CA1032396A - Method of depositing thin film utilizing a lift-off mask - Google Patents
Method of depositing thin film utilizing a lift-off maskInfo
- Publication number
- CA1032396A CA1032396A CA211,474A CA211474A CA1032396A CA 1032396 A CA1032396 A CA 1032396A CA 211474 A CA211474 A CA 211474A CA 1032396 A CA1032396 A CA 1032396A
- Authority
- CA
- Canada
- Prior art keywords
- lift
- mask
- thin film
- depositing thin
- film utilizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000151 deposition Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0272—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers for lift-off processes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/094—Multilayer resist systems, e.g. planarising layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/312—Organic layers, e.g. photoresist
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
- H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Drying Of Semiconductors (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Weting (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US420034A US3873361A (en) | 1973-11-29 | 1973-11-29 | Method of depositing thin film utilizing a lift-off mask |
Publications (1)
Publication Number | Publication Date |
---|---|
CA1032396A true CA1032396A (en) | 1978-06-06 |
Family
ID=23664803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA211,474A Expired CA1032396A (en) | 1973-11-29 | 1974-10-16 | Method of depositing thin film utilizing a lift-off mask |
Country Status (7)
Country | Link |
---|---|
US (1) | US3873361A (de) |
JP (1) | JPS5231714B2 (de) |
CA (1) | CA1032396A (de) |
DE (1) | DE2448535C2 (de) |
FR (1) | FR2253278B1 (de) |
GB (1) | GB1450508A (de) |
IT (1) | IT1025189B (de) |
Families Citing this family (76)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5061124A (de) * | 1973-09-28 | 1975-05-26 | ||
US3982943A (en) * | 1974-03-05 | 1976-09-28 | Ibm Corporation | Lift-off method of fabricating thin films and a structure utilizable as a lift-off mask |
DE2432719B2 (de) * | 1974-07-08 | 1977-06-02 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum erzeugen von feinen strukturen aus aufdampfbaren materialien auf einer unterlage und anwendung des verfahrens |
NL7412383A (nl) * | 1974-09-19 | 1976-03-23 | Philips Nv | Werkwijze voor het vervaardigen van een in- richting met een geleiderpatroon. |
JPS5230851B2 (de) * | 1974-10-11 | 1977-08-11 | ||
JPS5738897B2 (de) * | 1974-11-19 | 1982-08-18 | ||
US4207105A (en) * | 1975-01-27 | 1980-06-10 | Fuji Photo Film Co., Ltd. | Plasma-etching image in exposed AgX emulsion |
JPS51105821A (en) * | 1975-03-14 | 1976-09-20 | Fuji Photo Film Co Ltd | Masukugazono keiseihoho |
US4004044A (en) * | 1975-05-09 | 1977-01-18 | International Business Machines Corporation | Method for forming patterned films utilizing a transparent lift-off mask |
FR2340620A1 (fr) * | 1976-02-06 | 1977-09-02 | Ibm | Procede de fabrication d'un dispositif integre a grande echelle ayant une surface plane |
US4029562A (en) * | 1976-04-29 | 1977-06-14 | Ibm Corporation | Forming feedthrough connections for multi-level interconnections metallurgy systems |
US4035276A (en) * | 1976-04-29 | 1977-07-12 | Ibm Corporation | Making coplanar layers of thin films |
US4040891A (en) * | 1976-06-30 | 1977-08-09 | Ibm Corporation | Etching process utilizing the same positive photoresist layer for two etching steps |
US4076575A (en) * | 1976-06-30 | 1978-02-28 | International Business Machines Corporation | Integrated fabrication method of forming connectors through insulative layers |
US4218532A (en) * | 1977-10-13 | 1980-08-19 | Bell Telephone Laboratories, Incorporated | Photolithographic technique for depositing thin films |
