CA1203640A - Apparatus for cooling integrated circuit chips - Google Patents

Apparatus for cooling integrated circuit chips

Info

Publication number
CA1203640A
CA1203640A CA000428435A CA428435A CA1203640A CA 1203640 A CA1203640 A CA 1203640A CA 000428435 A CA000428435 A CA 000428435A CA 428435 A CA428435 A CA 428435A CA 1203640 A CA1203640 A CA 1203640A
Authority
CA
Canada
Prior art keywords
film
contact
paste
integrated circuit
mat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000428435A
Other languages
English (en)
French (fr)
Inventor
Faquir C. Mittal
Charles R. Solis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unisys Corp
Original Assignee
Sperry Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sperry Corp filed Critical Sperry Corp
Application granted granted Critical
Publication of CA1203640A publication Critical patent/CA1203640A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CA000428435A 1983-02-07 1983-05-18 Apparatus for cooling integrated circuit chips Expired CA1203640A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46429483A 1983-02-07 1983-02-07
US464,294 1983-02-07

Publications (1)

Publication Number Publication Date
CA1203640A true CA1203640A (en) 1986-04-22

Family

ID=23843332

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000428435A Expired CA1203640A (en) 1983-02-07 1983-05-18 Apparatus for cooling integrated circuit chips

Country Status (3)

Country Link
JP (1) JPS6057139U (ref)
CA (1) CA1203640A (ref)
DE (1) DE3404027A1 (ref)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4312057A1 (de) * 1993-04-13 1993-10-14 Siegmund Maettig Vorrichtung zum Kühlen hochintegrierter Multi-Chip-Moduls für Datenverarbeitungsanlagen mit hoher Rechnerleistung
JP4626082B2 (ja) * 2001-04-16 2011-02-02 株式会社日立製作所 冷却水路を備えた電気装置
WO2003098686A1 (de) * 2002-05-22 2003-11-27 Siemens Aktiengesellschaft Kühlvorrichtungen zum kühlen elektrischer bauteile, modul aus kühlvorrichtung und elektrischen bauteilen, und anordnung aus kühlvorrichtung oder modul und trägerkörper

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package

Also Published As

Publication number Publication date
JPH0135484Y2 (ref) 1989-10-30
DE3404027A1 (de) 1984-08-16
JPS6057139U (ja) 1985-04-20

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Legal Events

Date Code Title Description
MKEX Expiry