BRPI0921259A2 - conjunto em conformidade com nvis - Google Patents
conjunto em conformidade com nvisInfo
- Publication number
- BRPI0921259A2 BRPI0921259A2 BRPI0921259A BRPI0921259A BRPI0921259A2 BR PI0921259 A2 BRPI0921259 A2 BR PI0921259A2 BR PI0921259 A BRPI0921259 A BR PI0921259A BR PI0921259 A BRPI0921259 A BR PI0921259A BR PI0921259 A2 BRPI0921259 A2 BR PI0921259A2
- Authority
- BR
- Brazil
- Prior art keywords
- nvis
- accordance
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
- G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11222808P | 2008-11-07 | 2008-11-07 | |
| PCT/US2009/063027 WO2010053884A1 (en) | 2008-11-07 | 2009-11-03 | Lighting systems |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0921259A2 true BRPI0921259A2 (pt) | 2018-05-29 |
Family
ID=41611431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0921259A BRPI0921259A2 (pt) | 2008-11-07 | 2009-11-03 | conjunto em conformidade com nvis |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8523372B2 (pt) |
| EP (1) | EP2364509A1 (pt) |
| JP (1) | JP2012508464A (pt) |
| CN (1) | CN102210033A (pt) |
| BR (1) | BRPI0921259A2 (pt) |
| CA (1) | CA2741864C (pt) |
| WO (1) | WO2010053884A1 (pt) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008067402A2 (en) * | 2006-11-28 | 2008-06-05 | Hayward Industries, Inc. | Programmable underwater lighting system |
| TWI385834B (zh) * | 2009-02-06 | 2013-02-11 | Yu Nung Shen | Light emitting diode chip package and manufacturing method thereof |
| US8541793B2 (en) * | 2010-02-04 | 2013-09-24 | Yu-Nung Shen | Light emitting diode device and method for fabricating the same |
| US20110267834A1 (en) | 2010-04-28 | 2011-11-03 | Hayward Industries, Inc. | Underwater Light Having A Sealed Polymer Housing and Method of Manufacture Therefor |
| CN103782200A (zh) * | 2011-09-09 | 2014-05-07 | 欧司朗股份有限公司 | 改进的占用传感器装置 |
| KR20130080613A (ko) * | 2012-01-05 | 2013-07-15 | 금호전기주식회사 | 색필터를 이용한 ｌｅｄ 조명장치 |
| WO2013144964A1 (en) * | 2012-03-31 | 2013-10-03 | Noam Meir | Illumination system and method for backlighting |
| DE102012211217A1 (de) * | 2012-06-28 | 2014-01-02 | Osram Opto Semiconductors Gmbh | Optoelektronische bauelementevorrichtung und verfahren zum herstellen einer optoelektronischen bauelementevorrichtung |
| ES2900654T3 (es) | 2013-03-15 | 2022-03-17 | Hayward Ind Inc | Sistema de control modular de piscina/hidromasaje |
| DE102013103984A1 (de) * | 2013-04-19 | 2014-11-06 | Osram Opto Semiconductors Gmbh | Beleuchtungseinrichtung zur Hinterleuchtung eines Displays oder eines Fernsehers, Display und Fernseher |
| US10642087B2 (en) | 2014-05-23 | 2020-05-05 | Eyesafe, Llc | Light emission reducing compounds for electronic devices |
| US9698315B2 (en) | 2014-10-31 | 2017-07-04 | Nichia Corporation | Light emitting device |
| US11122669B2 (en) | 2016-01-22 | 2021-09-14 | Hayward Industries, Inc. | Systems and methods for providing network connectivity and remote monitoring, optimization, and control of pool/spa equipment |
| US11720085B2 (en) | 2016-01-22 | 2023-08-08 | Hayward Industries, Inc. | Systems and methods for providing network connectivity and remote monitoring, optimization, and control of pool/spa equipment |
| US11810532B2 (en) | 2018-11-28 | 2023-11-07 | Eyesafe Inc. | Systems for monitoring and regulating harmful blue light exposure from digital devices |
| US11592701B2 (en) | 2018-11-28 | 2023-02-28 | Eyesafe Inc. | Backlight unit with emission modification |
| US11168876B2 (en) | 2019-03-06 | 2021-11-09 | Hayward Industries, Inc. | Underwater light having programmable controller and replaceable light-emitting diode (LED) assembly |
| US10971660B2 (en) * | 2019-08-09 | 2021-04-06 | Eyesafe Inc. | White LED light source and method of making same |
| CN111273482A (zh) * | 2020-01-21 | 2020-06-12 | 苏州奥科飞光电科技有限公司 | 一种新型的夜视兼容背光模组 |
| KR102543767B1 (ko) * | 2020-11-26 | 2023-06-16 | 주식회사 사이언 | 야시조명계통용 발광다이오드 |
| CN116951343B (zh) * | 2023-09-19 | 2023-11-24 | 东莞市红富照明科技有限公司 | 一种多光效智能发光装置和智能台灯 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2400817A1 (fr) * | 1977-08-19 | 1979-03-16 | Radiotechnique Compelec | Dispositifs electroluminescents pour affichage au soleil |
| US5140384A (en) | 1990-06-14 | 1992-08-18 | Rohm Co., Ltd. | Semiconductor laser device mounted on a stem |
| JPH07193282A (ja) * | 1993-12-27 | 1995-07-28 | Mitsubishi Materials Corp | 指向性の少ない赤外可視変換発光ダイオード |
| JPH0864860A (ja) * | 1994-08-17 | 1996-03-08 | Mitsubishi Materials Corp | 色純度の高い赤外可視変換青色発光ダイオード |
