BRPI0511989A - método para produzir um portador de dados portátil - Google Patents

método para produzir um portador de dados portátil

Info

Publication number
BRPI0511989A
BRPI0511989A BRPI0511989-8A BRPI0511989A BRPI0511989A BR PI0511989 A BRPI0511989 A BR PI0511989A BR PI0511989 A BRPI0511989 A BR PI0511989A BR PI0511989 A BRPI0511989 A BR PI0511989A
Authority
BR
Brazil
Prior art keywords
portable data
data bearer
produce
producing
semiconductor circuit
Prior art date
Application number
BRPI0511989-8A
Other languages
English (en)
Inventor
Volker Waschk
Original Assignee
Giesecke & Devrient Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke & Devrient Gmbh filed Critical Giesecke & Devrient Gmbh
Publication of BRPI0511989A publication Critical patent/BRPI0511989A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • B29C45/0055—Shaping
    • B29C2045/0058—Shaping removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Credit Cards Or The Like (AREA)
  • Packaging Frangible Articles (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

MéTODO PARA PRODUZIR UM PORTADOR DE DADOS PORTáTIL. Um método para produzir um portador de dados portátil (100) é proposto, partindo de um portador de filme (10) que tem disposto em seu lado superior (14) um layout de contato (28), e em seu lado inferior (16) um circuito semicondutor (20) conectado ao layout de contato. O portador de filme (10) assim preparado é posto em um molde de injeção (30), onde um processo de moldagem por injeção é executado, no qual um corpo moldado (40) que tem um contorno externo (102) correspondendo a uma especificação padrão para as dimensões externas de um portador de dados portátil é formado no lado inferior(16) ao redor do circuito semicondutor (20).
BRPI0511989-8A 2004-06-09 2005-06-07 método para produzir um portador de dados portátil BRPI0511989A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004028218A DE102004028218B4 (de) 2004-06-09 2004-06-09 Verfahren zur Herstellung eines tragbaren Datenträgers
PCT/EP2005/006104 WO2005122072A1 (de) 2004-06-09 2005-06-07 Verfahren zur herstellung eines tragbaren datenträgers

Publications (1)

Publication Number Publication Date
BRPI0511989A true BRPI0511989A (pt) 2008-01-22

Family

ID=34970220

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0511989-8A BRPI0511989A (pt) 2004-06-09 2005-06-07 método para produzir um portador de dados portátil

Country Status (8)

Country Link
US (1) US8087591B2 (pt)
EP (1) EP1759339B1 (pt)
JP (1) JP5105523B2 (pt)
CN (1) CN1989511B (pt)
BR (1) BRPI0511989A (pt)
DE (1) DE102004028218B4 (pt)
RU (1) RU2382412C2 (pt)
WO (1) WO2005122072A1 (pt)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2221752A1 (en) * 2009-02-19 2010-08-25 Gemalto SA Microprocessor mini-card and its manufacturing process
DE102009023405A1 (de) 2009-05-29 2010-12-02 Giesecke & Devrient Gmbh Verfahren zur Herstellung tragbarer Datenträger
EP2343174A1 (fr) * 2010-01-11 2011-07-13 Gemalto SA Cartes à puce moulées et procédé de fabrication
DE102011100070A1 (de) 2011-04-29 2012-10-31 Giesecke & Devrient Gmbh Verfahren zum optischen Personalisieren von tragbaren Datenträgern
DE102011103281A1 (de) 2011-05-26 2012-11-29 Giesecke & Devrient Gmbh Tragbarer Datenträger zum kontaktbehafteten Datenaustausch mit einem Endgerät
DE102011104510A1 (de) * 2011-06-17 2012-12-20 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Datenträgers
DE102011104508A1 (de) 2011-06-17 2012-12-20 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Datenträgers mit metallfreiem Rand
JP2014534493A (ja) * 2011-09-28 2014-12-18 ジェマルト・テクノロジーズ・アジア・リミテッド 超小型回路が備えられたデータキャリアを製造する方法
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD703208S1 (en) * 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
DE102013010942A1 (de) * 2013-06-28 2015-01-15 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines tragbaren Datenträgers mit Chip
USD776070S1 (en) 2014-03-18 2017-01-10 Sony Corporation Non-contact type data carrier
CN104911877B (zh) * 2014-03-14 2018-12-25 青岛海尔滚筒洗衣机有限公司 一种具有框架的热交换器
JP6132800B2 (ja) 2014-03-31 2017-05-24 サトーホールディングス株式会社 Ｉｃタグ発行装置
JP6124830B2 (ja) * 2014-03-31 2017-05-10 サトーホールディングス株式会社 Ｉｃタグ発行装置及びｉｃタグ発行方法
DE102014217716A1 (de) * 2014-09-04 2016-03-10 Bundesdruckerei Gmbh Datenträger und den Datenträger enthaltender heft- oder buchförmiger Gegenstand sowie Verfahren zum Herstellen des Datenträgers
WO2019045638A1 (en) * 2017-08-28 2019-03-07 Smartflex Technology Pte Ltd INTEGRATED CIRCUIT MODULES AND INTELLIGENT CARDS INCORPORATING THEM

