BRPI0416166A - composição, uso de uma composição, e, processo para fabricar um modelo ou protótipo - Google Patents
composição, uso de uma composição, e, processo para fabricar um modelo ou protótipoInfo
- Publication number
- BRPI0416166A BRPI0416166A BRPI0416166-1A BRPI0416166A BRPI0416166A BR PI0416166 A BRPI0416166 A BR PI0416166A BR PI0416166 A BRPI0416166 A BR PI0416166A BR PI0416166 A BRPI0416166 A BR PI0416166A
- Authority
- BR
- Brazil
- Prior art keywords
- filler
- composition
- mixed together
- individual components
- components
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Composite Materials (AREA)
- Dispersion Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Sealing Material Composition (AREA)
- Paints Or Removers (AREA)
- Epoxy Resins (AREA)
Abstract
"COMPOSIçãO, USO DE UMA COMPOSIçãO, E, PROCESSO PARA FABRICAR UM MODELO OU PROTóTIPO". Uma composição reativa de dois componentes é descrita. Cada componente, antes que eles sejam misturados juntos, contém um enchedor tendo estrutura de plaqueta fina, por exemplo, uma nanoargila e um outro enchedor que interage com as plaquetas. Os componentes individuais podem ter uma carga de enchedor que os tornem escoáveis e portanto os componentes podem ser facilmente misturados entre si para dispersão fácil. Quando os componentes são completamente misturados entre si, a resina resultante pode ter uma viscosidade mais alta que a dos componentes individuais. A carga do enchedor é preferivelmente escolhida de modo que a resina misturada combinante é capaz de ser aplicada a uma superfície vertical sem sofrer colapso significante. A viscosidade do material misturado pode ser até 5 a 10 vezes ou mais do que aquela dos componentes individuais antes de misturar. A composição pode ser usada em adesivos, pastas de modelar, revestimentos, selantes, massas de vidraceiro, mástiques, compostos de fechamento, materiais de calafetagem, encapsulantes e revestimentos de superfície, por exemplo, tintas.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03256951 | 2003-11-04 | ||
PCT/EP2004/052765 WO2005042630A2 (en) | 2003-11-04 | 2004-11-03 | Two component curable compositions |
Publications (1)
Publication Number | Publication Date |
---|---|
BRPI0416166A true BRPI0416166A (pt) | 2007-01-09 |
Family
ID=34530806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0416166-1A BRPI0416166A (pt) | 2003-11-04 | 2004-11-03 | composição, uso de uma composição, e, processo para fabricar um modelo ou protótipo |
Country Status (7)
Country | Link |
---|---|
US (2) | US8026307B2 (pt) |
EP (1) | EP1682608A2 (pt) |
JP (1) | JP4799416B2 (pt) |
CN (1) | CN1875056B (pt) |
BR (1) | BRPI0416166A (pt) |
CA (1) | CA2540893C (pt) |
WO (1) | WO2005042630A2 (pt) |
Families Citing this family (49)
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US20050245665A1 (en) * | 2001-08-17 | 2005-11-03 | Chenggang Chen | Method of forming nanocomposite materials |
US20060079623A1 (en) * | 2001-08-17 | 2006-04-13 | Chenggang Chen | Method of forming nanocomposite materials |
US20050272847A1 (en) * | 2001-08-17 | 2005-12-08 | Chyi-Shan Wang | Method of forming nanocomposite materials |
US20080193751A1 (en) * | 2005-09-28 | 2008-08-14 | Peter Groppel | Uv-Curing Adhesive, Preparation Process, Adhesively Bonded Semiconductor Component, and Method of Adhesive Bonding |
US8257805B2 (en) | 2006-01-09 | 2012-09-04 | Momentive Performance Materials Inc. | Insulated glass unit possessing room temperature-curable siloxane-containing composition of reduced gas permeability |
