BRPI0414077A - composição e método relacionados com um adesivo quente derretido - Google Patents
composição e método relacionados com um adesivo quente derretidoInfo
- Publication number
- BRPI0414077A BRPI0414077A BRPI0414077-0A BRPI0414077A BRPI0414077A BR PI0414077 A BRPI0414077 A BR PI0414077A BR PI0414077 A BRPI0414077 A BR PI0414077A BR PI0414077 A BRPI0414077 A BR PI0414077A
- Authority
- BR
- Brazil
- Prior art keywords
- hot melt
- melt adhesive
- composition
- method related
- methyl methacrylate
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
"COMPOSIçãO E MéTODO RELACIONADOS COM UM ADESIVO QUENTE DERRETIDO". A presente invenção inclui métodos e composições relacionados com um adesivo quente derretido que inclui etileno metil metacrilato e uma resina adesiva.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/654,167 US7173076B2 (en) | 2003-09-03 | 2003-09-03 | Composition and method relating to a hot melt adhesive |
PCT/US2004/027166 WO2005023951A1 (en) | 2003-09-03 | 2004-08-20 | Composition and method relating to a hot melt adhesive |
Publications (1)
Publication Number | Publication Date |
---|---|
BRPI0414077A true BRPI0414077A (pt) | 2006-10-24 |
Family
ID=34218028
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0414077-0A BRPI0414077A (pt) | 2003-09-03 | 2004-08-20 | composição e método relacionados com um adesivo quente derretido |
Country Status (9)
Country | Link |
---|---|
US (2) | US7173076B2 (pt) |
EP (1) | EP1675927B8 (pt) |
KR (1) | KR20060033931A (pt) |
CN (1) | CN100447215C (pt) |
AT (1) | ATE458031T1 (pt) |
BR (1) | BRPI0414077A (pt) |
CA (1) | CA2536933C (pt) |
DE (1) | DE602004025597D1 (pt) |
WO (1) | WO2005023951A1 (pt) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6846876B1 (en) * | 2003-07-16 | 2005-01-25 | Adherent Laboratories, Inc. | Low odor, light color, disposable article construction adhesive |
US7173076B2 (en) * | 2003-09-03 | 2007-02-06 | H.B. Fuller Licensing & Financing Inc | Composition and method relating to a hot melt adhesive |
US7910794B2 (en) | 2007-03-05 | 2011-03-22 | Adherent Laboratories, Inc. | Disposable diaper construction and adhesive |
KR101683353B1 (ko) | 2011-10-26 | 2016-12-06 | 사우디 아라비안 오일 컴퍼니 | 유황-개질 아스팔트 에멀전 및 바인더 조성물 |
US8829105B2 (en) | 2012-01-18 | 2014-09-09 | Eastman Chemical Company | Low molecular weight polystyrene resin and methods of making and using the same |
CN103289605B (zh) * | 2013-05-07 | 2015-12-23 | 安徽金门工贸有限公司 | 一种不锈钢材料用热熔胶及其制备方法 |
CN103289602B (zh) * | 2013-05-07 | 2016-04-20 | 安徽金门工贸有限公司 | 一种塑料管材用热熔胶及其制备方法 |
CN104497931B (zh) * | 2014-12-10 | 2016-08-24 | 上海邦中新材料有限公司 | 一种用于铜塑复合板的粘结树脂 |
CN108893082A (zh) * | 2018-06-14 | 2018-11-27 | 深圳市通产丽星股份有限公司 | 一种热熔胶及其制备方法 |
CN109852342A (zh) * | 2018-12-06 | 2019-06-07 | 鼎贞(厦门)实业有限公司 | 高分子热熔胶及封玻璃容器封口垫片 |
CN109651979B (zh) * | 2018-12-27 | 2021-07-02 | 华威粘结材料(上海)股份有限公司 | 一种书刊装订热熔胶 |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3287335A (en) * | 1964-07-03 | 1966-11-22 | Celanese Corp | Polymerization of olefin with polar monomers in the presence of ziegler type catalyst systems |
US3658741A (en) * | 1966-09-19 | 1972-04-25 | Allied Chem | Homogeneous copolymers from ethylene |
US3949016A (en) * | 1973-03-16 | 1976-04-06 | Societe Nationale Des Petroles D'aquitaine | Method for copolymerizing monomers of different types and polymer blends contain the copolymer |
GB1431070A (en) | 1973-07-17 | 1976-04-07 | Ici Ltd | Hot melt adhesive composition |
DE2523617C2 (de) | 1975-05-28 | 1982-09-16 | Basf Ag, 6700 Ludwigshafen | Haftkleber |
US4197380A (en) * | 1978-03-01 | 1980-04-08 | Raychem Corporation | Hot melt adhesive comprising fluorocarbon elastomer, ethylene copolymer and tackifier |
US4284542A (en) * | 1979-05-07 | 1981-08-18 | E. I. Du Pont De Nemours And Company | Hot melt adhesive composition |
JPS564279A (en) * | 1979-06-25 | 1981-01-17 | Toshiba Corp | Insulated gate type field effect transistor |
JPS5641279A (en) | 1979-09-11 | 1981-04-17 | Taihei Seishi Kk | Hot-melt adhesive composition |
FR2504933A1 (fr) * | 1981-04-30 | 1982-11-05 | Charbonnages Ste Chimique | Compositions applicables a la fabrication de colles thermofusibles et leur procede de preparation |
JPS6028476A (ja) * | 1983-07-27 | 1985-02-13 | Arakawa Chem Ind Co Ltd | ホツトメルト接着剤組成物 |