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
US5030407A (en) * 1988-04-28 1991-07-09 Schlumberger Industries Method of making cards having graphics elements thereon
JPH0767874B2 (ja) * 1989-03-31 1995-07-26 リズム時計工業株式会社 Ｉｃカードの製造方法
DE4401588C2 (de) * 1994-01-20 2003-02-20 Gemplus Gmbh Verfahren zum Verkappen eines Chipkarten-Moduls und Chipkarten-Modul
US5675375A (en) * 1994-12-15 1997-10-07 Harris Corporation Home videoconferencing system (HVS)
DE19713641A1 (de) * 1997-04-02 1998-10-08 Ods Gmbh & Co Kg Minichipkarte sowie Verfahren zu ihrer Herstellung
JPH1134553A (ja) * 1997-07-18 1999-02-09 Rohm Co Ltd Ｉｃモジュール、およびその製造方法、ならびにこれを備えたｉｃカード
US6241153B1 (en) * 1998-03-17 2001-06-05 Cardxx, Inc. Method for making tamper-preventing, contact-type, smart cards
US6196459B1 (en) * 1998-05-11 2001-03-06 Ubiq Incorporated Smart card personalization in a multistation environment
DE19858343A1 (de) * 1998-12-17 2000-06-21 Giesecke & Devrient Gmbh Verfahren und Vorrichtung zum Herstellen von personalisierten Chipkarten
DE19908285A1 (de) * 1999-02-26 2000-08-31 Orga Kartensysteme Gmbh Vorrichtung zum Laden einer Chipkarte mit Personalisierungsdaten
FR2794059B1 (fr) * 1999-05-31 2001-08-10 Gemplus Card Int Dispositif portable a circuit integre et procede de fabrication
KR100309161B1 (ko) * 1999-10-11 2001-11-02 윤종용 메모리 카드 및 그 제조방법
EP1104910A1 (de) 1999-11-02 2001-06-06 Infineon Technologies AG Chipkarte und Verfahren zu deren Herstellung
AU2003269337A1 (en) * 2002-10-15 2004-05-04 Axalto Sa Method of manufacturing a data carrier
DE10303740B4 (de) * 2003-01-30 2006-09-14 Infineon Technologies Flash Gmbh & Co. Kg Sicherheitsspeicherkarte und Herstellungsverfahren
US7389920B2 (en) * 2004-02-18 2008-06-24 Honeywell International Inc. Wireless inventory re-ordering system for surface mount technology pick and place assembly machines

Also Published As

Publication number Publication date
CN1989511A (zh) 2007-06-27
RU2382412C2 (ru) 2010-02-20
JP5105523B2 (ja) 2012-12-26
EP1759339A1 (de) 2007-03-07
DE102004028218B4 (de) 2006-06-29
JP2008502059A (ja) 2008-01-24
US20080135625A1 (en) 2008-06-12
WO2005122072A1 (de) 2005-12-22
EP1759339B1 (de) 2016-05-04
US8087591B2 (en) 2012-01-03
DE102004028218A1 (de) 2006-01-05
RU2006145885A (ru) 2008-07-27
CN1989511B (zh) 2010-10-06

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Legal Events

Date Code Title Description
B07A Technical examination (opinion): publication of technical examination (opinion) [chapter 7.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]