CA1032657A - Radio frequency power amplifier constructed as hybrid microelectronic unit - Google Patents

Radio frequency power amplifier constructed as hybrid microelectronic unit

Info

Publication number
CA1032657A
CA1032657A CA229,273A CA229273A CA1032657A CA 1032657 A CA1032657 A CA 1032657A CA 229273 A CA229273 A CA 229273A CA 1032657 A CA1032657 A CA 1032657A
Authority
CA
Canada
Prior art keywords
radio frequency
power amplifier
frequency power
microelectronic unit
amplifier constructed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA229,273A
Other languages
English (en)
French (fr)
Inventor
Daniel M. Smith
William J. Knutson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of CA1032657A publication Critical patent/CA1032657A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0091Housing specially adapted for small components
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/189High-frequency amplifiers, e.g. radio frequency amplifiers
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/20Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
    • H03F3/24Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
    • H03F3/245Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages with semiconductor devices only
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07Electric details
    • H05K2201/0707Shielding
    • H05K2201/0715Shielding provided by an outer layer of PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/1003Non-printed inductor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10265Metallic coils or springs, e.g. as part of a connection element
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/171Tuning, e.g. by trimming of printed components or high frequency circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/175Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Amplifiers (AREA)
  • Microwave Amplifiers (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CA229,273A 1974-08-05 1975-06-13 Radio frequency power amplifier constructed as hybrid microelectronic unit Expired CA1032657A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/492,306 US4001711A (en) 1974-08-05 1974-08-05 Radio frequency power amplifier constructed as hybrid microelectronic unit

Publications (1)

Publication Number Publication Date
CA1032657A true CA1032657A (en) 1978-06-06

Family

ID=23955766

Family Applications (1)

Application Number Title Priority Date Filing Date
CA229,273A Expired CA1032657A (en) 1974-08-05 1975-06-13 Radio frequency power amplifier constructed as hybrid microelectronic unit

Country Status (9)

