IT1055539B - Procedimento per la produzione di disegvi mediante incisione a polve rizzazione catodica - Google Patents
Procedimento per la produzione di disegvi mediante incisione a polve rizzazione catodicaInfo
- Publication number
- IT1055539B IT1055539B IT69925/73A IT6992573A IT1055539B IT 1055539 B IT1055539 B IT 1055539B IT 69925/73 A IT69925/73 A IT 69925/73A IT 6992573 A IT6992573 A IT 6992573A IT 1055539 B IT1055539 B IT 1055539B
- Authority
- IT
- Italy
- Prior art keywords
- rization
- cathodic
- engraving
- powder
- procedure
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
- H10P76/408—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes
- H10P76/4083—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes characterised by their behaviours during the lithography processes, e.g. soluble masks or redeposited masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7213625A NL7213625A (it) | 1972-10-07 | 1972-10-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT1055539B true IT1055539B (it) | 1982-01-11 |
Family
ID=19817096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT69925/73A IT1055539B (it) | 1972-10-07 | 1973-10-04 | Procedimento per la produzione di disegvi mediante incisione a polve rizzazione catodica |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3919066A (it) |
| JP (1) | JPS5232954B2 (it) |
| CA (1) | CA1020494A (it) |
| FR (1) | FR2202369B2 (it) |
| GB (1) | GB1440349A (it) |
| IT (1) | IT1055539B (it) |
| NL (1) | NL7213625A (it) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4057831A (en) * | 1972-09-05 | 1977-11-08 | U.S. Philips Corporation | Video record disc manufactured by a process involving chemical or sputter etching |
| DE2547792C3 (de) * | 1974-10-25 | 1978-08-31 | Hitachi, Ltd., Tokio | Verfahren zur Herstellung eines Halbleiterbauelementes |
| JPS5210080A (en) * | 1975-07-15 | 1977-01-26 | Nippon Telegr & Teleph Corp <Ntt> | Method for manufacturing semiconductor device |
| NL7607298A (nl) * | 1976-07-02 | 1978-01-04 | Philips Nv | Werkwijze voor het vervaardigen van een inrichting en inrichting vervaardigd volgens de werkwijze. |
| JPS5381110A (en) * | 1976-12-25 | 1978-07-18 | Toshiba Corp | Manufacture of magnetic film head |
| JPS5539646A (en) * | 1978-09-12 | 1980-03-19 | Nec Corp | Ion taper etching |
| US4534826A (en) * | 1983-12-29 | 1985-08-13 | Ibm Corporation | Trench etch process for dielectric isolation |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2117199C3 (de) * | 1971-04-08 | 1974-08-22 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Verfahren zur Herstellung geätzter Muster in dünnen Schichten mit definierten Kantenprofilen |
| US3723277A (en) * | 1971-07-14 | 1973-03-27 | Molekularelektronik | Method for the production of masks in the manufacture of semiconductor components |
-
1972
- 1972-10-07 NL NL7213625A patent/NL7213625A/xx unknown
-
1973
- 1973-09-26 US US400879A patent/US3919066A/en not_active Expired - Lifetime
- 1973-10-03 CA CA182,588A patent/CA1020494A/en not_active Expired
- 1973-10-04 GB GB4637673A patent/GB1440349A/en not_active Expired
- 1973-10-04 FR FR7335435A patent/FR2202369B2/fr not_active Expired
- 1973-10-04 IT IT69925/73A patent/IT1055539B/it active
- 1973-10-08 JP JP48112424A patent/JPS5232954B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2202369B2 (it) | 1976-10-01 |
| CA1020494A (en) | 1977-11-08 |
| AU6103973A (en) | 1975-04-10 |
| US3919066A (en) | 1975-11-11 |
| JPS5232954B2 (it) | 1977-08-25 |
| GB1440349A (en) | 1976-06-23 |
| DE2348779A1 (de) | 1974-04-11 |
| JPS4974483A (it) | 1974-07-18 |
| NL7213625A (it) | 1974-04-09 |
| FR2202369A2 (it) | 1974-05-03 |
| DE2348779B2 (de) | 1976-05-26 |
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