BR9814289A - Processo e aparelho de revestimento por spin para sistemas de dióxido de carbono lìquido - Google Patents

Processo e aparelho de revestimento por spin para sistemas de dióxido de carbono lìquido

Info

Publication number
BR9814289A
BR9814289A BR9814289-5A BR9814289A BR9814289A BR 9814289 A BR9814289 A BR 9814289A BR 9814289 A BR9814289 A BR 9814289A BR 9814289 A BR9814289 A BR 9814289A
Authority
BR
Brazil
Prior art keywords
carbon dioxide
substrate
spin coating
coating process
liquid carbon
Prior art date
Application number
BR9814289-5A
Other languages
English (en)
Inventor
Xoseph M Desimone
Ruben G Carbonell
Original Assignee
Univ North Carolina
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ North Carolina filed Critical Univ North Carolina
Publication of BR9814289A publication Critical patent/BR9814289A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Coating Apparatus (AREA)

Abstract

Patente de Invenção: <B>"PROCESSO E APARELHO DE REVESTIMENTO POR SPIN PARA SISTEMAS DE DIóXIDO DE CARBONO LìQUIDO"<D>. Um processo de revestimento por spin compreende aplicar um líquido de dióxido de carbono a porção superficial de um substrato (12); e então rodar o substrato (12) em redor de um eixo para distribuir o líquido de dióxido de carbono no substrato (12). O líquido de dióxido de carbono pode ser distribuido no substrato (12) como um portador, para fins de depositar um material, como um revestimento, no substrato (12). Além dissso, o líquido de dióxido de carbono pode ser distribuído no substrato (12) como um solvente, para fins de solubilizar, dissolver ou remover um material previamente depositado na superfície do substrato (12). O aparelho (10) para realizar a presente invenção é também divulgado.
BR9814289-5A 1997-12-16 1998-11-24 Processo e aparelho de revestimento por spin para sistemas de dióxido de carbono lìquido BR9814289A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/991,321 US6001418A (en) 1997-12-16 1997-12-16 Spin coating method and apparatus for liquid carbon dioxide systems
PCT/US1998/025172 WO1999030840A1 (en) 1997-12-16 1998-11-24 Spin coating method and apparatus for liquid carbon dioxide systems

Publications (1)

Publication Number Publication Date
BR9814289A true BR9814289A (pt) 2000-10-03

Family

ID=25537101

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9814289-5A BR9814289A (pt) 1997-12-16 1998-11-24 Processo e aparelho de revestimento por spin para sistemas de dióxido de carbono lìquido

Country Status (9)

