CA1193752A - Electrical circuits - Google Patents

Electrical circuits

Info

Publication number
CA1193752A
CA1193752A CA000414414A CA414414A CA1193752A CA 1193752 A CA1193752 A CA 1193752A CA 000414414 A CA000414414 A CA 000414414A CA 414414 A CA414414 A CA 414414A CA 1193752 A CA1193752 A CA 1193752A
Authority
CA
Canada
Prior art keywords
alloy
substrate
circuit
components
printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000414414A
Other languages
English (en)
French (fr)
Inventor
Christopher J. Ransom
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of CA1193752A publication Critical patent/CA1193752A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CA000414414A 1981-11-04 1982-10-28 Electrical circuits Expired CA1193752A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB08133262A GB2110475A (en) 1981-11-04 1981-11-04 Substrate for hybrid and printed circuits
GB8133262 1981-11-04

Publications (1)

Publication Number Publication Date
CA1193752A true CA1193752A (en) 1985-09-17

Family

ID=10525627

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000414414A Expired CA1193752A (en) 1981-11-04 1982-10-28 Electrical circuits

Country Status (3)

Country Link
JP (1) JPS58100481A (en:Method)
CA (1) CA1193752A (en:Method)
GB (1) GB2110475A (en:Method)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2162694A (en) * 1984-08-04 1986-02-05 British Aerospace Printed circuits
DE3447520A1 (de) * 1984-12-27 1986-08-14 Metallwerk Plansee GmbH, Reutte, Tirol Verbundleiterplatte, verfahren zur herstellung einer verbundleiterplatte und verwendung von aluminiumoxyd als isolierende schicht einer verbundleiterplatte

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5917879A (ja) * 1982-07-19 1984-01-30 Mitsubishi Electric Corp 交流エレベ−タの制御装置
JPS6149827A (ja) * 1984-08-17 1986-03-11 Mitsubishi Electric Corp 対向液圧成形法
JPS6149831A (ja) * 1985-06-10 1986-03-11 Shiro Ono チユ−ブ状包装袋の製造方法

Also Published As

Publication number Publication date
JPS58100481A (ja) 1983-06-15
GB2110475A (en) 1983-06-15
JPH0334676B2 (en:Method) 1991-05-23

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Legal Events

Date Code Title Description
MKEC Expiry (correction)
MKEX Expiry