Country Link
US (1) US4001711A (ru)
JP (1) JPS5136060A (ru)
CA (1) CA1032657A (ru)
DE (1) DE2532670A1 (ru)
DK (1) DK352475A (ru)
FR (1) FR2281672A1 (ru)
GB (1) GB1463925A (ru)
NL (1) NL7508266A (ru)
SE (1) SE400015B (ru)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5233453A (en) * 1975-09-10 1977-03-14 Nec Corp High frequency high output transistor amplifier
JPS52141621A (en) * 1977-06-06 1977-11-26 Nippon Gakki Seizo Kk Automatic rhythm playing device
JPS54163361A (en) * 1978-06-15 1979-12-25 Nippon Electric Co High frequency integrated circuit apparatus
JPS5546791A (en) * 1978-09-28 1980-04-02 Roland Kk Automatic rhythum generation system for electronic musical instrument
US4318054A (en) * 1979-02-07 1982-03-02 Nippon Gakki Seizo Kabushiki Kaisha Input circuit of audio amplifier
US4389080A (en) * 1981-07-15 1983-06-21 General Electric Plug-in ceramic hybrid module
DE3316314A1 (de) * 1982-05-15 1983-11-17 AMP Inc., 17105 Harrisburg, Pa. Elektrischer verbinder
US4523155A (en) * 1983-05-04 1985-06-11 Motorola, Inc. Temperature compensated automatic output control circuitry for RF signal power amplifiers with wide dynamic range
US4716391A (en) * 1986-07-25 1987-12-29 Motorola, Inc. Multiple resonator component-mountable filter
US4954796A (en) * 1986-07-25 1990-09-04 Motorola, Inc. Multiple resonator dielectric filter
JPH02130008A (ja) * 1988-11-09 1990-05-18 Toshiba Corp 高周波電力増幅回路
US4965526A (en) * 1989-07-14 1990-10-23 Motorola Inc. Hybrid amplifier
US5170321A (en) * 1990-12-24 1992-12-08 Motorola, Inc. Enclosure system for environmental isolation of RF circuitry
EP0499116A1 (de) * 1991-02-11 1992-08-19 Industrielabor für Hochenergie-Elektronik Winfried P. Rütt-Hübner KG Kompaktes RF-Leistungsgenerator-System
DE4234022C2 (de) * 1992-10-09 1995-05-24 Telefunken Microelectron Schichtschaltung mit mindestens einem Leistungswiderstand
US5367434A (en) * 1993-05-06 1994-11-22 Motorola, Inc. Electrical module assembly
JPH07211856A (ja) * 1994-01-12 1995-08-11 Fujitsu Ltd 集積回路モジュール
US5535438A (en) * 1994-05-10 1996-07-09 Panasonic Technologies, Inc. Phase linear class E amplifier for a satellite communication terminal which communicates with a low earth orbiting satellite
FI971850A (fi) 1997-04-30 1998-10-31 Nokia Telecommunications Oy Järjestely radiotaajuisten signaalien keskeishäiriöiden vähentämiseksi
RU2133523C1 (ru) * 1997-11-03 1999-07-20 Закрытое акционерное общество "Техно-ТМ" Трехмерный электронный модуль
JP2001292028A (ja) * 2000-04-05 2001-10-19 Murata Mfg Co Ltd 電圧制御発振器の調整方法
TW483233B (en) * 2000-05-30 2002-04-11 Alps Electric Co Ltd Electronic circuit unit
TW535352B (en) * 2000-05-30 2003-06-01 Alps Electric Co Ltd Surface-mounting type electronic circuit unit
DE60321045D1 (de) * 2002-12-20 2008-06-26 California Inst Of Techn Rauscharmer verstärker mit gemeinsamem gate mit resistiver durchspeisung
US6933443B2 (en) * 2004-01-28 2005-08-23 Infineon Technologies North America Corp. Method for bonding ceramic to copper, without creating a bow in the copper
US8884714B2 (en) * 2005-12-22 2014-11-11 Pine Valley Investments, Inc. Apparatus, system, and method for digital base modulation of power amplifier in polar transmitter
CN201956484U (zh) * 2010-11-22 2011-08-31 中兴通讯股份有限公司 一种射频传输的导电装置
US10212804B2 (en) 2017-01-16 2019-02-19 Harris Global Communications, Inc. Electronic device with laterally extending thermally conductive body and related methods
RU2701486C1 (ru) * 2018-12-25 2019-09-26 Открытое акционерное общество "Научно-производственное объединение Ангстрем" Устройство усилителя мощности со встроенным в корпус блоком питания
RU2694141C1 (ru) * 2018-12-29 2019-07-09 Открытое акционерное общество "Научно-производственное объединение Ангстрем" Устройство линейного усилителя мощности дкмв диапазона
DE102019117473A1 (de) * 2019-06-28 2020-12-31 Tesat-Spacecom Gmbh & Co. Kg Schaltungsanordnung bestehend aus zwei miteinander verbundenen Hochfrequenzkomponenten
CN114980633B (zh) * 2022-08-02 2022-10-21 成都汉芯国科集成技术有限公司 一种前侧热提取结构的功率放大器装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3258606A (en) * 1962-10-16 1966-06-28 Integrated circuits using thermal effects
US3502997A (en) * 1965-10-24 1970-03-24 Motorola Inc Integrated semiconductor cascode amplifier
DE6608942U (de) * 1967-08-19 1971-12-23 Sanyo Electric Co Integrierte hybridschaltung.
SE328352B (ru) * 1967-09-11 1970-09-14 Ericsson Telefon Ab L M
AT280348B (de) * 1968-07-30 1970-04-10 H C Hans Dipl Ing Dr Dr List Integrierter Feld-Effekt-Kettenverstärker
US3506877A (en) * 1968-09-25 1970-04-14 Us Navy Hermetically sealed and shielded circuit module
BE760031A (fr) * 1969-12-11 1971-05-17 Rca Corp Boitier pour module de puissance hybride a semiconducteurs
US3694699A (en) * 1970-03-30 1972-09-26 Nat Beryllia Corp Ceramic based substrates for electronic circuits with improved heat dissipating properties and circuits including the same
DE2258557C3 (de) * 1972-11-30 1975-06-05 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Lösbare elektrische Verbindung zwischen dem Massebelag eines Mikrowellenbausteins und dem diesen umschließenden metallischen Gehäuse
US3845403A (en) * 1972-12-27 1974-10-29 Rca Corp Amplifier for amplitude modulated waves with means for improving sideband response

Also Published As

Publication number Publication date
US4001711A (en) 1977-01-04
DK352475A (da) 1976-02-06
FR2281672A1 (fr) 1976-03-05
FR2281672B1 (ru) 1981-08-07
SE400015B (sv) 1978-03-06
GB1463925A (en) 1977-02-09
SE7507701L (sv) 1976-02-06
NL7508266A (nl) 1976-02-09
DE2532670A1 (de) 1976-02-19
DE2532670C2 (ru) 1987-12-17
JPS5136060A (ru) 1976-03-26

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