622T patent/DE68926622T2/de not_active Expired - Fee Related
- 1989-11-20 JP JP2501550A patent/JPH04501138A/ja active Pending
- 1989-12-06 CA CA002004796A patent/CA2004796C/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO1991001894A1 (fr) | 1991-02-21 |
DE68926622D1 (de) | 1996-07-11 |
EP0438535A1 (fr) | 1991-07-31 |
CA2004796C (fr) | 1993-12-21 |
DE68926622T2 (de) | 1996-11-28 |
US4921571A (en) | 1990-05-01 |
US4921571B1 (fr) | 1991-12-31 |
EP0438535A4 (en) | 1992-01-15 |
JPH04501138A (ja) | 1992-02-27 |
EP0438535B1 (fr) | 1996-06-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |