CA1002391A - Wave-soldering of printed circuits - Google Patents

Wave-soldering of printed circuits

Info

Publication number
CA1002391A
CA1002391A CA210,934A CA210934A CA1002391A CA 1002391 A CA1002391 A CA 1002391A CA 210934 A CA210934 A CA 210934A CA 1002391 A CA1002391 A CA 1002391A
Authority
CA
Canada
Prior art keywords
soldering
wave
printed circuits
printed
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA210,934A
Other languages
English (en)
Other versions
CA210934S (en
Inventor
Donald A. Elliott
Zoltan Palko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ELECTROVERT Ltd - ELECTROVERT LTEE
Original Assignee
ELECTROVERT Ltd - ELECTROVERT LTEE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ELECTROVERT Ltd - ELECTROVERT LTEE filed Critical ELECTROVERT Ltd - ELECTROVERT LTEE
Priority to CA210,934A priority Critical patent/CA1002391A/en
Priority to DE2455629A priority patent/DE2455629C3/de
Priority to US533199A priority patent/US3921888A/en
Priority to GB22423/75A priority patent/GB1478768A/en
Priority to JP50081024A priority patent/JPS5143345A/ja
Priority to FR7530509A priority patent/FR2287298A1/fr
Application granted granted Critical
Publication of CA1002391A publication Critical patent/CA1002391A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
CA210,934A 1974-10-07 1974-10-07 Wave-soldering of printed circuits Expired CA1002391A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CA210,934A CA1002391A (en) 1974-10-07 1974-10-07 Wave-soldering of printed circuits
DE2455629A DE2455629C3 (de) 1974-10-07 1974-11-25 Verfahren zum Aufbringen einer Lötmittelschicht auf eine Fläche einer gedruckten Schaltungsplatte oder eines ähnlichen Körpers und Anordnung zur Durchführung des Verfahrens
US533199A US3921888A (en) 1974-10-07 1974-12-16 Wave soldering of printed circuits
GB22423/75A GB1478768A (en) 1974-10-07 1975-05-22 Method of and apparatus for applying solder to circuit boards and circuit components
JP50081024A JPS5143345A (en) 1974-10-07 1975-07-02 Handazukehoho oyobi sonosochi
FR7530509A FR2287298A1 (fr) 1974-10-07 1975-10-06 Perfectionnements aux techniques de soudage, en vue notamment de la realisation de circuits imprimes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA210,934A CA1002391A (en) 1974-10-07 1974-10-07 Wave-soldering of printed circuits

Publications (1)

Publication Number Publication Date
CA1002391A true CA1002391A (en) 1976-12-28

Family

ID=4101322

Family Applications (1)

Application Number Title Priority Date Filing Date
CA210,934A Expired CA1002391A (en) 1974-10-07 1974-10-07 Wave-soldering of printed circuits

Country Status (6)

Country Link
US (1) US3921888A (fr)
JP (1) JPS5143345A (fr)
CA (1) CA1002391A (fr)
DE (1) DE2455629C3 (fr)
FR (1) FR2287298A1 (fr)
GB (1) GB1478768A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4886201A (en) * 1988-06-09 1989-12-12 Electrovert Limited Solder wave nozzle construction