US4654389A (en) * | 1984-08-13 | 1987-03-31 | The Dow Chemical Company | Adhesive compositions of ethylene-unsaturated carboxylic acid copolymers |
US4830926A (en) * | 1987-10-30 | 1989-05-16 | Shell Oil Company | Poly-1-butene blend adhesives for laminar structure |
US5149741A (en) * | 1989-07-21 | 1992-09-22 | Findley Adhesives, Inc. | Hot melt construction adhesives for disposable soft goods |
US5286781A (en) * | 1991-04-18 | 1994-02-15 | Sekisui Chemical Co., Ltd. | Pressure sensitive adhesive composition and pressure sensitive adhesive tape or sheet making use of the same |
EP0603384B1 (en) * | 1992-07-02 | 2002-10-16 | H.B. FULLER LICENSING & FINANCING, INC. | Hot melt adhesive composition |
US5401791A (en) * | 1992-12-03 | 1995-03-28 | Exxon Chemical Patents Inc. | Bookbinding adhesives; processes for production of bookbinding adhesives; and methods of bookbinding |
US5382615A (en) * | 1993-10-01 | 1995-01-17 | Eastman Chemical Company | Modified polyethylene based hot-melt adhesives for use in packaging |
US5401792A (en) * | 1993-11-10 | 1995-03-28 | Minnesota Mining And Manufacturing Company | Sprayable thermoplastic compositions |
US5747573A (en) * | 1994-02-07 | 1998-05-05 | H. B. Fuller Licensing & Financing, Inc. | High heat resistant hot melt adhesive |
DE69630362D1 (de) * | 1996-04-15 | 2003-11-20 | Eastman Chemical Resins Inc | Heissschmelzklebstoff auf der Basis von styrolhaltigen Blockcopolymeren |
US6380292B1 (en) * | 1996-06-21 | 2002-04-30 | Bostik Findley, Inc. | Hydrophilic hot melt adhesive |
US5928782A (en) * | 1996-11-15 | 1999-07-27 | H.B. Fuller Licensing & Financing, Inc. | Hot melt adhesives with excellent heat resistance |
CN1312844A (zh) * | 1998-06-30 | 2001-09-12 | H·B·富勒许可和金融公司 | 含有均相乙烯共聚体和嵌段共聚物的热熔胶粘剂组合物 |
US6562888B1 (en) * | 1998-07-27 | 2003-05-13 | Arizona Chemical Company | Light-colored rosin esters and adhesive compositions |
US6410627B1 (en) * | 1999-04-09 | 2002-06-25 | National Starch And Chemical Investment Holding Corporation | Use of high hydroxyl compounds for water sensitive hot melt adhesives |
WO2001034719A1 (en) | 1999-11-05 | 2001-05-17 | H.B. Fuller Licensing & Financing, Inc. | Hot melt adhesives and method of use thereof in bookbinding at low application temperature |
WO2002060993A1 (en) * | 2001-01-19 | 2002-08-08 | Exxonmobil Chemical Patents Inc. | Hot melt adhesives |
JP2004525214A (ja) * | 2001-01-19 | 2004-08-19 | エクソンモービル・ケミカル・パテンツ・インク | ホットメルト接着剤 |
US20020193474A1 (en) * | 2001-06-14 | 2002-12-19 | Daily Jeffrey Daniel | Hot melt adhesive composition |
US7173076B2 (en) * | 2003-09-03 | 2007-02-06 | H.B. Fuller Licensing & Financing Inc | Composition and method relating to a hot melt adhesive |
-
2003
- 2003-09-03 US US10/654,167 patent/US7173076B2/en not_active Expired - Fee Related
-
2004
- 2004-08-20 EP EP04781781A patent/EP1675927B8/en not_active Expired - Lifetime
- 2004-08-20 WO PCT/US2004/027166 patent/WO2005023951A1/en active Application Filing
- 2004-08-20 BR BRPI0414077-0A patent/BRPI0414077A/pt not_active Application Discontinuation
- 2004-08-20 DE DE602004025597T patent/DE602004025597D1/de not_active Expired - Lifetime
- 2004-08-20 AT AT04781781T patent/ATE458031T1/de not_active IP Right Cessation
- 2004-08-20 KR KR1020067004478A patent/KR20060033931A/ko not_active Application Discontinuation
- 2004-08-20 CA CA2536933A patent/CA2536933C/en not_active Expired - Fee Related
- 2004-08-20 CN CNB2004800315773A patent/CN100447215C/zh not_active Expired - Fee Related
-
2006
- 2006-12-08 US US11/635,887 patent/US20070082973A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US7173076B2 (en) | 2007-02-06 |
CN1871321A (zh) | 2006-11-29 |
CA2536933A1 (en) | 2005-03-17 |
US20070082973A1 (en) | 2007-04-12 |
KR20060033931A (ko) | 2006-04-20 |
WO2005023951A1 (en) | 2005-03-17 |
EP1675927B1 (en) | 2010-02-17 |
US20050049342A1 (en) | 2005-03-03 |
CA2536933C (en) | 2012-06-19 |
DE602004025597D1 (de) | 2010-04-01 |
ATE458031T1 (de) | 2010-03-15 |
CN100447215C (zh) | 2008-12-31 |
EP1675927A1 (en) | 2006-07-05 |
EP1675927B8 (en) | 2010-05-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B11A | Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing | ||
B11Y | Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette] |