US4132586A (en) * | 1977-12-20 | 1979-01-02 | International Business Machines Corporation | Selective dry etching of substrates |
US4244799A (en) * | 1978-09-11 | 1981-01-13 | Bell Telephone Laboratories, Incorporated | Fabrication of integrated circuits utilizing thick high-resolution patterns |
US4181755A (en) * | 1978-11-21 | 1980-01-01 | Rca Corporation | Thin film pattern generation by an inverse self-lifting technique |
US4202914A (en) * | 1978-12-29 | 1980-05-13 | International Business Machines Corporation | Method of depositing thin films of small dimensions utilizing silicon nitride lift-off mask |
US4272561A (en) * | 1979-05-29 | 1981-06-09 | International Business Machines Corporation | Hybrid process for SBD metallurgies |
US4232059A (en) * | 1979-06-06 | 1980-11-04 | E-Systems, Inc. | Process of defining film patterns on microelectronic substrates by air abrading |
US4283483A (en) * | 1979-07-19 | 1981-08-11 | Hughes Aircraft Company | Process for forming semiconductor devices using electron-sensitive resist patterns with controlled line profiles |
US4341850A (en) * | 1979-07-19 | 1982-07-27 | Hughes Aircraft Company | Mask structure for forming semiconductor devices, comprising electron-sensitive resist patterns with controlled line profiles |
EP0031463B1 (de) * | 1979-12-26 | 1984-06-13 | International Business Machines Corporation | Verfahren zum musterförmigen Anbringen eines Materials auf einem Substrat und Verwendung dieses Verfahrens zur Herstellung einer gemusterten Maskenstruktur auf einem Halbleitersubstrat |
US4307179A (en) * | 1980-07-03 | 1981-12-22 | International Business Machines Corporation | Planar metal interconnection system and process |
US4335506A (en) * | 1980-08-04 | 1982-06-22 | International Business Machines Corporation | Method of forming aluminum/copper alloy conductors |
US4346125A (en) * | 1980-12-08 | 1982-08-24 | Bell Telephone Laboratories, Incorporated | Removing hardened organic materials during fabrication of integrated circuits using anhydrous hydrazine solvent |
CA1200624A (en) * | 1981-08-10 | 1986-02-11 | Susumu Muramoto | Method for the manufacture of semiconductor device using refractory metal in a lift-off step |
US4362598A (en) * | 1981-10-26 | 1982-12-07 | General Electric Company | Method of patterning a thick resist layer of polymeric plastic |
US4396458A (en) * | 1981-12-21 | 1983-08-02 | International Business Machines Corporation | Method for forming planar metal/insulator structures |
US4493855A (en) * | 1982-12-23 | 1985-01-15 | International Business Machines Corporation | Use of plasma polymerized organosilicon films in fabrication of lift-off masks |
US4562091A (en) * | 1982-12-23 | 1985-12-31 | International Business Machines Corporation | Use of plasma polymerized orgaosilicon films in fabrication of lift-off masks |
US4497684A (en) * | 1983-02-22 | 1985-02-05 | Amdahl Corporation | Lift-off process for depositing metal on a substrate |
US4606931A (en) * | 1983-06-27 | 1986-08-19 | International Business Machines Corporation | Lift-off masking method |
US4939071A (en) * | 1984-03-06 | 1990-07-03 | Harris Corporation | Method for forming low resistance, sub-micrometer semiconductor gate structures |
JPS60262150A (ja) * | 1984-06-11 | 1985-12-25 | Nippon Telegr & Teleph Corp <Ntt> | 三層レジスト用中間層材料及びそれを用いた三層レジストパタン形成方法 |
EP0185998A1 (de) * | 1984-12-14 | 1986-07-02 | Dynamics Research Corporation | Herstellung von Zwischenverbindungsschaltungen durch Übertragungsverformung |
US4662989A (en) * | 1985-10-04 | 1987-05-05 | Honeywell Inc. | High efficiency metal lift-off process |
US4912018A (en) * | 1986-02-24 | 1990-03-27 | Hoechst Celanese Corporation | High resolution photoresist based on imide containing polymers |
