BRPI0614969A2 - composição e método para acondicionamento a nível de matriz de microeletrônicos - Google Patents
composição e método para acondicionamento a nível de matriz de microeletrônicosInfo
- Publication number
- BRPI0614969A2 BRPI0614969A2 BRPI0614969A BRPI0614969A BRPI0614969A2 BR PI0614969 A2 BRPI0614969 A2 BR PI0614969A2 BR PI0614969 A BRPI0614969 A BR PI0614969A BR PI0614969 A BRPI0614969 A BR PI0614969A BR PI0614969 A2 BRPI0614969 A2 BR PI0614969A2
- Authority
- BR
- Brazil
- Prior art keywords
- composition
- matrix level
- level conditioning
- microelectronic
- microelectronic matrix
- Prior art date
Links
- 230000003750 conditioning effect Effects 0.000 title 1
- 239000011159 matrix material Substances 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000004377 microelectronic Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US71158305P | 2005-08-26 | 2005-08-26 | |
PCT/US2006/033234 WO2007025134A2 (en) | 2005-08-26 | 2006-08-25 | Thermally conductive thermoplastics for die-level packaging of microelectronics |
Publications (1)
Publication Number | Publication Date |
---|---|
BRPI0614969A2 true BRPI0614969A2 (pt) | 2016-09-13 |
Family
ID=37772437
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0614969A BRPI0614969A2 (pt) | 2005-08-26 | 2006-08-25 | composição e método para acondicionamento a nível de matriz de microeletrônicos |
Country Status (11)
Country | Link |
---|---|
US (1) | US20070045823A1 (pt) |
EP (1) | EP1925026A2 (pt) |
JP (1) | JP2009510716A (pt) |
KR (1) | KR20080044304A (pt) |
CN (1) | CN101496163A (pt) |
AU (1) | AU2006282935A1 (pt) |
BR (1) | BRPI0614969A2 (pt) |
CA (1) | CA2620851A1 (pt) |
MX (1) | MX2008002663A (pt) |
TW (1) | TW200717752A (pt) |
WO (1) | WO2007025134A2 (pt) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080153959A1 (en) * | 2006-12-20 | 2008-06-26 | General Electric Company | Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof |
JP5525682B2 (ja) * | 2007-05-15 | 2014-06-18 | 出光ライオンコンポジット株式会社 | ポリアリーレンサルファイド樹脂組成物及びそれからなる成形品 |
JP2009010081A (ja) * | 2007-06-27 | 2009-01-15 | Mac Eight Co Ltd | 発光ダイオード用ソケット |
US8127445B2 (en) * | 2008-04-03 | 2012-03-06 | E. I. Du Pont De Nemours And Company | Method for integrating heat transfer members, and an LED device |
DE102008040466A1 (de) * | 2008-07-16 | 2010-01-21 | Robert Bosch Gmbh | Leistungselektronikeinrichtung |
US8299159B2 (en) * | 2009-08-17 | 2012-10-30 | Laird Technologies, Inc. | Highly thermally-conductive moldable thermoplastic composites and compositions |
JP5391003B2 (ja) * | 2009-09-09 | 2014-01-15 | 株式会社クラレ | 光反射性回路基板 |
CN102340233B (zh) * | 2010-07-15 | 2014-05-07 | 台达电子工业股份有限公司 | 功率模块 |
US9287765B2 (en) | 2010-07-15 | 2016-03-15 | Delta Electronics, Inc. | Power system, power module therein and method for fabricating power module |
CN102339818B (zh) * | 2010-07-15 | 2014-04-30 | 台达电子工业股份有限公司 | 功率模块及其制造方法 |
FI20106001A0 (fi) * | 2010-09-28 | 2010-09-28 | Kruunutekniikka Oy | Menetelmä sähköisen toimilaitteen valmistukseen |
US8741998B2 (en) | 2011-02-25 | 2014-06-03 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof |
US8552101B2 (en) | 2011-02-25 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
CA2894268C (en) * | 2012-12-20 | 2021-01-05 | Dow Global Technologies Llc | Polymer composite components for wireless-communication towers |
KR101405258B1 (ko) * | 2012-12-20 | 2014-06-10 | 주식회사 삼양사 | 열전도성 및 휨 특성이 우수한 전기 절연성 열가소성 수지 조성물 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4563488A (en) * | 1984-08-20 | 1986-01-07 | Japan Vilene Co. Ltd. | Insulator with high thermal conductivity |
US5194480A (en) * | 1991-05-24 | 1993-03-16 | W. R. Grace & Co.-Conn. | Thermally conductive elastomer |
US5679457A (en) * | 1995-05-19 | 1997-10-21 | The Bergquist Company | Thermally conductive interface for electronic devices |
JP3461651B2 (ja) * | 1996-01-24 | 2003-10-27 | 電気化学工業株式会社 | 六方晶窒化ほう素粉末及びその用途 |
US5681883A (en) * | 1996-03-05 | 1997-10-28 | Advanced Ceramics Corporation | Enhanced boron nitride composition and polymer based high thermal conductivity molding compound |
US5781412A (en) * | 1996-11-22 | 1998-07-14 | Parker-Hannifin Corporation | Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size |
US6160042A (en) * | 1997-05-01 | 2000-12-12 | Edison Polymer Innovation Corporation | Surface treated boron nitride for forming a low viscosity high thermal conductivity polymer based boron nitride composition and method |
