CA1039631A - Copper and copper alloy etching solutions and process - Google Patents

Copper and copper alloy etching solutions and process

Info

Publication number
CA1039631A
CA1039631A CA209,481A CA209481A CA1039631A CA 1039631 A CA1039631 A CA 1039631A CA 209481 A CA209481 A CA 209481A CA 1039631 A CA1039631 A CA 1039631A
Authority
CA
Canada
Prior art keywords
ppm
copper
concentration
etching
salts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA209,481A
Other languages
English (en)
French (fr)
Inventor
Akira Matsumoto
Katsutoshi Itani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeka Corp
Original Assignee
Tokai Denka Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokai Denka Industrial Co Ltd filed Critical Tokai Denka Industrial Co Ltd
Application granted granted Critical
Publication of CA1039631A publication Critical patent/CA1039631A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Catalysts (AREA)
CA209,481A 1973-11-19 1974-09-18 Copper and copper alloy etching solutions and process Expired CA1039631A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48129156A JPS5224508B2 (enFirst) 1973-11-19 1973-11-19

Publications (1)

Publication Number Publication Date
CA1039631A true CA1039631A (en) 1978-10-03

Family

ID=15002514

Family Applications (1)

Application Number Title Priority Date Filing Date
CA209,481A Expired CA1039631A (en) 1973-11-19 1974-09-18 Copper and copper alloy etching solutions and process

Country Status (7)

Country Link
US (1) US3936332A (enFirst)
JP (1) JPS5224508B2 (enFirst)
CA (1) CA1039631A (enFirst)
DE (1) DE2453429A1 (enFirst)
FR (1) FR2251631B1 (enFirst)
GB (1) GB1464041A (enFirst)
IT (1) IT1022770B (enFirst)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4110237A (en) * 1973-11-19 1978-08-29 Tokai Denka Kabushiki Kaisha Compositions containing a diazine and a halogen compound for catalyzing copper etching solutions
US4155866A (en) * 1978-04-24 1979-05-22 International Business Machines Corporation Method of controlling silicon wafer etching rates-utilizing a diazine catalyzed etchant
US4362595A (en) * 1980-05-19 1982-12-07 The Boeing Company Screen fabrication by hand chemical blanking
US4319955A (en) * 1980-11-05 1982-03-16 Philip A. Hunt Chemical Corp. Ammoniacal alkaline cupric etchant solution for and method of reducing etchant undercut
US4725374A (en) * 1983-10-06 1988-02-16 Olin Corporation Process and apparatus for etching copper base materials
US4973380A (en) * 1983-10-06 1990-11-27 Olin Corporation Process for etching copper base materials
DE3623504A1 (de) * 1986-07-09 1988-01-21 Schering Ag Kupferaetzloesungen
US5607619A (en) * 1988-03-07 1997-03-04 Great Lakes Chemical Corporation Inorganic perbromide compositions and methods of use thereof
US5620585A (en) * 1988-03-07 1997-04-15 Great Lakes Chemical Corporation Inorganic perbromide compositions and methods of use thereof
US5248386A (en) * 1991-02-08 1993-09-28 Aluminum Company Of America Milling solution and method
FI934431L (fi) * 1991-04-12 1993-11-05 Great Lakes Chemical Corp Oorganiska perbromidkompositioner och deras anvaendningsfoerfaranden
JP3400558B2 (ja) * 1994-08-12 2003-04-28 メック株式会社 銅および銅合金のエッチング液
US20040035717A1 (en) * 2002-08-21 2004-02-26 Casio Micronics Co. , Ltd. Chemical treatment method and chemical treatment apparatus
TW200417628A (en) * 2002-09-09 2004-09-16 Shipley Co Llc Improved cleaning composition
JP6164614B2 (ja) * 2013-12-06 2017-07-19 メック株式会社 エッチング液、補給液及び銅配線の形成方法
JP6000420B1 (ja) * 2015-08-31 2016-09-28 メック株式会社 エッチング液、補給液及び銅配線の形成方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3410802A (en) * 1966-02-21 1968-11-12 Fmc Corp Process and composition for etching of copper metal
JPS5221460B1 (enFirst) * 1971-04-26 1977-06-10

Also Published As

Publication number Publication date
FR2251631A1 (enFirst) 1975-06-13
IT1022770B (it) 1978-04-20
US3936332A (en) 1976-02-03
GB1464041A (en) 1977-02-09
JPS5224508B2 (enFirst) 1977-07-01
FR2251631B1 (enFirst) 1978-06-16
JPS5079448A (enFirst) 1975-06-27
DE2453429A1 (de) 1975-05-22

Similar Documents

Publication Publication Date Title
CA1039631A (en) Copper and copper alloy etching solutions and process
US4144119A (en) Etchant and process
US4130454A (en) Etchant and process of etching with the same
US4859281A (en) Etching of copper and copper bearing alloys
CA1196560A (en) Metal stripping composition and process
CA2168013C (en) Alkaline ammoniacal cupric chloride etching bath containing a copper (i) stabilizer
CA1038736A (en) Copper and copper alloy etching solutions and process
JPS5943879A (ja) 過酸化水素含有硫酸溶液を用いるプリント回路エツチングのための組成物及びその方法
US4462861A (en) Etchant with increased etch rate
US3137600A (en) Dissolution of copper
KR20230121078A (ko) 수성 조성물, 이것을 이용한 스테인리스강 표면의 조화처리방법,그리고 조화 스테인리스강의 제조방법
US4110237A (en) Compositions containing a diazine and a halogen compound for catalyzing copper etching solutions
CA1215300A (en) Regenerative copper etching process and solution
CA2069933C (en) Etching solution containing a vanadium catalyst
US4158593A (en) Dissolution of metals utilizing a H2 O2 -sulfuric acid solution catalyzed with selenium compounds
JPH01240683A (ja) 銅のエッチング液組成物およびエッチング方法
JP3387529B2 (ja) 銅および銅合金の化学溶解液
US3322673A (en) Composition for and method of dissolving copper and copper alloys by chemical action
CN114717559A (zh) 一种钛蚀刻液及其应用
JPS6231070B2 (enFirst)
US3919100A (en) Alkaline etchant compositions
JP3124512B2 (ja) エッチングレジスト用エッチング液
US4437929A (en) Dissolution of metals utilizing pyrrolidone
CN107012465A (zh) 一种铜蚀刻液及其应用
CA1221896A (en) Aqueous process for etching copper and other metals