Country Link
US (2) US6001418A (pt)
EP (1) EP1042077A1 (pt)
JP (1) JP2002508248A (pt)
KR (1) KR20010052121A (pt)
CN (1) CN1158145C (pt)
AU (1) AU1605899A (pt)
BR (1) BR9814289A (pt)
CA (1) CA2315225A1 (pt)
WO (1) WO1999030840A1 (pt)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6383289B2 (en) * 1997-12-16 2002-05-07 The University Of North Carolina At Chapel Hill Apparatus for liquid carbon dioxide systems
US6197385B1 (en) * 1998-02-04 2001-03-06 Tokyo Electron Limited Film forming apparatus, substrate conveying apparatus, film forming method, and substrate conveying method
US6083565A (en) * 1998-11-06 2000-07-04 North Carolina State University Method for meniscus coating with liquid carbon dioxide
US6497921B1 (en) * 1998-11-06 2002-12-24 North Carolina State University Method for meniscus coating with liquid carbon dioxide
US7044143B2 (en) * 1999-05-14 2006-05-16 Micell Technologies, Inc. Detergent injection systems and methods for carbon dioxide microelectronic substrate processing systems
US6940223B2 (en) * 2000-07-10 2005-09-06 Semiconductor Energy Laboratory Co., Ltd. Film forming apparatus and method of manufacturing light emitting device
US20040011378A1 (en) * 2001-08-23 2004-01-22 Jackson David P Surface cleaning and modification processes, methods and apparatus using physicochemically modified dense fluid sprays
CN1246429C (zh) * 2000-09-26 2006-03-22 北卡罗来纳-查佩尔山大学 用于二氧化碳的磷酸酯氟表面活性剂
WO2002031596A1 (en) * 2000-10-12 2002-04-18 University Of North Carolina At Chapel Hill Co2-processes photoresists, polymers, and photoactive compounds for microlithography
US6623355B2 (en) 2000-11-07 2003-09-23 Micell Technologies, Inc. Methods, apparatus and slurries for chemical mechanical planarization
GB2371248A (en) * 2000-12-04 2002-07-24 Seiko Epson Corp Fabrication of self-assembled monolayers
US6656666B2 (en) * 2000-12-22 2003-12-02 International Business Machines Corporation Topcoat process to prevent image collapse
US6602351B2 (en) 2001-02-15 2003-08-05 Micell Technologies, Inc. Methods for the control of contaminants following carbon dioxide cleaning of microelectronic structures
US6905555B2 (en) 2001-02-15 2005-06-14 Micell Technologies, Inc. Methods for transferring supercritical fluids in microelectronic and other industrial processes
US6596093B2 (en) 2001-02-15 2003-07-22 Micell Technologies, Inc. Methods for cleaning microelectronic structures with cyclical phase modulation
US6641678B2 (en) 2001-02-15 2003-11-04 Micell Technologies, Inc. Methods for cleaning microelectronic structures with aqueous carbon dioxide systems
US6562146B1 (en) 2001-02-15 2003-05-13 Micell Technologies, Inc. Processes for cleaning and drying microelectronic structures using liquid or supercritical carbon dioxide
US6613157B2 (en) 2001-02-15 2003-09-02 Micell Technologies, Inc. Methods for removing particles from microelectronic structures
US7658989B2 (en) 2001-03-28 2010-02-09 North Carolina State University Nano-and micro-cellular foamed thin-walled material, and processes and apparatuses for making the same
US6509136B1 (en) 2001-06-27 2003-01-21 International Business Machines Corporation Process of drying a cast polymeric film disposed on a workpiece
US6706641B2 (en) 2001-09-13 2004-03-16 Micell Technologies, Inc. Spray member and method for using the same
US6782900B2 (en) 2001-09-13 2004-08-31 Micell Technologies, Inc. Methods and apparatus for cleaning and/or treating a substrate using CO2
US6666928B2 (en) * 2001-09-13 2003-12-23 Micell Technologies, Inc. Methods and apparatus for holding a substrate in a pressure chamber
US6619304B2 (en) 2001-09-13 2003-09-16 Micell Technologies, Inc. Pressure chamber assembly including non-mechanical drive means
US6763840B2 (en) 2001-09-14 2004-07-20 Micell Technologies, Inc. Method and apparatus for cleaning substrates using liquid carbon dioxide
US6737225B2 (en) 2001-12-28 2004-05-18 Texas Instruments Incorporated Method of undercutting micro-mechanical device with super-critical carbon dioxide
US20050227183A1 (en) * 2002-01-11 2005-10-13 Mark Wagner Compositions and methods for image development of conventional chemically amplified photoresists
US20040003828A1 (en) * 2002-03-21 2004-01-08 Jackson David P. Precision surface treatments using dense fluids and a plasma
US20030190818A1 (en) * 2002-04-03 2003-10-09 Ruben Carbonell Enhanced processing of performance films using high-diffusivity penetrants
US6736906B2 (en) 2002-04-10 2004-05-18 International Business Machines Corporation Turbine part mount for supercritical fluid processor
US20040045578A1 (en) * 2002-05-03 2004-03-11 Jackson David P. Method and apparatus for selective treatment of a precision substrate surface
US6846380B2 (en) * 2002-06-13 2005-01-25 The Boc Group, Inc. Substrate processing apparatus and related systems and methods
US20080000505A1 (en) * 2002-09-24 2008-01-03 Air Products And Chemicals, Inc. Processing of semiconductor components with dense processing fluids
US7267727B2 (en) * 2002-09-24 2007-09-11 Air Products And Chemicals, Inc. Processing of semiconductor components with dense processing fluids and ultrasonic energy
US20080004194A1 (en) * 2002-09-24 2008-01-03 Air Products And Chemicals, Inc. Processing of semiconductor components with dense processing fluids
US20040098106A1 (en) * 2002-11-14 2004-05-20 Williams Michael S. Intraluminal prostheses and carbon dioxide-assisted methods of impregnating same with pharmacological agents