US4689113A (en) * | 1986-03-21 | 1987-08-25 | International Business Machines Corporation | Process for forming planar chip-level wiring |
EP0394597A1 (de) * | 1989-04-28 | 1990-10-31 | International Business Machines Corporation | System zum Verfolgen eines Ätzprozesses in einer RIE-Vorrichtung und dessen Verwendung zur Herstellung reproduzierbarer Strukturen hoher Auflösung |
US5223914A (en) * | 1989-04-28 | 1993-06-29 | International Business Machines Corporation | Follow-up system for etch process monitoring |
US5234539A (en) * | 1990-02-23 | 1993-08-10 | France Telecom (C.N.E.T.) | Mechanical lift-off process of a metal layer on a polymer |
US5059500A (en) * | 1990-10-10 | 1991-10-22 | Polaroid Corporation | Process for forming a color filter |
US5140396A (en) * | 1990-10-10 | 1992-08-18 | Polaroid Corporation | Filter and solid state imager incorporating this filter |
JP2939946B2 (ja) * | 1990-12-27 | 1999-08-25 | ジェイエスアール株式会社 | 微細レジストパターンの形成方法 |
JPH05114577A (ja) * | 1991-04-09 | 1993-05-07 | Sgs Thomson Microelectron Inc | 独特のエツチング形成したスロープを有するサブミクロンコンタクトの製造方法 |
US5227280A (en) * | 1991-09-04 | 1993-07-13 | International Business Machines Corporation | Resists with enhanced sensitivity and contrast |
KR940010562B1 (ko) * | 1991-09-06 | 1994-10-24 | 손병기 | Ta_2O_5수소이온 감지막을 갖는 감이온 전계효과 트랜지스터의 제조방법 |
DE4303923A1 (de) * | 1993-02-10 | 1994-08-11 | Microparts Gmbh | Verfahren zum Beseitigen von Kunststoffen aus Mikrostrukturen |
US5426071A (en) * | 1994-03-04 | 1995-06-20 | E. I. Du Pont De Nemours And Company | Polyimide copolymer film for lift-off metallization |
US5667920A (en) * | 1996-03-11 | 1997-09-16 | Polaroid Corporation | Process for preparing a color filter |
US6303488B1 (en) | 1997-02-12 | 2001-10-16 | Micron Technology, Inc. | Semiconductor processing methods of forming openings to devices and substrates, exposing material from which photoresist cannot be substantially selectively removed |
US6495468B2 (en) | 1998-12-22 | 2002-12-17 | Micron Technology, Inc. | Laser ablative removal of photoresist |
JP2003502449A (ja) * | 1999-06-10 | 2003-01-21 | ハネウエル・インターナシヨナル・インコーポレーテツド | フォトリソグラフィ用スピンオンガラス反射防止コーティング |
SE516194C2 (sv) * | 2000-04-18 | 2001-12-03 | Obducat Ab | Substrat för samt process vid tillverkning av strukturer |
US6368400B1 (en) * | 2000-07-17 | 2002-04-09 | Honeywell International | Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography |
US6946238B2 (en) * | 2001-06-29 | 2005-09-20 | 3M Innovative Properties Company | Process for fabrication of optical waveguides |
US7205228B2 (en) * | 2003-06-03 | 2007-04-17 | Applied Materials, Inc. | Selective metal encapsulation schemes |
US8053159B2 (en) | 2003-11-18 | 2011-11-08 | Honeywell International Inc. | Antireflective coatings for via fill and photolithography applications and methods of preparation thereof |
US20070207406A1 (en) * | 2004-04-29 | 2007-09-06 | Guerrero Douglas J | Anti-reflective coatings using vinyl ether crosslinkers |
US20050255410A1 (en) | 2004-04-29 | 2005-11-17 | Guerrero Douglas J | Anti-reflective coatings using vinyl ether crosslinkers |
US20070134943A2 (en) * | 2006-04-02 | 2007-06-14 | Dunnrowicz Clarence J | Subtractive - Additive Edge Defined Lithography |
US7914974B2 (en) | 2006-08-18 | 2011-03-29 | Brewer Science Inc. | Anti-reflective imaging layer for multiple patterning process |
DE102007006640A1 (de) * | 2007-02-06 | 2008-08-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Aufbringen einer Struktur auf ein Halbleiterbauelement |
US8642246B2 (en) * | 2007-02-26 | 2014-02-04 | Honeywell International Inc. | Compositions, coatings and films for tri-layer patterning applications and methods of preparation thereof |
CN101971102B (zh) * | 2008-01-29 | 2012-12-12 | 布鲁尔科技公司 | 用来通过多次暗视场曝光对硬掩模进行图案化的在线法 |