| JP3374578B2 (ja) * | 1995-03-08 | 2003-02-04 | 日亜化学工業株式会社 | Ｌｅｄ信号灯 |
| US5600181A (en) | 1995-05-24 | 1997-02-04 | Lockheed Martin Corporation | Hermetically sealed high density multi-chip package |
| US5986317A (en) | 1995-09-29 | 1999-11-16 | Infineon Technologies Corporation | Optical semiconductor device having plural encapsulating layers |
| US5777433A (en) | 1996-07-11 | 1998-07-07 | Hewlett-Packard Company | High refractive index package material and a light emitting device encapsulated with such material |
| JP3704941B2 (ja) * | 1998-03-30 | 2005-10-12 | 日亜化学工業株式会社 | 発光装置 |
| US6501091B1 (en) * | 1998-04-01 | 2002-12-31 | Massachusetts Institute Of Technology | Quantum dot white and colored light emitting diodes |
| GB9815271D0 (en) | 1998-07-14 | 1998-09-09 | Cambridge Display Tech Ltd | Particles and devices comprising particles |
| US6521916B2 (en) | 1999-03-15 | 2003-02-18 | Gentex Corporation | Radiation emitter device having an encapsulant with different zones of thermal conductivity |
| JP2003519438A (ja) | 1999-04-27 | 2003-06-17 | シュラムバーガー ホールディングス リミテッド | 放射源 |
| GB0015561D0 (en) * | 2000-06-27 | 2000-08-16 | Oxley Dev Co Ltd | Filter |
| US7040794B2 (en) * | 2001-07-12 | 2006-05-09 | Northrop Grumman Corporation | Programmable multi-color backlight for a liquid crystal display |
| US6870311B2 (en) | 2002-06-07 | 2005-03-22 | Lumileds Lighting U.S., Llc | Light-emitting devices utilizing nanoparticles |
| US6786617B2 (en) * | 2003-01-29 | 2004-09-07 | Cmc Electronique Inc. | Night vision imaging system (NVIS) compliant instrument panel component |
| US7081991B2 (en) * | 2003-03-14 | 2006-07-25 | Rockwell Collins, Inc. | Dye-based filter |
| US7481954B2 (en) * | 2003-03-14 | 2009-01-27 | Rockwell Collins, Inc. | Composition for a light filtering material |
| US6921929B2 (en) | 2003-06-27 | 2005-07-26 | Lockheed Martin Corporation | Light-emitting diode (LED) with amorphous fluoropolymer encapsulant and lens |
| US7183588B2 (en) | 2004-01-08 | 2007-02-27 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light emission device |
| EP1733077B1 (en) | 2004-01-15 | 2018-04-18 | Samsung Electronics Co., Ltd. | Nanocrystal doped matrixes |
| TWI261676B (en) * | 2004-02-16 | 2006-09-11 | Advanced Chip Eng Tech Inc | Structure and method for package burn-in testing |
| FR2870359B1 (fr) * | 2004-05-11 | 2006-09-15 | Thales Sa | Procede de filtrage des sources d'eclairage pour vision de nuit |
| EP1624324B1 (en) * | 2004-08-04 | 2008-05-28 | Agfa HealthCare NV | Device provided with a near infrared absorbing dye filter |
| JP2006140281A (ja) | 2004-11-11 | 2006-06-01 | Stanley Electric Co Ltd | パワーｌｅｄ及びその製造方法 |
| US7192795B2 (en) | 2004-11-18 | 2007-03-20 | 3M Innovative Properties Company | Method of making light emitting device with silicon-containing encapsulant |
| US7798678B2 (en) | 2005-12-30 | 2010-09-21 | 3M Innovative Properties Company | LED with compound encapsulant lens |
| US7829899B2 (en) | 2006-05-03 | 2010-11-09 | Cree, Inc. | Multi-element LED lamp package |
| JP4611937B2 (ja) * | 2006-06-07 | 2011-01-12 | 日亜化学工業株式会社 | 表面実装型発光装置及びその製造方法 |
| CN100428020C (zh) * | 2006-09-05 | 2008-10-22 | 深圳市中电淼浩固体光源有限公司 | 一种使用led光源的具有夜视兼容性的lcd背光系统 |
| US7766529B2 (en) * | 2007-12-14 | 2010-08-03 | Honeywell International Inc. | Light emitting diodes, display systems, and methods of manufacturing light emitting diodes |
-
2009
- 2009-11-03 CA CA2741864A patent/CA2741864C/en active Active
- 2009-11-03 WO PCT/US2009/063027 patent/WO2010053884A1/en active Application Filing
- 2009-11-03 JP JP2011535616A patent/JP2012508464A/ja active Pending
- 2009-11-03 CN CN2009801444863A patent/CN102210033A/zh active Pending
- 2009-11-03 US US12/611,130 patent/US8523372B2/en active Active
- 2009-11-03 EP EP09753277A patent/EP2364509A1/en not_active Withdrawn
- 2009-11-03 BR BRPI0921259A patent/BRPI0921259A2/pt not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| WO2010053884A1 (en) | 2010-05-14 |
| EP2364509A1 (en) | 2011-09-14 |
| US8523372B2 (en) | 2013-09-03 |
| CN102210033A (zh) | 2011-10-05 |
| JP2012508464A (ja) | 2012-04-05 |
| US20100118511A1 (en) | 2010-05-13 |
| CA2741864A1 (en) | 2010-05-14 |
| CA2741864C (en) | 2015-12-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B08F | Application fees: application dismissed [chapter 8.6 patent gazette] | ||
| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2474 DE 05-06-2018 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |