BR9815494A - Módulo de chip, módulo e procedimento para a manufatura de um módulo assim como um cartão com chip - Google Patents

Módulo de chip, módulo e procedimento para a manufatura de um módulo assim como um cartão com chip

Info

Publication number
BR9815494A
BR9815494A BR9815494-0A BR9815494A BR9815494A BR 9815494 A BR9815494 A BR 9815494A BR 9815494 A BR9815494 A BR 9815494A BR 9815494 A BR9815494 A BR 9815494A
Authority
BR
Brazil
Prior art keywords
module
chip
procedure
manufacturing
contact elements
Prior art date
Application number
BR9815494-0A
Other languages
English (en)
Inventor
Karl Heinz Wendisch
Original Assignee
Karl Heinz Wendisch
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19733777A external-priority patent/DE19733777C2/de
Application filed by Karl Heinz Wendisch filed Critical Karl Heinz Wendisch
Publication of BR9815494A publication Critical patent/BR9815494A/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1078—Leads having locally deformed portion, e.g. for retention
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

<B>"MóDULO DE CHIP, MóDULO E PROCEDIMENTO PARA A MANUFATURA DE UM MóDULO ASSIM COMO UM CARTãO COM CHIP"<D>. A invenção refere-se a um módulo, em especial para a utilização em cartões com chip, composto de um módulo de chip com um circuito de conexão integrado e de um módulo de transmissão com no mínimo um elemento de transmissão para a transferência de dados e/ou de energia entre o circuito de conexão integrado e um aparelho externo ou vice-versa, sendo que o módulo de chip e o módulo de transmissão apresentam elementos de contato para a conexão elétrica entre si, sendo que os elementos de contato (11) do módulo de chip (3) por um lado e os elementos de contato (7) do módulo de transmissão (2) por outro lado estão ligados uns com os outros através de encravamento dos elementos de contato (7, 11) correspondentes entre si.
BR9815494-0A 1997-07-28 1998-07-25 Módulo de chip, módulo e procedimento para a manufatura de um módulo assim como um cartão com chip BR9815494A (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19732409 1997-07-28
DE19733777A DE19733777C2 (de) 1997-07-28 1997-08-05 Modul und Verfahren zur Herstellung eines Moduls sowie eine Chipkarte
PCT/DE1998/002097 WO1999005643A2 (de) 1997-07-28 1998-07-25 Chipmodul, modul und verfahren zur herstellung eines moduls sowie eine chipkarte

Publications (1)

Publication Number Publication Date
BR9815494A true BR9815494A (pt) 2000-10-31

Family

ID=26038634

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9815494-0A BR9815494A (pt) 1997-07-28 1998-07-25 Módulo de chip, módulo e procedimento para a manufatura de um módulo assim como um cartão com chip

Country Status (6)

Country Link
EP (1) EP0998723B1 (pt)
JP (1) JP2001511571A (pt)
CN (1) CN1265213A (pt)
AU (1) AU9431098A (pt)
BR (1) BR9815494A (pt)
WO (1) WO1999005643A2 (pt)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4712157B2 (ja) * 2000-05-08 2011-06-29 大日本印刷株式会社 非接触式データキャリア
JP4783991B2 (ja) * 2001-03-28 2011-09-28 大日本印刷株式会社 Ｉｃモジュールの製造方法
DE102013018518A1 (de) 2013-11-04 2015-05-07 Giesecke & Devrient Gmbh IC-Modul für unterschiedliche Verbindungstechniken
DE102014012394A1 (de) * 2014-08-21 2016-02-25 Giesecke & Devrient Gmbh Datenträger mit Teilstück

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
DE4440721A1 (de) * 1994-11-15 1996-05-23 Datacolor Druck Und Fullservic Trägerelement für IC-Baustein
DE69702399T2 (de) * 1996-08-02 2001-02-15 Schlumberger Systems & Service Kombinierte chipkarte
DE29706016U1 (de) * 1997-04-04 1998-08-06 Telbus Ges Fuer Elektronische Elektronisches Gerät, insbesondere Chipkarte mit Nietverbindung

Also Published As

Publication number Publication date
EP0998723A2 (de) 2000-05-10
WO1999005643A2 (de) 1999-02-04
CN1265213A (zh) 2000-08-30
JP2001511571A (ja) 2001-08-14
AU9431098A (en) 1999-02-16
EP0998723B1 (de) 2003-04-09
WO1999005643A3 (de) 1999-04-08

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Legal Events

Date Code Title Description
FA10 Dismissal: dismissal - article 33 of industrial property law
B11Y Definitive dismissal acc. article 33 of ipl - extension of time limit for request of examination expired