BG26638A1
(US07534539-20090519-C00280.png)
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1978-06-06 |
1979-05-15 |
|
|
US4336111A
(en)
*
|
1978-11-02 |
1982-06-22 |
The Boeing Company |
Method for determining the strength of a metal processing solution
|
US4326940A
(en)
*
|
1979-05-21 |
1982-04-27 |
Rohco Incorporated |
Automatic analyzer and control system for electroplating baths
|
US4324621A
(en)
*
|
1979-12-26 |
1982-04-13 |
Cominco Ltd. |
Method and apparatus for controlling the quality of electrolytes
|
CA1179751A
(en)
*
|
1982-01-07 |
1984-12-18 |
Robert C. Kerby |
Controlling metal electro-deposition using electrolyte containing, two polarizing agents
|
US4581122A
(en)
*
|
1982-06-09 |
1986-04-08 |
Energy Development Associates, Inc. |
State of charge analytical apparatus
|
US4474649A
(en)
*
|
1982-06-21 |
1984-10-02 |
Asarco Incorporated |
Method of thiourea addition of electrolytic solutions useful for copper refining
|
US4479852A
(en)
*
|
1983-01-21 |
1984-10-30 |
International Business Machines Corporation |
Method for determination of concentration of organic additive in plating bath
|
EP0137776B1
(en)
*
|
1983-02-28 |
1988-04-06 |
Asarco Incorporated |
Method of maintaining and testing for proper concentrations of thiourea in copper refining electrolysis cells
|
US4789445A
(en)
*
|
1983-05-16 |
1988-12-06 |
Asarco Incorporated |
Method for the electrodeposition of metals
|
US4725339A
(en)
*
|
1984-02-13 |
1988-02-16 |
International Business Machines Corporation |
Method for monitoring metal ion concentrations in plating baths
|
TR22348A
(tr)
*
|
1984-06-14 |
1987-02-23 |
Asorco Inc |
Bakir saflandirilmasinda yararh elektrolit coezeltilerine tiouere ilave etme yoentemi
|
DE3668915D1
(de)
*
|
1985-02-28 |
1990-03-15 |
Uemura Kogyo Kk |
Verfahren und vorrichtung zum feststellen des beginns des stromlosen plattierungsvorgangs.
|
US4631116A
(en)
*
|
1985-06-05 |
1986-12-23 |
Hughes Aircraft Company |
Method of monitoring trace constituents in plating baths
|
US4654126A
(en)
*
|
1985-10-07 |
1987-03-31 |
International Business Machines Corporation |
Process for determining the plating activity of an electroless plating bath
|
US4820643A
(en)
*
|
1986-03-10 |
1989-04-11 |
International Business Machines Corporation |
Process for determining the activity of a palladium-tin catalyst
|
US4917774A
(en)
*
|
1986-04-24 |
1990-04-17 |
Shipley Company Inc. |
Method for analyzing additive concentration
|
US4917777A
(en)
*
|
1986-04-24 |
1990-04-17 |
Shipley Company Inc. |
Method for analyzing additive concentration
|
US4908242A
(en)
*
|
1986-10-31 |
1990-03-13 |
Kollmorgen Corporation |
Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
|
US4812210A
(en)
*
|
1987-10-16 |
1989-03-14 |
The United States Department Of Energy |
Measuring surfactant concentration in plating solutions
|
US5071527A
(en)
*
|
1990-06-29 |
1991-12-10 |
University Of Dayton |
Complete oil analysis technique
|
JP3037971B2
(ja)
*
|
1990-07-04 |
2000-05-08 |
アンリツ株式会社 |
アジ検出方法
|
US5223118A
(en)
*
|
1991-03-08 |
1993-06-29 |
Shipley Company Inc. |
Method for analyzing organic additives in an electroplating bath
|
US5192403A
(en)
*
|
1991-05-16 |
1993-03-09 |
International Business Machines Corporation |
Cyclic voltammetric method for the measurement of concentrations of subcomponents of plating solution additive mixtures
|
US5273641A
(en)
*
|
1992-01-21 |
1993-12-28 |
Inco Limited |
Electrode and method for measuring levelling power
|
US5236571A
(en)
*
|
1992-01-21 |
1993-08-17 |
Inco Limited |
Electrode and method for measuring levelling power
|
US5352350A
(en)
*
|
1992-02-14 |
1994-10-04 |
International Business Machines Corporation |
Method for controlling chemical species concentration
|
US5389215A
(en)
*
|
1992-11-05 |
1995-02-14 |
Nippon Telegraph And Telephone Corporation |
Electrochemical detection method and apparatus therefor
|
CA2087801C
(en)
*
|
1993-01-21 |
1996-08-13 |
Noranda Ipco Inc. |
Method and apparatus for on-line monitoring the quality of a purified metal sulphate solution
|
US5298132A
(en)
*
|
1993-03-25 |
1994-03-29 |
Hughes Aircraft Company |
Method for monitoring purification treatment in plating baths
|
EP0665431A3
(de)
*
|
1994-01-14 |
1996-11-13 |
Fraunhofer Ges Forschung |
Verfahren und Vorrichtung zur Detektion von Nitrotoluolen.