EP2100908B1 (en) | 2006-11-15 | 2014-05-21 | Hitachi Chemical Company, Ltd. | Heat curable resin composition for light reflection |
US7811405B2 (en) * | 2007-08-31 | 2010-10-12 | Gm Global Technology Operations, Inc. | Adhesive bonding of vehicle external panels to reduce bond-line read-out |
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DE102008001808A1 (de) * | 2008-05-15 | 2009-11-19 | Evonik Degussa Gmbh | Beschichtungszusammensetzung |
ATE538089T1 (de) * | 2008-07-22 | 2012-01-15 | Basf Se | Verfahren zur herstellung von formkörpern mit hilfe von mischungen von aminen mit guanidin- derivaten |
PL2307358T3 (pl) * | 2008-07-22 | 2012-05-31 | Basf Se | Mieszaniny amin z pochodnymi guanidyny |
SI2307359T1 (sl) * | 2008-07-22 | 2012-05-31 | Basf Se | Mešanice ki vsebujejo epoksi smole in mešaniceaminov z gvanidinskimi derivati |
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US20110105647A1 (en) * | 2009-10-30 | 2011-05-05 | Rust-Oleum Corporation | Countertop Coating |
KR100982451B1 (ko) * | 2010-01-19 | 2010-09-15 | 주식회사 삼안 | 나노 플레이크를 이용한 방수 및 방식 세라믹 코팅제 |
EP2407292B1 (en) * | 2010-07-14 | 2013-11-13 | Siemens Aktiengesellschaft | Negative mold comprising predefined foam blocks for casting a component and method for producing the negative mold |
US20120065294A1 (en) | 2010-09-10 | 2012-03-15 | Alliant Techsystems Inc. | Insulative compositions, article incorporating the same and methods of forming the same |
US8505432B2 (en) | 2010-09-10 | 2013-08-13 | Alliant Techsystems, Inc. | Multilayer backing materials for composite armor |
US20120183694A1 (en) | 2011-01-18 | 2012-07-19 | Owens Corning Intellectual Capital, Llc | Hybrid polyurethane spray foams made with urethane prepolymers and rheology modifiers |
EP2497857A1 (de) * | 2011-03-05 | 2012-09-12 | Huntsman Textile Effects (Germany) GmbH | Textile Flächengebilde mit reduzierter Geruchsentwicklung |
DE102011075401A1 (de) * | 2011-05-06 | 2012-05-03 | Carl Zeiss Jena Gmbh | Klebstoff mit nanoskaligen füllstoffen |
JP5825734B2 (ja) * | 2011-07-13 | 2015-12-02 | コニシ株式会社 | 模型素材又は模型の製造方法 |
JP2013091774A (ja) * | 2011-10-05 | 2013-05-16 | Canon Inc | エポキシ樹脂組成物 |
TWI488930B (zh) * | 2012-03-12 | 2015-06-21 | Lg Chemical Ltd | 壓感性黏著組成物 |
US20150065613A1 (en) | 2012-04-26 | 2015-03-05 | Dow Mf Produktions Gmbh & Co. Ohg | Epoxy adhesive composition |
ES2435474B1 (es) * | 2012-06-15 | 2014-10-21 | Gamesa Innovation & Technology, S.L. | Método de optimización de la eficiencia de las palas de un aerogenerador |
JP6552481B2 (ja) * | 2013-04-05 | 2019-07-31 | フィッシャーヴェルケ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフトfischerwerke GmbH & Co. KG | 生物由来の反応性希釈剤及び樹脂を有する合成樹脂接着剤 |
DE102013007917A1 (de) * | 2013-05-10 | 2014-11-13 | Mankiewicz Gebr. & Co. (Gmbh & Co. Kg) | Zusammensetzung zur Herstellung von Spachtelmassen und Verfahren zur Herstellung und Verarbeitung der Spachtelmassen |
EP3161034A1 (de) * | 2014-06-24 | 2017-05-03 | BYK-Chemie GmbH | Polyurethan-zwei- oder mehrkomponenten-systeme mit latenter verdickungsneigung |
EP3250623B1 (en) | 2015-01-30 | 2022-07-27 | Zephyros Inc. | Adhesive material and method of use thereof |
EP3085744A1 (en) | 2015-04-24 | 2016-10-26 | PPG Coatings Europe B.V. | An intumescent coating composition |
US10059873B2 (en) * | 2015-06-19 | 2018-08-28 | Halliburton Energy Services, Inc. | Incorporation of clay into curable resin system |
GR1009055B (el) * | 2015-11-23 | 2017-06-21 | Σιδερατου, Ωραιοζηλη Νικολαου | Καινοτομα νανοσυνθετα υλικα με ιδιοτητες ελεγχου οργανικης μικροστοιβαδας για εφαρμογες σε επικαλυψεις απομακρυνσης θαλασσιων επικαθισεων |
