CA1199754A - Solutions de catalyse pour l'activation de substrats dielectriques, et methode de plaquage non electrolytique - Google Patents

Solutions de catalyse pour l'activation de substrats dielectriques, et methode de plaquage non electrolytique

Info

Publication number
CA1199754A
CA1199754A CA000428815A CA428815A CA1199754A CA 1199754 A CA1199754 A CA 1199754A CA 000428815 A CA000428815 A CA 000428815A CA 428815 A CA428815 A CA 428815A CA 1199754 A CA1199754 A CA 1199754A
Authority
CA
Canada
Prior art keywords
metal
bath
salts
copper
organic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000428815A
Other languages
English (en)
Inventor
Harold L. Rhodenizer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Application granted granted Critical
Publication of CA1199754A publication Critical patent/CA1199754A/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CA000428815A 1982-05-26 1983-05-25 Solutions de catalyse pour l'activation de substrats dielectriques, et methode de plaquage non electrolytique Expired CA1199754A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38194382A 1982-05-26 1982-05-26
US381,943 1982-05-26

Publications (1)

Publication Number Publication Date
CA1199754A true CA1199754A (fr) 1986-01-28

Family

ID=23506952

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000428815A Expired CA1199754A (fr) 1982-05-26 1983-05-25 Solutions de catalyse pour l'activation de substrats dielectriques, et methode de plaquage non electrolytique

Country Status (5)

Country Link
EP (1) EP0109402B1 (fr)
JP (1) JPS59500870A (fr)
CA (1) CA1199754A (fr)
DE (1) DE3376852D1 (fr)
WO (1) WO1983004268A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3637130C1 (de) * 1986-10-31 1987-09-17 Deutsche Automobilgesellsch Verfahren zum chemischen Metallisieren von Textilmaterial
EP0564673B1 (fr) * 1992-04-06 1995-10-11 International Business Machines Corporation Procédé de préparation de couches active catalytiquement d'un métal sélectionné dans le groupe du platine
JP4069248B2 (ja) * 2002-12-09 2008-04-02 大阪市 無電解めっき用触媒組成物
CN104593751B (zh) * 2014-12-27 2017-10-17 广东致卓环保科技有限公司 铜表面化学镀镍用超低浓度离子钯活化液及工艺
KR101681116B1 (ko) * 2016-05-26 2016-12-09 (주)오알켐 인쇄 회로 기판의 스루홀을 무전해 동 도금하는 방법 및 그 방법에 사용되는 촉매 용액을 제조하는 방법

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3532518A (en) * 1967-06-28 1970-10-06 Macdermid Inc Colloidal metal activating solutions for use in chemically plating nonconductors,and process of preparing such solutions
US3562038A (en) * 1968-05-15 1971-02-09 Shipley Co Metallizing a substrate in a selective pattern utilizing a noble metal colloid catalytic to the metal to be deposited
US3607352A (en) * 1968-11-29 1971-09-21 Enthone Electroless metal plating
US3672938A (en) * 1969-02-20 1972-06-27 Kollmorgen Corp Novel precious metal sensitizing solutions
US3650913A (en) * 1969-09-08 1972-03-21 Macdermid Inc An electroless plating process employing a specially prepared palladium-tin activator solution
US3682671A (en) * 1970-02-05 1972-08-08 Kollmorgen Corp Novel precious metal sensitizing solutions
US3767583A (en) * 1971-08-13 1973-10-23 Enthone Activator solutions their preparation and use in electroless plating of surfaces
US3874897A (en) * 1971-08-13 1975-04-01 Enthone Activator solutions, their preparation and use in electroless plating of surfaces
US3904792A (en) * 1972-02-09 1975-09-09 Shipley Co Catalyst solution for electroless metal deposition on a substrate
US3961109A (en) * 1973-08-01 1976-06-01 Photocircuits Division Of Kollmorgen Corporation Sensitizers and process for electroless metal deposition
DE2418654A1 (de) * 1974-04-18 1975-11-06 Langbein Pfanhauser Werke Ag Verfahren zum stromlosen oberflaechenmetallisieren von kunststoffgegenstaenden und fuer die durchfuehrung des verfahrens geeignetes aktivierungsbad
US4008343A (en) * 1975-08-15 1977-02-15 Bell Telephone Laboratories, Incorporated Process for electroless plating using colloid sensitization and acid rinse
ZA774561B (en) * 1976-09-20 1978-06-28 Kollmorgen Tech Corp Preparation of solid precious metal sensitizing compositions
DE2659680C2 (de) * 1976-12-30 1985-01-31 Ibm Deutschland Gmbh, 7000 Stuttgart Verfahren zum Aktivieren von Oberflächen
US4073981A (en) * 1977-03-11 1978-02-14 Western Electric Company, Inc. Method of selectively depositing metal on a surface
US4182784A (en) * 1977-12-16 1980-01-08 Mcgean Chemical Company, Inc. Method for electroless plating on nonconductive substrates using palladium/tin catalyst in aqueous solution containing a hydroxy substituted organic acid
IT1107840B (it) * 1978-07-25 1985-12-02 Alfachimici Spa Soluzione catalitica per la deposizione anelettrica di metalli
US4204013A (en) * 1978-10-20 1980-05-20 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine

Also Published As

Publication number Publication date
EP0109402A4 (fr) 1984-10-29
JPS59500870A (ja) 1984-05-17
DE3376852D1 (en) 1988-07-07
WO1983004268A1 (fr) 1983-12-08
EP0109402B1 (fr) 1988-06-01
JPH0239594B2 (fr) 1990-09-06
EP0109402A1 (fr) 1984-05-30

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Legal Events

Date Code Title Description
MKEX Expiry