CA1103013A - Silver compositions - Google Patents
Silver compositionsInfo
- Publication number
- CA1103013A CA1103013A CA298,233A CA298233A CA1103013A CA 1103013 A CA1103013 A CA 1103013A CA 298233 A CA298233 A CA 298233A CA 1103013 A CA1103013 A CA 1103013A
- Authority
- CA
- Canada
- Prior art keywords
- silver
- glass
- pbf2
- compositions according
- compositions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
- H01C17/283—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/286—Precursor compositions therefor, e.g. pastes, inks, glass frits applied to TiO2 or titanate resistors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Conductive Materials (AREA)
- Paints Or Removers (AREA)
- Compositions Of Oxide Ceramics (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US775,274 | 1977-03-07 | ||
| US05/775,274 US4101710A (en) | 1977-03-07 | 1977-03-07 | Silver compositions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1103013A true CA1103013A (en) | 1981-06-16 |
Family
ID=25103891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA298,233A Expired CA1103013A (en) | 1977-03-07 | 1978-03-06 | Silver compositions |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4101710A (enExample) |
| JP (1) | JPS53110097A (enExample) |
| CA (1) | CA1103013A (enExample) |
| DE (1) | DE2809818C3 (enExample) |
| FR (1) | FR2383507A1 (enExample) |
| GB (1) | GB1568504A (enExample) |
| IT (1) | IT1094178B (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4271236A (en) * | 1979-10-29 | 1981-06-02 | E. I. Du Pont De Nemours And Company | Air fireable end termination compositions for multilayer capacitors based on nickel borides |
| US4400310A (en) * | 1980-02-12 | 1983-08-23 | E. I. Du Pont De Nemours And Company | Thick film silver compositions for silver terminations for reduced barium titanate capacitors |
| IE52134B1 (en) * | 1980-07-31 | 1987-07-08 | Du Pont | Thick film conductor compositions |
| US4345955A (en) * | 1980-10-28 | 1982-08-24 | E. I. Du Pont De Nemours And Company | Process for manufacturing multilayer ceramic chip carrier modules |
| US4401767A (en) * | 1981-08-03 | 1983-08-30 | Johnson Matthey Inc. | Silver-filled glass |
| US4436785A (en) | 1982-03-08 | 1984-03-13 | Johnson Matthey Inc. | Silver-filled glass |
| US4459166A (en) * | 1982-03-08 | 1984-07-10 | Johnson Matthey Inc. | Method of bonding an electronic device to a ceramic substrate |
| US4846163A (en) * | 1987-08-24 | 1989-07-11 | Cooper Industries, Inc. | Method of sealing capacitor bushings |
| CN1143425A (zh) * | 1994-03-04 | 1997-02-19 | 株式会社小松 | 正特性热敏电阻及采用它的热敏电阻装置 |
| US5431718A (en) * | 1994-07-05 | 1995-07-11 | Motorola, Inc. | High adhesion, solderable, metallization materials |
| GB9518033D0 (en) * | 1995-09-05 | 1995-11-08 | Cookson Matthey Ceramics Plc | Composition |
| JP4136113B2 (ja) * | 1998-09-18 | 2008-08-20 | Tdk株式会社 | チップ型積層電子部品 |
| US6217821B1 (en) * | 1999-06-02 | 2001-04-17 | E. I. Du Pont De Nemours And Company | Method of forming distortion-free circuits |
| JP3797281B2 (ja) * | 2001-09-20 | 2006-07-12 | 株式会社村田製作所 | 積層セラミック電子部品の端子電極用導電性ペースト、積層セラミック電子部品の製造方法、積層セラミック電子部品 |
| JP3636123B2 (ja) * | 2001-09-20 | 2005-04-06 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法、および積層セラミック電子部品 |
| WO2009052141A1 (en) * | 2007-10-18 | 2009-04-23 | E. I. Du Pont De Nemours And Company | Conductive compositions and processes for use in the manufacture of semiconductor devices |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3929674A (en) * | 1974-06-03 | 1975-12-30 | Du Pont | Boride-containing metallizations |
| US3943168A (en) * | 1974-11-13 | 1976-03-09 | E. I. Du Pont De Nemours And Company | Conductor compositions comprising nickel borides |
| US4122232A (en) * | 1975-04-21 | 1978-10-24 | Engelhard Minerals & Chemicals Corporation | Air firable base metal conductors |
| US3970590A (en) * | 1975-06-23 | 1976-07-20 | E. I. Du Pont De Nemours And Company | Gold conductor compositions |
-
1977
- 1977-03-07 US US05/775,274 patent/US4101710A/en not_active Expired - Lifetime
-
1978
- 1978-03-06 IT IT20917/78A patent/IT1094178B/it active
- 1978-03-06 CA CA298,233A patent/CA1103013A/en not_active Expired
- 1978-03-06 GB GB8832/78A patent/GB1568504A/en not_active Expired
- 1978-03-06 FR FR7806320A patent/FR2383507A1/fr active Granted
- 1978-03-07 JP JP2508178A patent/JPS53110097A/ja active Granted
- 1978-03-07 DE DE2809818A patent/DE2809818C3/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2383507A1 (fr) | 1978-10-06 |
| GB1568504A (en) | 1980-05-29 |
| IT1094178B (it) | 1985-07-26 |
| DE2809818B2 (de) | 1979-11-15 |
| US4101710A (en) | 1978-07-18 |
| IT7820917A0 (it) | 1978-03-06 |
| FR2383507B1 (enExample) | 1981-07-10 |
| DE2809818C3 (de) | 1980-07-31 |
| JPS6115523B2 (enExample) | 1986-04-24 |
| DE2809818A1 (de) | 1978-09-14 |
| JPS53110097A (en) | 1978-09-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1103013A (en) | Silver compositions | |
| US4072771A (en) | Copper thick film conductor | |
| US4122232A (en) | Air firable base metal conductors | |
| US4001146A (en) | Novel silver compositions | |
| US3929674A (en) | Boride-containing metallizations | |
| JPH0350365B2 (enExample) | ||
| CA1110053A (en) | Silver compositions | |
| JPS5851503A (ja) | 導体組成物 | |
| EP0046640B1 (en) | Thick film conductor employing copper oxide | |
| US3547835A (en) | Processes of producing and applying silver compositions,and products therefrom | |
| EP0047071B1 (en) | Thick film conductor employing nickel oxide | |
| US4312896A (en) | Novel soldering process comprising coating a dielectric substrate with electroconductive metal protected by nickel carbide | |
| JPH0574166B2 (enExample) | ||
| US4906404A (en) | Copper conductor composition | |
| EP0045482B1 (en) | Thick film conductor compositions | |
| US4097653A (en) | Cobalt boride conductor compositions | |
| US3588636A (en) | Ohmic contact and method and composition for forming same | |
| JPH04206602A (ja) | 厚膜抵抗組成物 | |
| JPH0349108A (ja) | 銅導体組成物 | |
| JP2631010B2 (ja) | 厚膜銅ペースト | |
| US4271236A (en) | Air fireable end termination compositions for multilayer capacitors based on nickel borides | |
| US3917487A (en) | Cadmium-containing silver conductor compositions | |
| JP2931450B2 (ja) | 導体ペースト | |
| JPH05114305A (ja) | 焼成用ペースト | |
| JP2531023B2 (ja) | 導電性ペ―スト |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |