CA1051559A - Process for the production of printed circuits with solder rejecting sub-zones - Google Patents
Process for the production of printed circuits with solder rejecting sub-zonesInfo
- Publication number
- CA1051559A CA1051559A CA261,258A CA261258A CA1051559A CA 1051559 A CA1051559 A CA 1051559A CA 261258 A CA261258 A CA 261258A CA 1051559 A CA1051559 A CA 1051559A
- Authority
- CA
- Canada
- Prior art keywords
- zones
- sub
- etch
- layer
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 35
- 230000008569 process Effects 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 38
- 239000002184 metal Substances 0.000 claims abstract description 38
- 238000005530 etching Methods 0.000 claims abstract description 23
- 238000002161 passivation Methods 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 8
- 238000007639 printing Methods 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 9
- 239000011593 sulfur Substances 0.000 claims description 9
- 229910052717 sulfur Inorganic materials 0.000 claims description 9
- 210000004185 liver Anatomy 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 238000011161 development Methods 0.000 claims description 7
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 239000007864 aqueous solution Substances 0.000 claims description 6
- 238000007598 dipping method Methods 0.000 claims description 6
- 239000000243 solution Substances 0.000 claims description 6
- 230000018109 developmental process Effects 0.000 claims 4
- 239000004922 lacquer Substances 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- MCWXGJITAZMZEV-UHFFFAOYSA-N dimethoate Chemical compound CNC(=O)CSP(=S)(OC)OC MCWXGJITAZMZEV-UHFFFAOYSA-N 0.000 description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- BWFPGXWASODCHM-UHFFFAOYSA-N copper monosulfide Chemical class [Cu]=S BWFPGXWASODCHM-UHFFFAOYSA-N 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001371 Er alloy Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- OMZSGWSJDCOLKM-UHFFFAOYSA-N copper(II) sulfide Chemical compound [S-2].[Cu+2] OMZSGWSJDCOLKM-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- FGRVOLIFQGXPCT-UHFFFAOYSA-L dipotassium;dioxido-oxo-sulfanylidene-$l^{6}-sulfane Chemical compound [K+].[K+].[O-]S([O-])(=O)=S FGRVOLIFQGXPCT-UHFFFAOYSA-L 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 229940016373 potassium polysulfide Drugs 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 description 1
- 229960002218 sodium chlorite Drugs 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000004763 sulfides Chemical class 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0505—Double exposure of the same photosensitive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3473—Plating of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19752541280 DE2541280A1 (de) | 1975-09-16 | 1975-09-16 | Verfahren zur herstellung einer gedruckten verdrahtung mit lotabweisenden teilbereichen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1051559A true CA1051559A (en) | 1979-03-27 |
Family
ID=5956607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA261,258A Expired CA1051559A (en) | 1975-09-16 | 1976-09-15 | Process for the production of printed circuits with solder rejecting sub-zones |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US4268349A (show.php) |
| JP (1) | JPS5236758A (show.php) |
| AT (1) | AT364017B (show.php) |
| BE (1) | BE846282A (show.php) |
| BR (1) | BR7605828A (show.php) |
| CA (1) | CA1051559A (show.php) |
| CH (1) | CH607545A5 (show.php) |
| DE (1) | DE2541280A1 (show.php) |
| FR (1) | FR2325269A1 (show.php) |
| GB (1) | GB1517235A (show.php) |
| IT (1) | IT1068137B (show.php) |