US10501572B2 (en) | 2015-12-22 | 2019-12-10 | Carbon, Inc. | Cyclic ester dual cure resins for additive manufacturing |
EP3426737B1 (en) | 2016-03-08 | 2021-11-24 | 3D Systems, Incorporated | Non-isocyanate polyurethane inks for 3d printing |
US10253225B2 (en) * | 2016-12-23 | 2019-04-09 | Evonik Degussa Gmbh | APCHA as a building block in curing agent formulations for structural adhesives |
CN107400337A (zh) * | 2017-07-27 | 2017-11-28 | 重庆市新森宝科技有限公司 | 一种环氧/聚酯环保复合材料及其制备方法 |
US20190060527A1 (en) * | 2017-08-22 | 2019-02-28 | Cook Medical Technologies Llc | Medical balloons with nanoplatelet composite materials and method of making the same |
CN107383320A (zh) * | 2017-08-23 | 2017-11-24 | 南京林业大学 | 环氧树脂改性形状记忆聚氨酯的制备方法 |
CN108192548B (zh) * | 2017-12-29 | 2021-02-12 | 广东铁科灌浆科技有限公司 | 耐久型环氧树脂嵌缝材料及其制备方法 |
JP7249209B2 (ja) * | 2018-06-20 | 2023-03-30 | 京セラ株式会社 | 注形用エポキシ樹脂組成物、電子部品及び電子部品の製造方法 |
CN109294452A (zh) * | 2018-09-08 | 2019-02-01 | 佛山皖和新能源科技有限公司 | 一种高耐热太阳能光伏组件密封胶的制备方法 |
WO2022153234A1 (en) * | 2021-01-15 | 2022-07-21 | Saudi Aramco Technologies Company | Polycarbonate polyol nanocomposites |
CN113304595B (zh) * | 2021-04-27 | 2023-04-18 | 天津市一玛防护材料有限公司 | 一种车用绿色环保净化材料 |
CN115232586B (zh) * | 2022-08-02 | 2023-09-15 | 山东省公路桥梁建设集团有限公司 | 混凝土结构裂缝修补工艺 |
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US2887458A (en) * | 1957-06-25 | 1959-05-19 | Cornelius G Fitzgerald | Thermosetting resinous coating material with thixotropic properties and article coated therewith |
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WO2003016394A1 (en) | 2001-08-16 | 2003-02-27 | Henkel Loctite Corporation | Composition of bulk filler and epoxy-clay nanocomposite |
US6887931B2 (en) * | 2001-10-23 | 2005-05-03 | Ashland Inc. | Thermosetting inorganic clay nanodispersions and their use |
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CN1216114C (zh) * | 2002-12-13 | 2005-08-24 | 湖南省第六工程公司 | 含纳米材料的结构胶 |
CN1207333C (zh) | 2003-02-10 | 2005-06-22 | 四川大学 | 用无机纳米粒子增加不相容高分子共混物混容性的方法 |
JP2004307681A (ja) * | 2003-04-08 | 2004-11-04 | Yokohama Rubber Co Ltd:The | 有機化処理された層状粘土鉱物を含むエポキシ樹脂組成物及びその製法 |
KR100872833B1 (ko) * | 2005-11-11 | 2008-12-09 | 한국생산기술연구원 | 유기점토를 포함하는 부식방지용 코팅제 조성물 및 이의제조 제법 |
-
2004
- 2004-11-03 CN CN2004800327145A patent/CN1875056B/zh not_active Expired - Fee Related
- 2004-11-03 EP EP04817401A patent/EP1682608A2/en not_active Withdrawn
- 2004-11-03 JP JP2006537312A patent/JP4799416B2/ja not_active Expired - Fee Related
- 2004-11-03 US US10/577,880 patent/US8026307B2/en not_active Expired - Fee Related
- 2004-11-03 CA CA2540893A patent/CA2540893C/en not_active Expired - Fee Related
- 2004-11-03 BR BRPI0416166-1A patent/BRPI0416166A/pt not_active IP Right Cessation
- 2004-11-03 WO PCT/EP2004/052765 patent/WO2005042630A2/en active Application Filing
-
2011
- 2011-08-17 US US13/211,617 patent/US8153042B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1875056A (zh) | 2006-12-06 |
WO2005042630A3 (en) | 2005-09-09 |
CA2540893A1 (en) | 2005-05-12 |
US20110301264A1 (en) | 2011-12-08 |
CN1875056B (zh) | 2013-10-16 |
JP4799416B2 (ja) | 2011-10-26 |
CA2540893C (en) | 2012-08-07 |
JP2007514009A (ja) | 2007-05-31 |
EP1682608A2 (en) | 2006-07-26 |
US20070072981A1 (en) | 2007-03-29 |
US8026307B2 (en) | 2011-09-27 |
WO2005042630A2 (en) | 2005-05-12 |
US8153042B2 (en) | 2012-04-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B07A | Application suspended after technical examination (opinion) [chapter 7.1 patent gazette] | ||
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 10A ANUIDADE. |
|
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2278 DE 02/09/2014. |