US5945470A (en) * | 1997-10-15 | 1999-08-31 | Ali; Mir Akbar | Ceramic-polymer composite material and its use in microelectronics packaging |
US6705388B1 (en) * | 1997-11-10 | 2004-03-16 | Parker-Hannifin Corporation | Non-electrically conductive thermal dissipator for electronic components |
US6162849A (en) * | 1999-01-11 | 2000-12-19 | Ferro Corporation | Thermally conductive thermoplastic |
US6048919A (en) * | 1999-01-29 | 2000-04-11 | Chip Coolers, Inc. | Thermally conductive composite material |
JP2001172398A (ja) * | 1999-12-17 | 2001-06-26 | Polymatech Co Ltd | 熱伝導性成形体およびその製造方法 |
US6649325B1 (en) * | 2001-05-25 | 2003-11-18 | The Bergquist Company | Thermally conductive dielectric mounts for printed circuitry and semi-conductor devices and method of preparation |
US6794435B2 (en) * | 2000-05-18 | 2004-09-21 | Saint Gobain Ceramics & Plastics, Inc. | Agglomerated hexagonal boron nitride powders, method of making, and uses thereof |
US6764975B1 (en) * | 2000-11-28 | 2004-07-20 | Saint-Gobain Ceramics & Plastics, Inc. | Method for making high thermal diffusivity boron nitride powders |
US6645612B2 (en) * | 2001-08-07 | 2003-11-11 | Saint-Gobain Ceramics & Plastics, Inc. | High solids hBN slurry, hBN paste, spherical hBN powder, and methods of making and using them |
US7038009B2 (en) * | 2001-08-31 | 2006-05-02 | Cool Shield, Inc. | Thermally conductive elastomeric pad and method of manufacturing same |
US20030139510A1 (en) * | 2001-11-13 | 2003-07-24 | Sagal E. Mikhail | Polymer compositions having high thermal conductivity and dielectric strength and molded packaging assemblies produced therefrom |
-
2006
- 2006-08-25 BR BRPI0614969A patent/BRPI0614969A2/pt not_active IP Right Cessation
- 2006-08-25 JP JP2008528187A patent/JP2009510716A/ja not_active Withdrawn
- 2006-08-25 KR KR1020087006669A patent/KR20080044304A/ko not_active Application Discontinuation
- 2006-08-25 CN CN200680035815.7A patent/CN101496163A/zh active Pending
- 2006-08-25 CA CA002620851A patent/CA2620851A1/en not_active Abandoned
- 2006-08-25 AU AU2006282935A patent/AU2006282935A1/en not_active Abandoned
- 2006-08-25 EP EP06802326A patent/EP1925026A2/en not_active Withdrawn
- 2006-08-25 MX MX2008002663A patent/MX2008002663A/es unknown
- 2006-08-25 WO PCT/US2006/033234 patent/WO2007025134A2/en active Search and Examination
- 2006-08-25 US US11/467,282 patent/US20070045823A1/en not_active Abandoned
- 2006-08-28 TW TW095131675A patent/TW200717752A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
AU2006282935A1 (en) | 2007-03-01 |
US20070045823A1 (en) | 2007-03-01 |
EP1925026A2 (en) | 2008-05-28 |
CA2620851A1 (en) | 2007-03-01 |
TW200717752A (en) | 2007-05-01 |
KR20080044304A (ko) | 2008-05-20 |
MX2008002663A (es) | 2008-04-04 |
JP2009510716A (ja) | 2009-03-12 |
WO2007025134A2 (en) | 2007-03-01 |
CN101496163A (zh) | 2009-07-29 |
WO2007025134A3 (en) | 2009-04-23 |
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Legal Events
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B06G | Technical and formal requirements: other requirements [chapter 6.7 patent gazette] |
Free format text: SOLICITA-SE A REGULARIZACAO DA PROCURACAO, UMA VEZ QUE BASEADO NO ARTIGO 216 PAR 1O DA LPI, O DOCUMENTO DE PROCURACAO DEVE SER APRESENTADO NO ORIGINAL, TRASLADO OU FOTOCOPIA AUTENTICADA. |
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B11Z | Dismissal: petition dismissal - article 216, par 2 of industrial property law |
Free format text: REFERENTE A PETICAO NO 20080028183/RJ DE 25/02/2008. |
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B11M | Decision cancelled [chapter 11.13 patent gazette] |
Free format text: O DESPACHO 11.6.1 ESTA SENDO ANULADO TENDO POR BASE A DETERMINACAO DO DIRETOR DE PATENTES, A QUAL E CALCADA NO PARECER NO 0003-2014 AGU/PGF/PFE/INPI/COOPHI-LBC-1.0. |
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B06H | Technical and formal requirements: requirement cancelled [chapter 6.8 patent gazette] |
Free format text: O DESPACHO 6.7 ESTA SENDO ANULADO TENDO POR BASE A DETERMINACAO DO DIRETOR DE PATENTES, A QUAL E CALCADA NO PARECER NO 0003-2014 AGU/PGF/PFE/INPI/COOPHI-LBC-1.0. |
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B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE AS 6A, 7A, 8A, 9A E 10A ANUIDADES. |
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B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |