CA1020900A - Electrodeposition of copper - Google Patents

Electrodeposition of copper

Info

Publication number
CA1020900A
CA1020900A CA188,095A CA188095A CA1020900A CA 1020900 A CA1020900 A CA 1020900A CA 188095 A CA188095 A CA 188095A CA 1020900 A CA1020900 A CA 1020900A
Authority
CA
Canada
Prior art keywords
electrodeposition
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA188,095A
Other languages
English (en)
Inventor
Silvester P. Valayil
Otto Kardos
Donald A. Arcilesi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
M&T Chemicals Inc
Original Assignee
M&T Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M&T Chemicals Inc filed Critical M&T Chemicals Inc
Application granted granted Critical
Publication of CA1020900A publication Critical patent/CA1020900A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CA188,095A 1972-12-14 1973-12-13 Electrodeposition of copper Expired CA1020900A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US31511272A 1972-12-14 1972-12-14

Publications (1)

Publication Number Publication Date
CA1020900A true CA1020900A (en) 1977-11-15

Family

ID=23222945

Family Applications (1)

Application Number Title Priority Date Filing Date
CA188,095A Expired CA1020900A (en) 1972-12-14 1973-12-13 Electrodeposition of copper

Country Status (11)

Country Link
JP (1) JPS5727190B2 (xx)
BE (1) BE808564A (xx)
CA (1) CA1020900A (xx)
CS (1) CS191224B2 (xx)
DE (1) DE2360892A1 (xx)
FR (1) FR2210673B1 (xx)
GB (1) GB1433040A (xx)
IT (1) IT1000992B (xx)
NL (1) NL7317204A (xx)
PL (1) PL94267B1 (xx)
ZA (1) ZA739310B (xx)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5791594A (en) * 1980-11-29 1982-06-07 Anritsu Electric Co Ltd Method of plating through hole with copper
JPS641687A (en) * 1987-03-28 1989-01-06 Toshiji Shimokawa Water discharging device for vessel
JPS6482598A (en) * 1987-09-24 1989-03-28 Fujitsu Ltd Copper plating method for printed board
GB8801827D0 (en) * 1988-01-27 1988-02-24 Jct Controls Ltd Improvements in electrochemical processes
DE10100954A1 (de) * 2001-01-11 2002-07-18 Raschig Gmbh Verwendung von Polyolefinen mit basischen, aromatischen Substituenten als Hilfsmittel zur elektrolytischen Abscheidung von metallischen Schichten
US8002962B2 (en) 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
PL2620529T3 (pl) * 2012-01-25 2014-09-30 Atotech Deutschland Gmbh Sposób wytwarzania matowych warstw miedzianych
CN116348636A (zh) 2021-10-26 2023-06-27 宁德时代新能源科技股份有限公司 一种镀铜镀液及由其制备的负极复合集流体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
US3542655A (en) * 1968-04-29 1970-11-24 M & T Chemicals Inc Electrodeposition of copper
ZA708430B (en) * 1970-02-12 1971-09-29 Udylite Corp Electrodeposition of copper from acidic baths
US3682788A (en) * 1970-07-28 1972-08-08 M & T Chemicals Inc Copper electroplating

Also Published As

Publication number Publication date
GB1433040A (en) 1976-04-22
CS191224B2 (en) 1979-06-29
JPS49135832A (xx) 1974-12-27
ZA739310B (en) 1974-11-27
FR2210673B1 (xx) 1977-08-19
NL7317204A (xx) 1974-06-18
JPS5727190B2 (xx) 1982-06-09
PL94267B1 (xx) 1977-07-30
BE808564A (fr) 1974-03-29
DE2360892A1 (de) 1974-06-20
FR2210673A1 (xx) 1974-07-12
IT1000992B (it) 1976-04-10
AU6354273A (en) 1975-06-12

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