CA1071579A - End point control in plasma etching - Google Patents
End point control in plasma etchingInfo
- Publication number
- CA1071579A CA1071579A CA261,108A CA261108A CA1071579A CA 1071579 A CA1071579 A CA 1071579A CA 261108 A CA261108 A CA 261108A CA 1071579 A CA1071579 A CA 1071579A
- Authority
- CA
- Canada
- Prior art keywords
- plasma
- emission
- etching
- intensity
- emission line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/71—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light thermally excited
- G01N21/73—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light thermally excited using plasma burners or torches
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/0006—Investigating plasma, e.g. measuring the degree of ionisation or the electron temperature
- H05H1/0012—Investigating plasma, e.g. measuring the degree of ionisation or the electron temperature using electromagnetic or particle radiation, e.g. interferometry
- H05H1/0025—Investigating plasma, e.g. measuring the degree of ionisation or the electron temperature using electromagnetic or particle radiation, e.g. interferometry by using photoelectric means
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Biochemistry (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Drying Of Semiconductors (AREA)
- ing And Chemical Polishing (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA261,108A CA1071579A (en) | 1976-09-13 | 1976-09-13 | End point control in plasma etching |
GB2591777A GB1569939A (en) | 1976-09-13 | 1977-06-21 | End point control in plasma etching |
NL7707198A NL7707198A (nl) | 1976-09-13 | 1977-06-29 | Werkwijze en inrichting voor de regeling van een plasma-etsproces. |
DE19772736262 DE2736262A1 (de) | 1976-09-13 | 1977-08-11 | Verfahren und vorrichtung zur endpunkt-steuerung beim plasmaaetzen |
JP52097935A JPS6013072B2 (ja) | 1976-09-13 | 1977-08-17 | プラズマエツチングの終点制御方法および装置 |
FR7727505A FR2364593A1 (fr) | 1976-09-13 | 1977-09-12 | Procede de controle du point d'arret dans une attaque par plasma et appareil mettant en oeuvre ce procede |
SE7710257A SE439266B (sv) | 1976-09-13 | 1977-09-13 | Sett och anordning for astadkommande av slutpunktskontroll vid plasmaetsning |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA261,108A CA1071579A (en) | 1976-09-13 | 1976-09-13 | End point control in plasma etching |
Publications (1)
Publication Number | Publication Date |
---|---|
CA1071579A true CA1071579A (en) | 1980-02-12 |
Family
ID=4106853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA261,108A Expired CA1071579A (en) | 1976-09-13 | 1976-09-13 | End point control in plasma etching |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS6013072B2 (sv) |
CA (1) | CA1071579A (sv) |
DE (1) | DE2736262A1 (sv) |
FR (1) | FR2364593A1 (sv) |
GB (1) | GB1569939A (sv) |
NL (1) | NL7707198A (sv) |
SE (1) | SE439266B (sv) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54142143A (en) * | 1978-04-27 | 1979-11-06 | Anelva Corp | Dry type etching device |
FR2487574A1 (fr) * | 1980-07-24 | 1982-01-29 | Efcis | Procede et dispositif d'attaque sous plasma d'une couche mince |
US4415402A (en) * | 1981-04-02 | 1983-11-15 | The Perkin-Elmer Corporation | End-point detection in plasma etching or phosphosilicate glass |
JPS5839781A (ja) * | 1981-09-02 | 1983-03-08 | Toshiba Corp | 反応性イオンエツチング装置 |
JPS58100740A (ja) * | 1981-12-11 | 1983-06-15 | Hitachi Ltd | プラズマ分布モニタ |
US4482424A (en) * | 1983-05-06 | 1984-11-13 | At&T Bell Laboratories | Method for monitoring etching of resists by monitoring the flouresence of the unetched material |
DE4016211A1 (de) * | 1990-05-19 | 1991-11-21 | Convac Gmbh | Verfahren zur ueberwachung und steuerung eines aetzvorgangs und vorrichtung hierfuer |
WO2000003232A1 (en) * | 1998-07-11 | 2000-01-20 | Vorgem Limited | Improved process monitor |
DE19860152C1 (de) * | 1998-12-24 | 2000-06-15 | Temic Semiconductor Gmbh | Verfahren zur Erkennung von Lackverbrennungen |
DE102014107385A1 (de) * | 2014-05-26 | 2015-11-26 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung |
GB201611652D0 (en) * | 2016-07-04 | 2016-08-17 | Spts Technologies Ltd | Method of detecting a condition |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US366492A (en) * | 1887-07-12 | Ash-sifter | ||
JPS529353B2 (sv) * | 1972-04-18 | 1977-03-15 | ||
JPS5135639A (ja) * | 1974-09-20 | 1976-03-26 | Hitachi Ltd | Himakunopurazumaetsuchingushorishutenkenshutsuho |
JPS5421711B2 (sv) * | 1975-01-20 | 1979-08-01 | ||
JPS5326674A (en) * | 1976-08-25 | 1978-03-11 | Hitachi Ltd | Plasma etching |
-
1976
- 1976-09-13 CA CA261,108A patent/CA1071579A/en not_active Expired
-
1977
- 1977-06-21 GB GB2591777A patent/GB1569939A/en not_active Expired
- 1977-06-29 NL NL7707198A patent/NL7707198A/xx not_active Application Discontinuation
- 1977-08-11 DE DE19772736262 patent/DE2736262A1/de not_active Withdrawn
- 1977-08-17 JP JP52097935A patent/JPS6013072B2/ja not_active Expired
- 1977-09-12 FR FR7727505A patent/FR2364593A1/fr not_active Withdrawn
- 1977-09-13 SE SE7710257A patent/SE439266B/sv not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPS6013072B2 (ja) | 1985-04-04 |
GB1569939A (en) | 1980-06-25 |
FR2364593A1 (fr) | 1978-04-07 |
SE7710257L (sv) | 1978-03-14 |
JPS5334641A (en) | 1978-03-31 |
DE2736262A1 (de) | 1978-03-16 |
SE439266B (sv) | 1985-06-10 |
NL7707198A (nl) | 1978-03-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MKEX | Expiry |