US7285287B2 (en) * 2002-11-14 2007-10-23 Synecor, Llc Carbon dioxide-assisted methods of providing biocompatible intraluminal prostheses
US6929904B2 (en) * 2002-11-14 2005-08-16 The University Of North Carolina At Chapel Hill Positive tone lithography with carbon dioxide development systems
US6919167B2 (en) * 2002-11-14 2005-07-19 Micell Technologies Positive tone lithography in carbon dioxide solvents
US6880560B2 (en) * 2002-11-18 2005-04-19 Techsonic Substrate processing apparatus for processing substrates using dense phase gas and sonic waves
US6932930B2 (en) * 2003-03-10 2005-08-23 Synecor, Llc Intraluminal prostheses having polymeric material with selectively modified crystallinity and methods of making same
US20040198066A1 (en) * 2003-03-21 2004-10-07 Applied Materials, Inc. Using supercritical fluids and/or dense fluids in semiconductor applications
US20040194886A1 (en) * 2003-04-01 2004-10-07 Deyoung James Microelectronic device manufacturing in coordinated carbon dioxide processing chambers
US6951769B2 (en) 2003-06-04 2005-10-04 Texas Instruments Incorporated Method for stripping sacrificial layer in MEMS assembly
US6806993B1 (en) 2003-06-04 2004-10-19 Texas Instruments Incorporated Method for lubricating MEMS components
US20050029492A1 (en) * 2003-08-05 2005-02-10 Hoshang Subawalla Processing of semiconductor substrates with dense fluids comprising acetylenic diols and/or alcohols
JP4538625B2 (ja) * 2004-03-01 2010-09-08 独立行政法人産業技術総合研究所 二酸化炭素を使用した塗装方法及びその装置
JP4429089B2 (ja) * 2004-06-14 2010-03-10 東京応化工業株式会社 回転塗布装置
US7195676B2 (en) * 2004-07-13 2007-03-27 Air Products And Chemicals, Inc. Method for removal of flux and other residue in dense fluid systems
US20060081273A1 (en) * 2004-10-20 2006-04-20 Mcdermott Wayne T Dense fluid compositions and processes using same for article treatment and residue removal
US7410751B2 (en) * 2005-01-28 2008-08-12 Micell Technologies, Inc. Compositions and methods for image development of conventional chemically amplified photoresists
WO2006081534A1 (en) * 2005-01-28 2006-08-03 Micell Technologies, Inc. Compositions and methods for image development of conventional chemically amplified photoresists
WO2006138727A2 (en) * 2005-06-17 2006-12-28 The Regents Of The University Of Michigan Apparatus and method of producing net-shape components from alloy sheets
US7784477B2 (en) * 2006-02-14 2010-08-31 Raytheon Company Automated non-contact cleaning
CA2736495A1 (en) * 2008-09-10 2010-03-18 Gregory A. Smith Apparatus and method to dispense hpc-based viscous liquids into porous substrates, e.g., continuous web-based process
KR20140009298A (ko) * 2011-03-18 2014-01-22 가부시키가이샤 가네카 액상 경화성 조성물이 충전된 토출 장치용 용기, 그 제조 방법 및 토출 장치
CN103182359A (zh) * 2011-12-28 2013-07-03 中国科学院微电子研究所 微波匀胶设备及其方法
DE202012013640U1 (de) * 2012-01-03 2018-11-12 solar-semi GmbH Substratteller
US9502225B2 (en) 2012-06-20 2016-11-22 The University Of North Carolina At Chapel Hill Integrated sample processing for electrospray ionization devices
CN102814251A (zh) * 2012-07-20 2012-12-12 樊荣 一种封闭式旋转喷漆机
CN105964488B (zh) * 2016-05-30 2019-12-03 中国科学院半导体研究所 带基片加热和气氛处理的匀胶机
WO2020189814A1 (ko) * 2019-03-19 2020-09-24 티티앤에스 주식회사 혼합분말이 함유된 코팅용액을 기판에 코팅하기 위한 코팅장치
CN116007311A (zh) * 2023-01-04 2023-04-25 江苏迪丞光电材料有限公司 一种陶瓷生产用陶瓷胚体的干燥装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4281057A (en) 1976-06-18 1981-07-28 International Business Machines Corporation Variable pre-spin drying time control of photoresists thickness
US4640846A (en) * 1984-09-25 1987-02-03 Yue Kuo Semiconductor spin coating method
US4794021A (en) * 1986-11-13 1988-12-27 Microelectronics And Computer Technology Corporation Method of providing a planarized polymer coating on a substrate wafer
US4886012A (en) * 1987-06-30 1989-12-12 Mitsubishi Denki Kabushiki Kaisha Spin coating apparatus
JP2663483B2 (ja) * 1988-02-29 1997-10-15 勝 西川 レジストパターン形成方法
US5094892A (en) * 1988-11-14 1992-03-10 Weyerhaeuser Company Method of perfusing a porous workpiece with a chemical composition using cosolvents
EP0388915B1 (en) * 1989-03-22 1993-10-06 Union Carbide Chemicals And Plastics Company, Inc. Precursor coating compositions
US5264246A (en) * 1989-05-02 1993-11-23 Mitsubishi Denki Kabushiki Kaisha Spin coating method
US5496901A (en) * 1992-03-27 1996-03-05 University Of North Carolina Method of making fluoropolymers
US5392989A (en) * 1993-01-13 1995-02-28 Semiconductor Systems, Inc. Nozzle assembly for dispensing liquid
US5312882A (en) 1993-07-30 1994-05-17 The University Of North Carolina At Chapel Hill Heterogeneous polymerization in carbon dioxide
US5472502A (en) * 1993-08-30 1995-12-05 Semiconductor Systems, Inc. Apparatus and method for spin coating wafers and the like
US5455076A (en) * 1993-10-05 1995-10-03 Union Carbide Chemicals & Plastics Technology Corporation Method and apparatus for proportioning and mixing non-compressible and compressible fluids
US5591264A (en) * 1994-03-22 1997-01-07 Sony Corporation Spin coating device
EP0681317B1 (en) * 1994-04-08 2001-10-17 Texas Instruments Incorporated Method for cleaning semiconductor wafers using liquefied gases
JP3277114B2 (ja) * 1995-02-17 2002-04-22 インターナショナル・ビジネス・マシーンズ・コーポレーション 陰画調レジスト像の作製方法
US5683977A (en) 1995-03-06 1997-11-04 Lever Brothers Company, Division Of Conopco, Inc. Dry cleaning system using densified carbon dioxide and a surfactant adjunct
US5989355A (en) * 1997-02-26 1999-11-23 Eco-Snow Systems, Inc. Apparatus for cleaning and testing precision components of hard drives and the like

