CA1151316A - Metal support for an electronic component interconnection network and process for manufacturing this support - Google Patents

Metal support for an electronic component interconnection network and process for manufacturing this support

Info

Publication number
CA1151316A
CA1151316A CA000353906A CA353906A CA1151316A CA 1151316 A CA1151316 A CA 1151316A CA 000353906 A CA000353906 A CA 000353906A CA 353906 A CA353906 A CA 353906A CA 1151316 A CA1151316 A CA 1151316A
Authority
CA
Canada
Prior art keywords
support
layer
aluminium
electronic component
component interconnection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000353906A
Other languages
English (en)
French (fr)
Inventor
Jean Le Rouzic
Loic Demeure
Yvon Le Roux
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ROUX YVON LE
Original Assignee
ROUX YVON LE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ROUX YVON LE filed Critical ROUX YVON LE
Application granted granted Critical
Publication of CA1151316A publication Critical patent/CA1151316A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12583—Component contains compound of adjacent metal
    • Y10T428/1259—Oxide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CA000353906A 1979-06-15 1980-06-12 Metal support for an electronic component interconnection network and process for manufacturing this support Expired CA1151316A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FREN7915398 1979-06-15
FR7915398A FR2459557A1 (fr) 1979-06-15 1979-06-15 Support metallique pour reseau d'interconnexion de composants electroniques et procede de fabrication de ce support

Publications (1)

Publication Number Publication Date
CA1151316A true CA1151316A (en) 1983-08-02

Family

ID=9226682

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000353906A Expired CA1151316A (en) 1979-06-15 1980-06-12 Metal support for an electronic component interconnection network and process for manufacturing this support

Country Status (4)

Country Link
US (1) US4285781A (oth)
CA (1) CA1151316A (oth)
DE (1) DE3022268A1 (oth)
FR (1) FR2459557A1 (oth)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2546878B1 (fr) * 1983-05-31 1988-04-08 Slonina Jean Pierre Plaque support d'un substrat ceramique, leger, a forte conductivite thermique et coefficient de dilatation adapte pour toutes applications dans le domaine electronique
JPS61108160A (ja) * 1984-11-01 1986-05-26 Nec Corp コンデンサ内蔵型半導体装置及びその製造方法
DE3501372A1 (de) * 1985-01-17 1986-07-17 Brown, Boveri & Cie Ag, 6800 Mannheim Substrat fuer leiterplatten
EP0221531A3 (en) * 1985-11-06 1992-02-19 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha High heat conductive insulated substrate and method of manufacturing the same
US4799309A (en) * 1987-12-24 1989-01-24 Ford Motor Company Method of making a rectifier and control module for an alternator
US4971894A (en) * 1989-02-13 1990-11-20 International Business Machines Corporation Method and structure for preventing wet etchant penetration at the interface between a resist mask and an underlying metal layer
IL110431A (en) * 1994-07-25 2001-08-08 Microcomponents And Systems Lt Method of manufacturing a composite structure for use in electronic device and structure manufactured by said method
IL120866A0 (en) 1997-05-20 1997-09-30 Micro Components Systems Ltd Process for producing an aluminum substrate
IL127256A (en) * 1998-11-25 2002-09-12 Micro Components Ltd Device for electronic packaging, a process for manufacturing thereof, and a pin jig fixture for use in the process
JP2009526130A (ja) * 2006-02-10 2009-07-16 オプレント エレクトロニクス インターナショナル ピーティーイー エルティーディー 陽極酸化アルミニウム、誘電体および方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1243254B (de) * 1964-08-07 1967-06-29 Telefunken Patent Traegerkoerper fuer Mikroschaltkreise
US3423821A (en) * 1965-03-18 1969-01-28 Hitachi Ltd Method of producing thin film integrated circuits
US3607381A (en) * 1968-06-14 1971-09-21 Platron Corp Spray process for creating electrical circuits
JPS4995591A (oth) * 1973-01-12 1974-09-10
US3941630A (en) * 1974-04-29 1976-03-02 Rca Corporation Method of fabricating a charged couple radiation sensing device
GB1536177A (en) * 1976-12-07 1978-12-20 Nat Res Dev Anodising a compound semiconductor
NL169394C (nl) * 1977-11-23 1982-07-01 Gennady Grigorievich Smolko Elektronisch apparaat.
FR2414281A1 (fr) * 1978-01-05 1979-08-03 Smolko Gennady Perfectionnements apportes aux dispositifs electroniques, notamment aux microcircuits

Also Published As

Publication number Publication date
FR2459557B1 (oth) 1982-05-21
US4285781A (en) 1981-08-25
FR2459557A1 (fr) 1981-01-09
DE3022268A1 (de) 1980-12-18

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