BR9801437A - Disposição de conexão para um circuito híbrido de capacidade-smd - Google Patents

Disposição de conexão para um circuito híbrido de capacidade-smd

Info

Publication number
BR9801437A
BR9801437A BR9801437-4A BR9801437A BR9801437A BR 9801437 A BR9801437 A BR 9801437A BR 9801437 A BR9801437 A BR 9801437A BR 9801437 A BR9801437 A BR 9801437A
Authority
BR
Brazil
Prior art keywords
hybrid circuit
smd
connection arrangement
hand
bridge
Prior art date
Application number
BR9801437-4A
Other languages
English (en)
Inventor
Karl Rehnelt
Frank Templin
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of BR9801437A publication Critical patent/BR9801437A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Patente de Invenção: <B>"DISPOSIçãO DE CONEXãO PARA UM CIRCUITO HìBRIDO DE CAPACIDADE-SMD"<D>. Por intermédio da construção, de acordo com a invenção dos pinos de conexão com dois setores laterais e com um setor central em forma de ponte puxado para cima, onde o pino de conexão e o circuito híbrido projetado perpendicularmente para cima apresentam juntos um formato tipicamente em forma de T invertido, é por um lado obtido com que o circuito híbrido fica aplicado por si só, sem outros meios adicionais, em cima do substrato e pode ser soldado. Por outro lado, a construção em forma de ponte proporciona uma elasticidade e carga suficientes com relação a oscilações ou acelerações, assim como a presença de duas superfícies de montagem definidas, cuja coplanaridade, não por último, é proporcionada pela construção elástica dos pinos de conexão.
BR9801437-4A 1997-04-24 1998-04-23 Disposição de conexão para um circuito híbrido de capacidade-smd BR9801437A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19717384 1997-04-24

Publications (1)

Publication Number Publication Date
BR9801437A true BR9801437A (pt) 1999-10-19

Family

ID=7827655

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9801437-4A BR9801437A (pt) 1997-04-24 1998-04-23 Disposição de conexão para um circuito híbrido de capacidade-smd

Country Status (6)

Country Link
US (1) US6072235A (pt)
EP (1) EP0892432B1 (pt)
AR (1) AR010149A1 (pt)
AT (1) ATE284570T1 (pt)
BR (1) BR9801437A (pt)
DE (1) DE59812350D1 (pt)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6984156B2 (en) * 2003-09-05 2006-01-10 Power-One Limited Connector for surface mounting subassemblies vertically on a mother board and assemblies comprising the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5142263A (en) * 1991-02-13 1992-08-25 Electromer Corporation Surface mount device with overvoltage protection feature
WO1994003913A1 (de) * 1992-08-07 1994-02-17 Siemens Aktiengesellschaft Thermosicherung und verfahren zu ihrer aktivierung
JP3424929B2 (ja) * 1992-09-16 2003-07-07 クレイトン，ジェイムズ，イー． 薄マルチチップ・モジュール
US5731633A (en) * 1992-09-16 1998-03-24 Gary W. Hamilton Thin multichip module
JP3253765B2 (ja) * 1993-06-25 2002-02-04 富士通株式会社 半導体装置
DE9417299U1 (de) * 1994-10-27 1995-03-02 Siemens AG, 80333 München Stromversorgungsmodul zur Bestückung einer Baugruppenleiterplatte

Also Published As

Publication number Publication date
EP0892432A3 (de) 1999-05-19
EP0892432A2 (de) 1999-01-20
US6072235A (en) 2000-06-06
ATE284570T1 (de) 2004-12-15
EP0892432B1 (de) 2004-12-08
DE59812350D1 (de) 2005-01-13
AR010149A1 (es) 2000-05-17

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 4A, 5A,6A,7A E 8A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1860 DE 29/08/2006.