| NL (1) | NL7609577A (show.php) |
| SE (1) | SE7609871L (show.php) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2861486D1 (en) * | 1977-11-21 | 1982-02-18 | Ciba Geigy Ag | Process for the application of soldering masks to printed circuits with through holes for contacting |
| US4512829A (en) * | 1983-04-07 | 1985-04-23 | Satosen Co., Ltd. | Process for producing printed circuit boards |
| US4537799A (en) * | 1984-04-16 | 1985-08-27 | At&T Technologies, Inc. | Selective metallization process |
| GB9401869D0 (en) * | 1994-02-01 | 1994-03-30 | Heinze Dyconex Patente | Improvements in and relating to printed circuit boards |
| US8826852B2 (en) | 2010-04-12 | 2014-09-09 | Engineered Products And Services, Inc. | Optimized double washer pull plug for minimizing coating error |
| USD655998S1 (en) * | 2010-04-12 | 2012-03-20 | Engineered Products And Services, Inc. | Double washer pull plug |
| CN110856364A (zh) * | 2019-11-21 | 2020-02-28 | 珠海市凯诺微电子有限公司 | 一种用于制造软硬结合板的沉镀金方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3443988A (en) * | 1965-05-06 | 1969-05-13 | Photocircuits Corp | Printed circuits,work holders and method of preventing electroless metal deposition |
| DE1812692A1 (de) * | 1968-12-04 | 1970-11-05 | Siemens Ag | Verfahren zur Herstellung von mit Leiterbahnen versehenen Schaltungsplatten |
| US3599326A (en) * | 1969-01-27 | 1971-08-17 | Philco Ford Corp | Method of forming electrical connections with solder resistant surfaces |
| US3610811A (en) * | 1969-06-02 | 1971-10-05 | Honeywell Inf Systems | Printed circuit board with solder resist gas escape ports |
| GB1310880A (en) * | 1969-06-13 | 1973-03-21 | Microponent Dev Ltd | Multi-layer printed circuit board assemblies |
| US3686625A (en) * | 1969-12-10 | 1972-08-22 | Molex Products Co | Solder resist |
| DE2140274A1 (de) * | 1971-08-11 | 1973-02-15 | Bbc Brown Boveri & Cie | Mittel und verfahren zur verhinderung des festhaftens von schweisspritzern |
| US3945826A (en) * | 1972-04-14 | 1976-03-23 | Howard Friedman | Method of chemical machining utilizing same coating of positive photoresist to etch and electroplate |
| US3990982A (en) * | 1974-12-18 | 1976-11-09 | Rbp Chemical Corporation | Composition for stripping lead-tin solder |
-
1975
- 1975-09-16 DE DE19752541280 patent/DE2541280A1/de not_active Withdrawn
-
1976
- 1976-06-17 CH CH774076A patent/CH607545A5/xx not_active IP Right Cessation
- 1976-07-09 GB GB28606/76A patent/GB1517235A/en not_active Expired
- 1976-08-12 AT AT0599576A patent/AT364017B/de not_active IP Right Cessation
- 1976-08-23 JP JP51100456A patent/JPS5236758A/ja active Pending
- 1976-08-27 NL NL7609577A patent/NL7609577A/xx not_active Application Discontinuation
- 1976-09-02 BR BR7605828A patent/BR7605828A/pt unknown
- 1976-09-07 SE SE7609871A patent/SE7609871L/xx unknown
- 1976-09-08 FR FR7626987A patent/FR2325269A1/fr active Granted
- 1976-09-10 IT IT27065/76A patent/IT1068137B/it active
- 1976-09-15 CA CA261,258A patent/CA1051559A/en not_active Expired
- 1976-09-15 US US05/723,582 patent/US4268349A/en not_active Expired - Lifetime
- 1976-09-16 BE BE170692A patent/BE846282A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GB1517235A (en) | 1978-07-12 |
| JPS5236758A (en) | 1977-03-22 |
| BR7605828A (pt) | 1977-08-16 |
| IT1068137B (it) | 1985-03-21 |
| BE846282A (fr) | 1977-01-17 |
| AT364017B (de) | 1981-09-25 |
| DE2541280A1 (de) | 1977-03-17 |
| CH607545A5 (show.php) | 1978-12-29 |
| FR2325269A1 (fr) | 1977-04-15 |
| FR2325269B1 (show.php) | 1980-09-05 |
| NL7609577A (nl) | 1977-03-18 |
| SE7609871L (sv) | 1977-03-17 |
| US4268349A (en) | 1981-05-19 |
| ATA599576A (de) | 1981-02-15 |
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