CA1020494A - Method of manufacturing etched patterns - Google Patents

Method of manufacturing etched patterns

Info

Publication number
CA1020494A
CA1020494A CA182,588A CA182588A CA1020494A CA 1020494 A CA1020494 A CA 1020494A CA 182588 A CA182588 A CA 182588A CA 1020494 A CA1020494 A CA 1020494A
Authority
CA
Canada
Prior art keywords
etched patterns
manufacturing etched
manufacturing
patterns
etched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA182,588A
Other languages
English (en)
French (fr)
Other versions
CA182588S (en
Inventor
Theodorus C.J.M. Bertens
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of CA1020494A publication Critical patent/CA1020494A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0335—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by their behaviour during the process, e.g. soluble masks, redeposited masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CA182,588A 1972-10-07 1973-10-03 Method of manufacturing etched patterns Expired CA1020494A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7213625A NL7213625A (xx) 1972-10-07 1972-10-07

Publications (1)

Publication Number Publication Date
CA1020494A true CA1020494A (en) 1977-11-08

Family

ID=19817096

Family Applications (1)

Application Number Title Priority Date Filing Date
CA182,588A Expired CA1020494A (en) 1972-10-07 1973-10-03 Method of manufacturing etched patterns

Country Status (7)

Country Link
US (1) US3919066A (xx)
JP (1) JPS5232954B2 (xx)
CA (1) CA1020494A (xx)
FR (1) FR2202369B2 (xx)
GB (1) GB1440349A (xx)
IT (1) IT1055539B (xx)
NL (1) NL7213625A (xx)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4057831A (en) * 1972-09-05 1977-11-08 U.S. Philips Corporation Video record disc manufactured by a process involving chemical or sputter etching
DE2547792C3 (de) * 1974-10-25 1978-08-31 Hitachi, Ltd., Tokio Verfahren zur Herstellung eines Halbleiterbauelementes
JPS5210080A (en) * 1975-07-15 1977-01-26 Nippon Telegr & Teleph Corp <Ntt> Method for manufacturing semiconductor device
NL7607298A (nl) * 1976-07-02 1978-01-04 Philips Nv Werkwijze voor het vervaardigen van een inrichting en inrichting vervaardigd volgens de werkwijze.
JPS5381110A (en) * 1976-12-25 1978-07-18 Toshiba Corp Manufacture of magnetic film head
JPS5539646A (en) * 1978-09-12 1980-03-19 Nec Corp Ion taper etching
US4534826A (en) * 1983-12-29 1985-08-13 Ibm Corporation Trench etch process for dielectric isolation

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2117199C3 (de) * 1971-04-08 1974-08-22 Philips Patentverwaltung Gmbh, 2000 Hamburg Verfahren zur Herstellung geätzter Muster in dünnen Schichten mit definierten Kantenprofilen
US3723277A (en) * 1971-07-14 1973-03-27 Molekularelektronik Method for the production of masks in the manufacture of semiconductor components

Also Published As

Publication number Publication date
AU6103973A (en) 1975-04-10
DE2348779A1 (de) 1974-04-11
US3919066A (en) 1975-11-11
GB1440349A (en) 1976-06-23
DE2348779B2 (de) 1976-05-26
NL7213625A (xx) 1974-04-09
IT1055539B (it) 1982-01-11
JPS4974483A (xx) 1974-07-18
JPS5232954B2 (xx) 1977-08-25
FR2202369B2 (xx) 1976-10-01
FR2202369A2 (xx) 1974-05-03

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