US9640396B2 (en) * | 2009-01-07 | 2017-05-02 | Brewer Science Inc. | Spin-on spacer materials for double- and triple-patterning lithography |
CN101900936A (zh) * | 2009-05-26 | 2010-12-01 | 鸿富锦精密工业(深圳)有限公司 | 压印模具及其制作方法 |
US8557877B2 (en) | 2009-06-10 | 2013-10-15 | Honeywell International Inc. | Anti-reflective coatings for optically transparent substrates |
DE102009034532A1 (de) | 2009-07-23 | 2011-02-03 | Msg Lithoglas Ag | Verfahren zum Herstellen einer strukturierten Beschichtung auf einem Substrat, beschichtetes Substrat sowie Halbzeug mit einem beschichteten Substrat |
KR101437924B1 (ko) * | 2010-01-22 | 2014-09-11 | 한국생명공학연구원 | 경사 증착을 이용한 리소그래피 방법 |
US8864898B2 (en) | 2011-05-31 | 2014-10-21 | Honeywell International Inc. | Coating formulations for optical elements |
US20140093688A1 (en) * | 2012-09-28 | 2014-04-03 | Yindar Chuo | Method for fabrication of nano-structures |
JP6803842B2 (ja) | 2015-04-13 | 2020-12-23 | ハネウェル・インターナショナル・インコーポレーテッドHoneywell International Inc. | オプトエレクトロニクス用途のためのポリシロキサン製剤及びコーティング |
CN104878355B (zh) * | 2015-04-30 | 2017-04-05 | 北京空间飞行器总体设计部 | 一种基于磁控溅射工艺的纳米介质层制备方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1230421A (de) * | 1967-09-15 | 1971-05-05 | ||
US3849136A (en) * | 1973-07-31 | 1974-11-19 | Ibm | Masking of deposited thin films by use of a masking layer photoresist composite |
-
1973
- 1973-11-29 US US420034A patent/US3873361A/en not_active Expired - Lifetime
-
1974
- 1974-09-25 FR FR7433130A patent/FR2253278B1/fr not_active Expired
- 1974-10-11 DE DE2448535A patent/DE2448535C2/de not_active Expired
- 1974-10-16 CA CA211,474A patent/CA1032396A/en not_active Expired
- 1974-10-16 JP JP11830874A patent/JPS5231714B2/ja not_active Expired
- 1974-10-25 IT IT28780/74A patent/IT1025189B/it active
- 1974-11-06 GB GB4793674A patent/GB1450508A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
IT1025189B (it) | 1978-08-10 |
DE2448535A1 (de) | 1975-06-05 |
DE2448535C2 (de) | 1982-08-12 |
FR2253278A1 (de) | 1975-06-27 |
FR2253278B1 (de) | 1979-06-01 |
US3873361A (en) | 1975-03-25 |
GB1450508A (en) | 1976-09-22 |
JPS5231714B2 (de) | 1977-08-16 |
JPS5086984A (de) | 1975-07-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA1032396A (en) | Method of depositing thin film utilizing a lift-off mask | |
CA1018475A (en) | Method and apparatus for thin film deposition on a substrate | |
CA1035255A (en) | Thin film coating apparatus | |
CA1016496A (en) | Thin film deposition apparatus using segmented target means | |
CA1000651A (en) | Method and apparatus for depositing film on a substrate | |
CA1027895A (en) | Method for coating a substrate | |
CA1008187A (en) | Method of making a monocharge electret | |
JPS52132688A (en) | Method of forming flat thin film | |
AU466665B2 (en) | Photoresist film | |
CA1005574A (en) | Thin film magnetic transducer | |
CA975628A (en) | Method for controlling the composition of a deposited film | |
CA998438A (en) | Method of static trimming of film deposited resistors | |
JPS5311576A (en) | Method of forming thin film by vapourrgrowth | |
CA1022438A (en) | Method of epitaxially depositing a semiconductor material on a substrate | |
CA964383A (en) | Method of selectively depositing a metal on a surface | |
CA1013599A (en) | Multiple thin film light polarisers | |
CA1005262A (en) | Method of forming a strip having substantially differing thicknesses | |
JPS5285033A (en) | Method of forming thin film structure | |
CA1032397A (en) | Method of manufacturing a device | |
AU5267673A (en) | Method of operating a telecommunication system | |
CA863805A (en) | Method of casting a film | |
AU493509B2 (en) | Film coating process | |
AU485610B2 (en) | Masking films | |
CA1017430A (en) | Method of positioning a substrate with respect to a reference axis | |
JPS51119762A (en) | Method of forming thin polymer film |