CA1179786A - Lateral transistor structure having self-aligned base and base contact and method of fabrication - Google Patents
Lateral transistor structure having self-aligned base and base contact and method of fabricationInfo
- Publication number
- CA1179786A CA1179786A CA000388541A CA388541A CA1179786A CA 1179786 A CA1179786 A CA 1179786A CA 000388541 A CA000388541 A CA 000388541A CA 388541 A CA388541 A CA 388541A CA 1179786 A CA1179786 A CA 1179786A
- Authority
- CA
- Canada
- Prior art keywords
- layer
- region
- impurity
- base
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000012535 impurity Substances 0.000 claims abstract description 46
- 238000000034 method Methods 0.000 claims abstract description 37
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 35
- 238000009792 diffusion process Methods 0.000 claims abstract description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 29
- 239000000377 silicon dioxide Substances 0.000 claims description 27
- 235000012239 silicon dioxide Nutrition 0.000 claims description 26
- 239000004065 semiconductor Substances 0.000 claims description 25
- 229910021332 silicide Inorganic materials 0.000 claims description 18
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 229910052710 silicon Inorganic materials 0.000 claims description 16
- 239000010703 silicon Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 15
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 7
- 229910052796 boron Inorganic materials 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 7
- WQJQOUPTWCFRMM-UHFFFAOYSA-N tungsten disilicide Chemical group [Si]#[W]#[Si] WQJQOUPTWCFRMM-UHFFFAOYSA-N 0.000 claims description 2
- 229910021342 tungsten silicide Inorganic materials 0.000 claims description 2
- 239000002019 doping agent Substances 0.000 abstract description 2
- 238000005530 etching Methods 0.000 abstract description 2
- 229960001866 silicon dioxide Drugs 0.000 description 26
- 230000008569 process Effects 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- 238000001020 plasma etching Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- XUIMIQQOPSSXEZ-NJFSPNSNSA-N silicon-30 atom Chemical compound [30Si] XUIMIQQOPSSXEZ-NJFSPNSNSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical class O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000005224 laser annealing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D10/00—Bipolar junction transistors [BJT]
- H10D10/311—Thin-film BJTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3215—Doping the layers
- H01L21/32155—Doping polycristalline - or amorphous silicon layers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US19977180A | 1980-10-23 | 1980-10-23 | |
US199,771 | 1980-10-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA1179786A true CA1179786A (en) | 1984-12-18 |
Family
ID=22738957
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA000388541A Expired CA1179786A (en) | 1980-10-23 | 1981-10-22 | Lateral transistor structure having self-aligned base and base contact and method of fabrication |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0052038B1 (en:Method) |
JP (1) | JPS57100763A (en:Method) |
CA (1) | CA1179786A (en:Method) |
DE (1) | DE3174777D1 (en:Method) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0137992A3 (en) * | 1983-09-29 | 1987-01-21 | Fujitsu Limited | Lateral bipolar transistor formed in a silicon on insulator (soi) substrate |
JPS6074477A (ja) * | 1983-09-29 | 1985-04-26 | Fujitsu Ltd | 半導体装置及びその製造方法 |
NL8303467A (nl) * | 1983-10-10 | 1985-05-01 | Philips Nv | Werkwijze voor het vervaardigen van een patroon van geleidend materiaal. |
JPS6081864A (ja) * | 1983-10-12 | 1985-05-09 | Fujitsu Ltd | ラテラル型トランジスタ |
DE3587797T2 (de) * | 1984-10-31 | 1994-07-28 | Texas Instruments Inc | Transistor mit horizontaler Struktur und Verfahren zu dessen Herstellung. |
US4897698A (en) * | 1984-10-31 | 1990-01-30 | Texas Instruments Incorporated | Horizontal structure thin film transistor |
GB2178593B (en) * | 1985-08-02 | 1989-07-26 | Stc Plc | Transistor manufacture |
US4792837A (en) * | 1986-02-26 | 1988-12-20 | Ge Solid State Patents, Inc. | Orthogonal bipolar transistor |
US5005066A (en) * | 1987-06-02 | 1991-04-02 | Texas Instruments Incorporated | Self-aligned NPN bipolar transistor built in a double polysilicon CMOS technology |
US4784966A (en) * | 1987-06-02 | 1988-11-15 | Texas Instruments Incorporated | Self-aligned NPN bipolar transistor built in a double polysilicon CMOS technology |
US4922315A (en) * | 1987-11-13 | 1990-05-01 | Kopin Corporation | Control gate lateral silicon-on-insulator bipolar transistor |
US5043786A (en) * | 1989-04-13 | 1991-08-27 | International Business Machines Corporation | Lateral transistor and method of making same |
JPH0483173A (ja) * | 1990-07-26 | 1992-03-17 | Tele Syst:Yugen | 電力量計 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1352044A (en) * | 1971-04-21 | 1974-05-15 | Garyainov S A Glazkov I M Raik | Planar semiconductor device |
JPS4915374A (en:Method) * | 1972-05-18 | 1974-02-09 | ||
JPS49123274A (en:Method) * | 1973-03-29 | 1974-11-26 | ||
US4201603A (en) * | 1978-12-04 | 1980-05-06 | Rca Corporation | Method of fabricating improved short channel MOS devices utilizing selective etching and counterdoping of polycrystalline silicon |
-
1981
- 1981-10-22 DE DE8181401665T patent/DE3174777D1/de not_active Expired
- 1981-10-22 CA CA000388541A patent/CA1179786A/en not_active Expired
- 1981-10-22 EP EP81401665A patent/EP0052038B1/en not_active Expired
- 1981-10-23 JP JP56168910A patent/JPS57100763A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
EP0052038A3 (en) | 1983-01-12 |
DE3174777D1 (en) | 1986-07-10 |
EP0052038A2 (en) | 1982-05-19 |
JPS57100763A (en) | 1982-06-23 |
JPH0241170B2 (en:Method) | 1990-09-14 |
EP0052038B1 (en) | 1986-06-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MKEX | Expiry |