CA1043472A - Method and apparatus for simultaneously bonding a plurality of lead frames to a plurality of planar articles - Google Patents

Method and apparatus for simultaneously bonding a plurality of lead frames to a plurality of planar articles

Info

Publication number
CA1043472A
CA1043472A CA250,688A CA250688A CA1043472A CA 1043472 A CA1043472 A CA 1043472A CA 250688 A CA250688 A CA 250688A CA 1043472 A CA1043472 A CA 1043472A
Authority
CA
Canada
Prior art keywords
bonding
lead frames
articles
tips
thermode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA250,688A
Other languages
English (en)
French (fr)
Inventor
John A. Burns
Andrew R. Sivo (Jr.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Application granted granted Critical
Publication of CA1043472A publication Critical patent/CA1043472A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
CA250,688A 1975-06-02 1976-04-21 Method and apparatus for simultaneously bonding a plurality of lead frames to a plurality of planar articles Expired CA1043472A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/583,213 US3941297A (en) 1975-06-02 1975-06-02 Method and apparatus for simultaneously bonding a plurality of lead frames to a plurality of planar articles

Publications (1)

Publication Number Publication Date
CA1043472A true CA1043472A (en) 1978-11-28

Family

ID=24332161

Family Applications (1)

Application Number Title Priority Date Filing Date
CA250,688A Expired CA1043472A (en) 1975-06-02 1976-04-21 Method and apparatus for simultaneously bonding a plurality of lead frames to a plurality of planar articles

Country Status (6)

Country Link
US (1) US3941297A (enExample)
JP (1) JPS51147960A (enExample)
CA (1) CA1043472A (enExample)
DE (1) DE2624178C2 (enExample)
FR (1) FR2313842A1 (enExample)
GB (1) GB1531547A (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3941297A (en) * 1975-06-02 1976-03-02 Western Electric Company, Inc. Method and apparatus for simultaneously bonding a plurality of lead frames to a plurality of planar articles
JPS5918861B2 (ja) * 1975-08-25 1984-05-01 日本電気株式会社 ダイボンデイング装置
US4583676A (en) * 1982-05-03 1986-04-22 Motorola, Inc. Method of wire bonding a semiconductor die and apparatus therefor
US4607779A (en) * 1983-08-11 1986-08-26 National Semiconductor Corporation Non-impact thermocompression gang bonding method
US4627151A (en) * 1984-03-22 1986-12-09 Thomson Components-Mostek Corporation Automatic assembly of integrated circuits
GB2165178A (en) * 1984-10-05 1986-04-09 Hitachi Ltd Method and apparatus for wire bonding
US4765531A (en) * 1987-05-14 1988-08-23 Kulicke And Soffa Industries Inc. Quick change work station apparatus for automatic wire bonders
GB8724817D0 (en) * 1987-10-23 1987-11-25 Chloride Silent Power Ltd Constructing metal energy conversion device
US4861944A (en) * 1987-12-09 1989-08-29 Cabot Electronics Ceramics, Inc. Low cost, hermetic pin grid array package
US4795077A (en) * 1988-05-23 1989-01-03 Motorola Inc. Bonding method and apparatus
US4899921A (en) * 1988-10-28 1990-02-13 The American Optical Corporation Aligner bonder
US5120391A (en) * 1989-04-17 1992-06-09 Kabushiki Kaisha Shinkawa Tape bonding apparatus
JP2534132B2 (ja) * 1989-05-15 1996-09-11 株式会社新川 ボンデイング方法
JPH0652747B2 (ja) * 1990-02-05 1994-07-06 インターナショナル・ビジネス・マシーンズ・コーポレイション 断熱装置
US5435378A (en) * 1991-06-04 1995-07-25 Process And Equipment Development, Inc. Apparatus for accurately heating and cooling articles
US5834320A (en) * 1995-06-05 1998-11-10 Motorola, Inc. Method of assembling a semiconductor device using a magnet
US5971256A (en) 1997-02-05 1999-10-26 Micron Technology, Inc. Quick change precisor
DE102005038416B3 (de) * 2005-08-12 2006-09-21 Mühlbauer Ag Thermodenvorrichtung für eine Vielzahl von Halbleiterbauelementen
ES2399982T3 (es) * 2006-06-26 2013-04-04 Srb Energy Research Sarl Dispositivo para soldar de manera estanca al vacío un colector solar de panel plano al vacío
DE102007058802B3 (de) * 2007-12-06 2009-06-10 Datacon Technology Gmbh Thermodenvorrichtung
US7845543B1 (en) * 2009-11-17 2010-12-07 Asm Assembly Automation Ltd Apparatus and method for bonding multiple dice
US11594511B2 (en) * 2021-04-08 2023-02-28 Advanced Semiconductor Engineering, Inc. Bonding device and bonding method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1253708A (en) * 1968-05-28 1971-11-17 Motorola Inc Semiconductor device fabrication
US3627190A (en) * 1969-10-28 1971-12-14 Gte Laboratories Inc Apparatus for bonding semiconductor elements
US3793714A (en) * 1971-05-27 1974-02-26 Texas Instruments Inc Integrated circuit assembly using etched metal patterns of flexible insulating film
US3729810A (en) * 1971-12-14 1973-05-01 Western Electric Co Compensating base for lead-frame bonding
US3868764A (en) * 1973-11-09 1975-03-04 Gen Motors Corp Multiple magnetic alignment of semiconductor devices for bonding
US3896541A (en) * 1974-09-16 1975-07-29 Western Electric Co Method and apparatus for supporting substrates during bonding
US3941297A (en) * 1975-06-02 1976-03-02 Western Electric Company, Inc. Method and apparatus for simultaneously bonding a plurality of lead frames to a plurality of planar articles

Also Published As

Publication number Publication date
FR2313842B1 (enExample) 1978-08-25
GB1531547A (en) 1978-11-08
JPS51147960A (en) 1976-12-18
DE2624178C2 (de) 1986-01-09
FR2313842A1 (fr) 1976-12-31
DE2624178A1 (de) 1977-05-05
US3941297A (en) 1976-03-02
JPS5426872B2 (enExample) 1979-09-06

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