BRPI0900885A2 - composição apresentando adesão aperfeiçoada a substratos porosos - Google Patents
composição apresentando adesão aperfeiçoada a substratos porososInfo
- Publication number
- BRPI0900885A2 BRPI0900885A2 BRPI0900885-3A BRPI0900885A BRPI0900885A2 BR PI0900885 A2 BRPI0900885 A2 BR PI0900885A2 BR PI0900885 A BRPI0900885 A BR PI0900885A BR PI0900885 A2 BRPI0900885 A2 BR PI0900885A2
- Authority
- BR
- Brazil
- Prior art keywords
- substrates
- composition
- improved adhesion
- porous substrates
- composition exhibiting
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/32—Polymers modified by chemical after-treatment
- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
- C08G65/333—Polymers modified by chemical after-treatment with organic compounds containing nitrogen
- C08G65/33348—Polymers modified by chemical after-treatment with organic compounds containing nitrogen containing isocyanate group
- C08G65/33355—Polymers modified by chemical after-treatment with organic compounds containing nitrogen containing isocyanate group cyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/2805—Compounds having only one group containing active hydrogen
- C08G18/288—Compounds containing at least one heteroatom other than oxygen or nitrogen
- C08G18/289—Compounds containing at least one heteroatom other than oxygen or nitrogen containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/71—Monoisocyanates or monoisothiocyanates
- C08G18/718—Monoisocyanates or monoisothiocyanates containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/32—Polymers modified by chemical after-treatment
- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
- C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2190/00—Compositions for sealing or packing joints
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Sealing Material Composition (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
COMPOSIçãO APRESENTANDO ADESãO APERFEIçOADA A SUBSTRATOS POROSOS. A presente invenção refere-se às composições baseadas em polímeros funcionais de silano que são adequados para a união adesiva, selagem e revestimento de substratos porosos, mais particularmente de substratos minerais porosos, e que mesmo após o armazenamento em água garante adesão eficaz da composição ao substrato.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP20080152325 EP2098548B1 (de) | 2008-03-05 | 2008-03-05 | Zusammensetzung mit verbesserter Haftung auf porösen Substraten |
Publications (1)
Publication Number | Publication Date |
---|---|
BRPI0900885A2 true BRPI0900885A2 (pt) | 2009-12-01 |
Family
ID=39666235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0900885-3A BRPI0900885A2 (pt) | 2008-03-05 | 2009-03-04 | composição apresentando adesão aperfeiçoada a substratos porosos |
Country Status (11)
Country | Link |
---|---|
US (1) | US8853341B2 (pt) |
EP (1) | EP2098548B1 (pt) |
JP (1) | JP5254848B2 (pt) |
CN (1) | CN101525484B (pt) |
AT (1) | ATE446332T1 (pt) |
BR (1) | BRPI0900885A2 (pt) |
DE (1) | DE502008000156D1 (pt) |
DK (1) | DK2098548T3 (pt) |
ES (1) | ES2332615T3 (pt) |
NZ (1) | NZ575308A (pt) |
RU (1) | RU2419645C2 (pt) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3066983A (en) * | 1957-02-18 | 1962-12-04 | Brev De Machines Agricoles S E | Coupling and dumping system |
EP2212365B1 (de) * | 2007-11-21 | 2019-03-06 | Sika Technology AG | Feuchtigkeitshärtende zusammensetzung umfassend mindestens zwei silangruppen-aufweisende polymere |
AU2010285732A1 (en) * | 2009-08-17 | 2012-02-16 | Asahi Glass Company, Limited | Curable composition |
WO2011087741A2 (en) * | 2009-12-22 | 2011-07-21 | Henkel Corporation | Moisture cure hot melt adhesives |
WO2013148750A1 (en) * | 2012-03-29 | 2013-10-03 | The Armor All/Stp Products Company | Product for treating vehicle surfaces |
JP2014022669A (ja) * | 2012-07-20 | 2014-02-03 | Shin Etsu Chem Co Ltd | プライマー組成物及びそれを用いた光半導体装置 |
US9365751B2 (en) | 2012-07-24 | 2016-06-14 | Henkel IP & Holding GmbH | Reactive hot melt adhesive |
EP2789636A1 (de) * | 2013-04-10 | 2014-10-15 | Sika Technology AG | Primerlose Haftung von Kleb- und Dichtstoffen auf Basis von silanfunktionellen Polymeren |
EP2930197A1 (de) * | 2014-04-10 | 2015-10-14 | Sika Technology AG | Silanterminierter klebstoff zum verfugen von fugen in der marine |
HUE034176T2 (en) * | 2015-03-09 | 2018-02-28 | SWISS KRONO Tec AG | A binder composition and application in wood-based sheets |
DE102016200704A1 (de) * | 2016-01-20 | 2017-07-20 | Bona Gmbh Deutschland | Verfahren zur Erhöhung der Anwendungssicherheit und der Alterungsbeständigkeit von Klebstoffen und anderen Produkten, enthaltend silanfunktionalisierte Präpolymere |
MX2019000424A (es) * | 2016-07-19 | 2019-03-28 | Evonik Degussa Gmbh | Uso de poliolesteres para la produccion de revestimientos plasticos porosos. |