|
US5889200A
(en)
*
|
1996-08-30 |
1999-03-30 |
The University Of Dayton |
Tandem technique for fluid monitoring
|
US5933016A
(en)
*
|
1996-08-30 |
1999-08-03 |
The University Of Dayton |
Single electrode conductivity technique
|
DE19748124C1
(de)
*
|
1997-10-31 |
1999-03-18 |
Fraunhofer Ges Forschung |
Verfahren und Vorrichtung zur Detektion schwerflüchtiger Substanzen
|
JP2002506531A
(ja)
*
|
1998-05-01 |
2002-02-26 |
セミトウール・インコーポレーテツド |
電気メッキ浴中の添加物の測定法
|
US6365033B1
(en)
*
|
1999-05-03 |
2002-04-02 |
Semitoof, Inc. |
Methods for controlling and/or measuring additive concentration in an electroplating bath
|
US6814855B2
(en)
*
|
1998-05-01 |
2004-11-09 |
Semitool, Inc. |
Automated chemical management system having improved analysis unit
|
USRE38931E1
(en)
*
|
1998-05-01 |
2006-01-10 |
Semitool, Inc. |
Methods for controlling and/or measuring additive concentration in an electroplating bath
|
US6899805B2
(en)
*
|
1998-05-01 |
2005-05-31 |
Semitool, Inc. |
Automated chemical management system executing improved electrolyte analysis method
|
DE69929607T2
(de)
|
1998-06-30 |
2006-07-27 |
Semitool, Inc., Kalispell |
Metallisierungsstrukturen für mikroelektronische anwendungen und verfahren zur herstellung dieser strukturen
|
FI109296B
(fi)
*
|
1999-12-21 |
2002-06-28 |
Outokumpu Oy |
Menetelmä kuparin elektrolyyttiseksi puhdistamiseksi
|
US6592736B2
(en)
|
2001-07-09 |
2003-07-15 |
Semitool, Inc. |
Methods and apparatus for controlling an amount of a chemical constituent of an electrochemical bath
|
JP2004537653A
(ja)
*
|
2001-08-14 |
2004-12-16 |
マグパワー・システムズ・インコーポレイテッド |
亜鉛電解採取のための水素発生抑制添加剤
|
US6991710B2
(en)
*
|
2002-02-22 |
2006-01-31 |
Semitool, Inc. |
Apparatus for manually and automatically processing microelectronic workpieces
|
US20100098863A1
(en)
*
|
2003-03-12 |
2010-04-22 |
University Of Missouri |
Process for spontaneous deposition from an organic solution
|
JP2005082843A
(ja)
*
|
2003-09-05 |
2005-03-31 |
Ebara Corp |
電解液管理方法及び管理装置
|
US20050236280A1
(en)
*
|
2004-04-27 |
2005-10-27 |
Jianwen Han |
Methods for analyzing inorganic components of an electrolytic solution, and /or cleaning an electrochemical analytical cell
|
US9864345B2
(en)
*
|
2014-01-31 |
2018-01-09 |
Technic, Inc. |
Eliminating temperature variation effects to improve accuracy of electroplating bath monitoring
|