BRPI0418408A - conjunto intercalador, e, método para conformar e carregar contatos elásticos metálicos em uma placa isolante. - Google Patents

conjunto intercalador, e, método para conformar e carregar contatos elásticos metálicos em uma placa isolante.

Info

Publication number
BRPI0418408A
BRPI0418408A BRPI0418408-4A BRPI0418408A BRPI0418408A BR PI0418408 A BRPI0418408 A BR PI0418408A BR PI0418408 A BRPI0418408 A BR PI0418408A BR PI0418408 A BRPI0418408 A BR PI0418408A
Authority
BR
Brazil
Prior art keywords
insulating plate
plate
forming
elastic contacts
contacts
Prior art date
Application number
BRPI0418408-4A
Other languages
English (en)
Inventor
Douglas A Neidich
Original Assignee
Amphenol Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amphenol Corp filed Critical Amphenol Corp
Publication of BRPI0418408A publication Critical patent/BRPI0418408A/pt

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2435Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/55Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/7082Coupling device supported only by cooperation with PCB
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

CONJUNTO INTERCALADOR, E, MéTODO PARA CONFORMAR E CARREGAR CONTATOS ELáSTICOS METALìCOS EM UMA PLACA ISOLANTE Um conjunto intercalador inclui uma placa dielétrica que tem uma pluralidade de passagem de contato que se estendem através da placa com um contato em cada passagem. Cada contato é formado de um comprimento de fio metalíco cilíndrico pré-revestido,que tem um pequeno diâmetro. Conjuntos intercaladores com contados formados a partir de contatos de fio de pequeno diâmetro têm indutância de contato reduzida e permitem redução da espessura da placa dielétrica e do espaçamento entre contatos adjacentes na placa.
BRPI0418408-4A 2004-01-16 2004-12-22 conjunto intercalador, e, método para conformar e carregar contatos elásticos metálicos em uma placa isolante. BRPI0418408A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/760,067 US6832917B1 (en) 2004-01-16 2004-01-16 Interposer assembly
PCT/US2004/043366 WO2005072108A2 (en) 2004-01-16 2004-12-22 Interposer assembly

Publications (1)

Publication Number Publication Date
BRPI0418408A true BRPI0418408A (pt) 2007-05-15

Family

ID=33511970

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0418408-4A BRPI0418408A (pt) 2004-01-16 2004-12-22 conjunto intercalador, e, método para conformar e carregar contatos elásticos metálicos em uma placa isolante.

Country Status (9)

Country Link
US (1) US6832917B1 (pt)
EP (1) EP1704622A4 (pt)
JP (1) JP2007518242A (pt)
KR (1) KR101101451B1 (pt)
CN (1) CN100423372C (pt)
BR (1) BRPI0418408A (pt)
CA (1) CA2553083C (pt)
HK (1) HK1098255A1 (pt)
WO (1) WO2005072108A2 (pt)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7402049B2 (en) * 2006-08-24 2008-07-22 Hon Hai Precision Ind. Co., Ltd. Contact for an interposer-type connector array
WO2009091958A1 (en) * 2008-01-17 2009-07-23 Amphenol Corporation Interposer assembly and method
US7775804B2 (en) 2008-04-15 2010-08-17 Amphenol Corporation Interposer assembly with flat contacts
US8780571B2 (en) 2010-07-28 2014-07-15 General Dynamics Advanced Information Systems, Inc. Interposer lead
US8952258B2 (en) * 2012-09-21 2015-02-10 International Business Machines Corporation Implementing graphene interconnect for high conductivity applications
JP6297288B2 (ja) * 2013-09-18 2018-03-20 株式会社ヨコオ スプリングコネクタ
US9425525B2 (en) * 2014-09-22 2016-08-23 Amphenol InterCon Systems, Inc. Interposer assembly and method
KR101921932B1 (ko) * 2016-10-28 2018-11-26 주식회사 오킨스전자 활-타입 범프, 및 이를 포함하는 인터포저
JP7142425B2 (ja) 2017-10-23 2022-09-27 タイコエレクトロニクスジャパン合同会社 インタポーザ組立体
KR102590955B1 (ko) 2019-02-22 2023-10-17 암페놀 인터콘 시스템즈, 아이엔씨. 인터포저 조립체 및 방법
US11394154B1 (en) 2022-03-09 2022-07-19 Jeffrey G. Buchoff Pliant electrical interface connector and its associated method of manufacture

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Publication number Priority date Publication date Assignee Title
DE1439262B2 (de) 1963-07-23 1972-03-30 Siemens AG, 1000 Berlin u. 8000 München Verfahren zum kontaktieren von halbleiterbauelementen durch thermokompression
JPS5295437A (en) * 1976-02-03 1977-08-11 Kayaba Industry Co Ltd Buffer
JPS5448076A (en) * 1977-09-24 1979-04-16 Matsushita Electric Ind Co Ltd Device for inserting wire rod into plateelike body
US4998885A (en) 1989-10-27 1991-03-12 International Business Machines Corporation Elastomeric area array interposer
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US5123848A (en) 1990-07-20 1992-06-23 Cray Research, Inc. Computer signal interconnect apparatus
US5030109A (en) * 1990-08-24 1991-07-09 Amp Incorporated Area array connector for substrates
US5248262A (en) 1992-06-19 1993-09-28 International Business Machines Corporation High density connector
JP2545675B2 (ja) 1992-07-17 1996-10-23 信越ポリマー株式会社 エラスチックコネクタの製造方法
US5371654A (en) 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
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US5385477A (en) 1993-07-30 1995-01-31 Ck Technologies, Inc. Contactor with elastomer encapsulated probes
TW381328B (en) 1994-03-07 2000-02-01 Ibm Dual substrate package assembly for being electrically coupled to a conducting member
JPH07320800A (ja) * 1994-05-18 1995-12-08 Star Micronics Co Ltd 端子及びその製造方法
US6229320B1 (en) 1994-11-18 2001-05-08 Fujitsu Limited IC socket, a test method using the same and an IC socket mounting mechanism
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US6730134B2 (en) * 2001-07-02 2004-05-04 Intercon Systems, Inc. Interposer assembly

Also Published As

Publication number Publication date
EP1704622A4 (en) 2008-02-20
CA2553083A1 (en) 2005-08-11
EP1704622A2 (en) 2006-09-27
CA2553083C (en) 2009-05-12
JP2007518242A (ja) 2007-07-05
WO2005072108A3 (en) 2005-12-15
KR20070019671A (ko) 2007-02-15
US6832917B1 (en) 2004-12-21
WO2005072108A2 (en) 2005-08-11
KR101101451B1 (ko) 2012-01-03
CN100423372C (zh) 2008-10-01
HK1098255A1 (en) 2007-07-13
CN1918748A (zh) 2007-02-21

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Legal Events

Date Code Title Description
B08L Patent application lapsed because of non payment of annual fee [chapter 8.12 patent gazette]

Free format text: REFERENTE AO NAO RECOLHIMENTO DAS 8A E 9A ANUIDADES.

B08I Application fees: publication cancelled [chapter 8.9 patent gazette]

Free format text: ANULADA A PUBLICACAO CODIGO 8.12 NA RPI NO 2259 DE 22/04/2014 POR TER SIDO INDEVIDA.

B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 8A, 9A, 10A, 11A, 12A, 13A, 14A E 15A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2602 DE 17-11-2020 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.