US20200071512A1 (en) * | 2017-03-29 | 2020-03-05 | Sika Technology Ag | Water-based composition having improved mechanical properties |
US11479676B2 (en) * | 2017-05-09 | 2022-10-25 | Sika Technology Ag | Aqueous pretreatment for bonded joints with increased heat stability |
EP4058517A4 (en) * | 2019-11-15 | 2023-08-16 | Dow Global Technologies LLC | CURABLE COMPOSITION AND METHOD OF APPLICATION |
EP4259679A1 (en) | 2020-12-14 | 2023-10-18 | Sika Technology AG | Liquid applied membrane with improved intercoat adhesion |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3971751A (en) | 1975-06-09 | 1976-07-27 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Vulcanizable silylether terminated polymer |
JPS5852350A (ja) * | 1981-09-21 | 1983-03-28 | Toray Silicone Co Ltd | プライマ−組成物 |
JPS61177402A (ja) | 1985-02-01 | 1986-08-09 | Power Reactor & Nuclear Fuel Dev Corp | 石英ガラス系光伝送体 |
JPH07113086B2 (ja) | 1988-06-02 | 1995-12-06 | 東レ・ダウコーニング・シリコーン株式会社 | 室温硬化性オルガノポリシロキサン組成物 |
US4906719A (en) * | 1988-11-28 | 1990-03-06 | Dow Corning Corporation | Silicone sealants having reduced color |
US5537555A (en) | 1993-03-22 | 1996-07-16 | Compaq Computer Corporation | Fully pipelined and highly concurrent memory controller |
US6191247B1 (en) * | 1996-04-10 | 2001-02-20 | The Yokohama Rubber Co., Ltd. | Polysiloxane composition having superior storage stability and rubber composition containing same |
EP0915753B1 (en) | 1996-05-06 | 2003-01-29 | Ameron International Corporation | Siloxane-modified adhesive/adherend systems |
EP1396513B1 (en) | 1997-04-21 | 2005-09-07 | Asahi Glass Company, Limited | Room temperature-setting composition |
US6602964B2 (en) * | 1998-04-17 | 2003-08-05 | Crompton Corporation | Reactive diluent in moisture curable system |
US6649016B2 (en) * | 2002-03-04 | 2003-11-18 | Dow Global Technologies Inc. | Silane functional adhesive composition and method of bonding a window to a substrate without a primer |
WO2005007751A1 (ja) * | 2003-07-18 | 2005-01-27 | Konishi Co., Ltd. | 硬化性樹脂組成物及び常温硬化接着剤 |
ZA200604706B (en) * | 2003-12-10 | 2007-10-31 | Dow Global Technologies Inc | System for bonding glass into a structure |
US7718730B2 (en) * | 2003-12-19 | 2010-05-18 | Bayer Materialscience Llc | Two-component silylated polyurethane adhesive, sealant, and coating compositions |
JP4860112B2 (ja) * | 2004-01-26 | 2012-01-25 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 室温硬化性オルガノポリシロキサン組成物 |
DE102004022150A1 (de) | 2004-05-05 | 2005-12-01 | Henkel Kgaa | Zweikomponenten-Kleb-/ und Dichtstoff |
JP5225581B2 (ja) | 2004-05-07 | 2013-07-03 | 株式会社カネカ | 硬化性と接着性の改善された硬化性組成物 |
WO2007074736A1 (ja) * | 2005-12-26 | 2007-07-05 | Asahi Glass Company, Limited | 硬化性組成物 |
EP1985666B1 (en) * | 2006-02-16 | 2010-12-15 | Kaneka Corporation | Curable composition |
AU2008228842B2 (en) * | 2007-03-21 | 2014-01-16 | Avery Dennison Corporation | Pressure sensitive adhesives |
-
2008
- 2008-03-05 DK DK08152325T patent/DK2098548T3/da active
- 2008-03-05 ES ES08152325T patent/ES2332615T3/es active Active
- 2008-03-05 DE DE200850000156 patent/DE502008000156D1/de active Active
- 2008-03-05 AT AT08152325T patent/ATE446332T1/de active
- 2008-03-05 EP EP20080152325 patent/EP2098548B1/de active Active
-
2009
- 2009-01-06 US US12/318,692 patent/US8853341B2/en not_active Expired - Fee Related
- 2009-03-02 CN CN2009100046235A patent/CN101525484B/zh active Active
- 2009-03-04 BR BRPI0900885-3A patent/BRPI0900885A2/pt active Search and Examination
- 2009-03-04 RU RU2009107793A patent/RU2419645C2/ru not_active IP Right Cessation
- 2009-03-04 NZ NZ575308A patent/NZ575308A/en not_active IP Right Cessation
- 2009-03-04 JP JP2009051177A patent/JP5254848B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
RU2009107793A (ru) | 2010-09-10 |
DE502008000156D1 (de) | 2009-12-03 |
RU2419645C2 (ru) | 2011-05-27 |
EP2098548A1 (de) | 2009-09-09 |
CN101525484A (zh) | 2009-09-09 |
ES2332615T3 (es) | 2010-02-09 |
NZ575308A (en) | 2010-06-25 |
US8853341B2 (en) | 2014-10-07 |
EP2098548B1 (de) | 2009-10-21 |
ATE446332T1 (de) | 2009-11-15 |
DK2098548T3 (da) | 2009-12-07 |
US20090226740A1 (en) | 2009-09-10 |
CN101525484B (zh) | 2011-08-10 |
JP2009209371A (ja) | 2009-09-17 |
JP5254848B2 (ja) | 2013-08-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B03A | Publication of a patent application or of a certificate of addition of invention [chapter 3.1 patent gazette] | ||
B06F | Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette] | ||
B06T | Formal requirements before examination [chapter 6.20 patent gazette] | ||
B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B11D | Dismissal acc. art. 38, par 2 of ipl - failure to pay fee after grant in time |