Also Published As

Publication number Publication date
US6240936B1 (en) 2001-06-05
KR20010052121A (ko) 2001-06-25
CN1281392A (zh) 2001-01-24
JP2002508248A (ja) 2002-03-19
AU1605899A (en) 1999-07-05
US6001418A (en) 1999-12-14
CN1158145C (zh) 2004-07-21
CA2315225A1 (en) 1999-06-24
WO1999030840A1 (en) 1999-06-24
EP1042077A1 (en) 2000-10-11

Similar Documents

Publication Publication Date Title
BR9814289A (pt) Processo e aparelho de revestimento por spin para sistemas de dióxido de carbono lìquido
John et al. Preferential glial cell attachment to microcontact printed surfaces
SG60096A1 (en) Cleaning liquid for producing semiconductor device and process for producing semiconductor device using same
BR9810241A (pt) Agente de limpeza para limpar a superfìcie de um substrato, composição de sub-revestimento para formar um sub-revestimento sobre a superfìcie de um substrato, processo para formar um revestimento fotocataliticamente hidrofilicável sobre a superfìcie de um substrato, conjunto, e, membro
ATE311665T1 (de) Verfahren und vorrichtung zum entfernen von einer flüssigkeit von der oberfläche eines rotierenden substrats
DE69529705T2 (de) Verfahren und Lösung zur Reinigung eines Substrats von einer Metallkontamination
DE59900269D1 (de) Vorrichtung zum Nassätzen einer Kante einer Halbleiterscheibe
BR9303951A (pt) Processo de aplicaçao de um material aditivo poli merico a um substrato polimerico
ATE488621T1 (de) Galvanisches verfahren zur herstellung einer mehrlagenstruktur
CA2054094A1 (en) Chemically adsorbed monomolecular lamination film
BR9510445A (pt) Processo e aparelho para revestir um substrato
DE69013149D1 (de) Verfahren zum auftragen einer schicht auf ein substrat sowie verfahrenssystem zu diesem zweck.
BR9510266A (pt) Processo aparelho para revestir um substrato
WO2005059646A3 (en) Photosensitive composition remover
EP0390134A3 (en) Method and apparatus for cleaning semiconductor devices
US20050124518A1 (en) Substrate treating apparatus
MXPA03006127A (es) Dispositivo y metodo de recubrimiento que utilizan varillas bobinadas.
BR9810170A (pt) Processos para criar um filme de carbono similar a diamante em um substrato, e de deposição quìmica de vapor melhorada por plasma de um filme de carbono similar a diamante em um substrato, e, artigo manufaturado
DE59305729D1 (de) Verfahren und Vorrichtung zum Modifizieren der Oberflächenaktivität eines Silikatglas Substrates
MY125913A (en) Method of removing organic materials from substrates
WO2000028552A8 (en) Method and apparatus for photosensitized ultraviolet decontamination of surfaces and aerosol clouds
BR8401629A (pt) Processo e aparelho para remover controlavelmente o revestimento magnetizavel do substrato de um disco flexivel
BR9400597A (pt) Composição removedora de papel de parede, e, processo de remoção de papel de parede de um substrato
WO2005067008A3 (en) Method and system for coating polymer solution on a substrate in a solvent saturated chamber
TW200515102A (en) A processing liquid coating apparatus and a processing liquid coating method

Legal Events

Date Code Title Description
PC Transfer

Free format text: THE UNIVERSITY OF NORTH CAROLINA AT CHAPEL HILL (US), NORTH CAROLINA STATE UNIVERSITY (US)

B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE A 4A , 5A , 6A E 7A ANUIDADES.