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3989180A (en) * 1971-11-10 1976-11-02 Electrovert Manufacturing Company, Limited Wave soldering with supported inclined wave
US4011980A (en) * 1976-03-25 1977-03-15 Western Electric Company, Inc. Flow-over mass soldering
JPS5468973A (en) * 1977-11-11 1979-06-02 Hitachi Ltd Soldering wave former
US4171761A (en) * 1978-03-20 1979-10-23 Rockwell International Corporation Wave solder apparatus
USRE32982E (en) * 1978-04-18 1989-07-11 Hollis Automation, Inc. Mass soldering system
AU539903B2 (en) * 1979-06-01 1984-10-25 Nippon Kokan Kabushiki Kaisha Dip-plating process and apparatus
DE3006431C2 (de) * 1980-02-21 1981-07-02 Philips Patentverwaltung Gmbh, 2000 Hamburg Verfahren zum Anlöten von an Trägerstreifen angeordneten Anschlußstiften an Schaltungsplatten und Tauchlötbad zur Durchführung des Verfahrens
US4447001A (en) * 1980-12-11 1984-05-08 Banner/Technical Devices Company, Inc. Adjustably dimensioned uniformly distributed solder wave apparatus
US4824010A (en) * 1980-12-26 1989-04-25 Matsushita Electric Industrial Co., Ltd. Process and apparatus for soldering printed circuit boards
DE3176527D1 (en) * 1980-12-26 1987-12-17 Matsushita Electric Ind Co Ltd Apparatus for soldering chip type components
JPS6051940B2 (ja) * 1981-06-16 1985-11-16 松下電器産業株式会社 プリント基板半田付装置
US4463891A (en) * 1981-11-18 1984-08-07 Rca Corporation Wave soldering apparatus and method
US4530457A (en) * 1982-01-12 1985-07-23 Electrovert Ltd. Wave-soldering of printed circuit boards
GB2117690B (en) * 1982-04-02 1986-01-08 Zevatron Gmbh Apparatus for soldering workpieces
US4666077A (en) * 1983-02-28 1987-05-19 Electrovert Solder pot for wave soldering machine
US4632291A (en) * 1983-02-28 1986-12-30 Electrovert Ltd. Automatic wave soldering machine
DE3312012A1 (de) * 1983-04-02 1984-10-04 Ernst 6983 Kreuzwertheim Hohnerlein Loetvorrichtung
US4545520A (en) * 1983-08-30 1985-10-08 At&T Technologies, Inc. Method and system for soldering insulation coated parts
EP0147000A1 (fr) * 1983-12-15 1985-07-03 Hollis Automation Inc. Système I à souder par ondes destiné à la fabrication en masse
US4566624A (en) * 1983-12-16 1986-01-28 Hollis Automation, Inc. Mass wave soldering system
JPS62142068A (ja) * 1984-11-07 1987-06-25 ハネウエル・インコ−ポレ−テツド 導体のはんだあげ装置
USRE33197E (en) * 1985-05-03 1990-04-10 Electrover Limited Vibrator wave soldering
US4684056A (en) * 1985-05-03 1987-08-04 Electrovert Limited Vibratory wave soldering
FR2587257A1 (fr) * 1985-09-16 1987-03-20 Outillages Scient Lab Unite de buse pour machine de soudure a la vague
US4891472A (en) * 1987-09-10 1990-01-02 Siemens Aktiengesellschaft Interconnects on a printed circuit board having connecting points for an electronic component with a plurality of terminals
US4802617A (en) * 1988-02-19 1989-02-07 Electrovert Limited Restriction of dross formation in a soldering apparatus
JPH0677815B2 (ja) * 1988-12-06 1994-10-05 権士 近藤 噴流式はんだ槽
US5044542A (en) * 1989-11-22 1991-09-03 Electrovert Ltd. Shield gas wave soldering
US5090651A (en) * 1990-01-31 1992-02-25 Electrovert Ltd. Gas curtain additives and zoned tunnel for soldering
US5228614A (en) * 1990-07-09 1993-07-20 Electrovert Ltd. Solder nozzle with gas knife jet
JPH04172174A (ja) * 1990-10-31 1992-06-19 Yokota Kikai Kk 自動半田付け方法及び装置
US5379943A (en) * 1993-10-19 1995-01-10 Ncr Corporation Hot air circulation apparatus and method for wave soldering machines
US5782400A (en) * 1996-06-28 1998-07-21 Susco Manufacturing Co., Inc. Substrate carrier for a soldering machine
US6168065B1 (en) 1998-02-17 2001-01-02 Soltec B.V. Movable selective debridging apparatus for debridging soldered joints on printed circuit boards
JP3740041B2 (ja) * 2001-08-31 2006-01-25 千住金属工業株式会社 プリント基板の部分はんだ付け方法
US20060186183A1 (en) * 2005-02-18 2006-08-24 Speedline Technologies, Inc. Wave solder nozzle
JP2007073786A (ja) * 2005-09-08 2007-03-22 Tamura Seisakusho Co Ltd はんだ付け方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2993272A (en) * 1958-08-26 1961-07-25 Sylvania Electric Prod Soldering device
US3482755A (en) * 1967-09-25 1969-12-09 Gen Electric Automatic wave soldering machine
US3553824A (en) * 1968-05-09 1971-01-12 Western Electric Co Process for eliminating icicle-like formations on soldered circuit substrates
US3713876A (en) * 1970-04-07 1973-01-30 Western Electric Co Methods of metal coating articles
DE2255240C3 (de) * 1971-11-10 1979-03-15 Electrovert Ltd., Montreal, Quebec (Kanada) Verfahren und Vorrichtung zur Lötung von Leiterplatten

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4886201A (en) * 1988-06-09 1989-12-12 Electrovert Limited Solder wave nozzle construction

Also Published As

Publication number Publication date
US3921888A (en) 1975-11-25
JPS5143345A (en) 1976-04-14
FR2287298A1 (fr) 1976-05-07
DE2455629C3 (de) 1981-04-30
US3921888B1 (fr) 1993-01-12
DE2455629A1 (de) 1976-04-15
DE2455629B2 (de) 1980-08-14
GB1478768A (en) 1977-07-06
JPS5327227B2 (fr) 1978-08-07
FR2287298B1 (fr) 1980-08-08

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