BR9400335A - Componente modular de sistema de computador e método para produzir um sistema de computador com tal componente - Google Patents

Componente modular de sistema de computador e método para produzir um sistema de computador com tal componente

Info

Publication number
BR9400335A
BR9400335A BR9400335A BR9400335A BR9400335A BR 9400335 A BR9400335 A BR 9400335A BR 9400335 A BR9400335 A BR 9400335A BR 9400335 A BR9400335 A BR 9400335A BR 9400335 A BR9400335 A BR 9400335A
Authority
BR
Brazil
Prior art keywords
computer system
component
producing
modular
modular computer
Prior art date
Application number
BR9400335A
Other languages
English (en)
Inventor
Jerome Albert Frankeny
Richard Francis Frankeny
Karl Hermann
Ronald Lann Imken
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of BR9400335A publication Critical patent/BR9400335A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/053—Tails
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
BR9400335A 1993-02-10 1994-01-26 Componente modular de sistema de computador e método para produzir um sistema de computador com tal componente BR9400335A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/015,989 US5363275A (en) 1993-02-10 1993-02-10 Modular component computer system

Publications (1)

Publication Number Publication Date
BR9400335A true BR9400335A (pt) 1994-08-16

Family

ID=21774742

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9400335A BR9400335A (pt) 1993-02-10 1994-01-26 Componente modular de sistema de computador e método para produzir um sistema de computador com tal componente

Country Status (3)

Country Link
US (1) US5363275A (pt)
JP (1) JP2582527B2 (pt)
BR (1) BR9400335A (pt)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5628031A (en) * 1993-07-19 1997-05-06 Elonex Ip Holdings Ltd. Personal digital assistant module implemented as a low-profile printed circuit assembly having a rigid substrate wherein IC devices are mounted within openings wholly between opposite plane surfaces of the rigid substrate
US5745333A (en) * 1994-11-21 1998-04-28 International Business Machines Corporation Laminar stackable circuit board structure with capacitor
US5509200A (en) * 1994-11-21 1996-04-23 International Business Machines Corporation Method of making laminar stackable circuit board structure
US5691041A (en) * 1995-09-29 1997-11-25 International Business Machines Corporation Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer
US5692911A (en) * 1996-03-27 1997-12-02 Electronic Products, Inc. Flexible electrical test fixure for integrated circuits on prototype and production printed circuit boards
US5789815A (en) * 1996-04-23 1998-08-04 Motorola, Inc. Three dimensional semiconductor package having flexible appendages
US5708568A (en) * 1996-06-17 1998-01-13 Sundstrand Corporation Electronic module with low impedance ground connection using flexible circuits
US5872337A (en) * 1996-09-09 1999-02-16 International Business Machines Corporation Chip carrier and cable assembly reinforced at edges
JP2001506779A (ja) * 1996-11-01 2001-05-22 ヴィーア・インコーポレイテッド 可撓性のある着用可能なコンピュータシステム
US6300679B1 (en) 1998-06-01 2001-10-09 Semiconductor Components Industries, Llc Flexible substrate for packaging a semiconductor component
US6316278B1 (en) * 1999-03-16 2001-11-13 Alien Technology Corporation Methods for fabricating a multiple modular assembly
US6563210B2 (en) * 2000-12-19 2003-05-13 Intel Corporation Parallel plane substrate
JP3687742B2 (ja) * 2001-07-13 2005-08-24 インターナショナル・ビジネス・マシーンズ・コーポレーション 機能拡張基板、通信用拡張基板、通信用拡張基板用の絶縁フィルム、コンピュータシステム、機能拡張基板の取り外し方法および電子回路用基板
US8847696B2 (en) * 2002-03-18 2014-09-30 Qualcomm Incorporated Flexible interconnect cable having signal trace pairs and ground layer pairs disposed on opposite sides of a flexible dielectric
US7336139B2 (en) * 2002-03-18 2008-02-26 Applied Micro Circuits Corporation Flexible interconnect cable with grounded coplanar waveguide
JP4122335B2 (ja) * 2002-12-09 2008-07-23 富士通株式会社 電子部品の実装構造及び実装方法
US7327022B2 (en) * 2002-12-30 2008-02-05 General Electric Company Assembly, contact and coupling interconnection for optoelectronics
US7239024B2 (en) * 2003-04-04 2007-07-03 Thomas Joel Massingill Semiconductor package with recess for die
US7239509B1 (en) 2004-10-18 2007-07-03 Matthew Roeske Modular computer components
US20090174991A1 (en) * 2008-01-05 2009-07-09 Mohhamad Mahdavi Generation Power Cable for Computers
CN112638043B (zh) * 2021-01-27 2022-04-01 东莞市若美电子科技有限公司 飞尾式结构的刚挠结合板制作方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3221095A (en) * 1962-07-09 1965-11-30 Reliable Electric Co Flexible connecting terminal assembly
US3546775A (en) * 1965-10-22 1970-12-15 Sanders Associates Inc Method of making multi-layer circuit
US3409732A (en) * 1966-04-07 1968-11-05 Electro Mechanisms Inc Stacked printed circuit board
DE2901416A1 (de) * 1979-01-15 1980-07-24 Vdo Schindling Anordnung zum elektrischen verbinden einer vielzahl von anschluessen
JPS57193094A (en) * 1981-05-18 1982-11-27 Matsushita Electric Ind Co Ltd Electronic circuit part and method of mounting same
US4754316A (en) * 1982-06-03 1988-06-28 Texas Instruments Incorporated Solid state interconnection system for three dimensional integrated circuit structures
US4587596A (en) * 1984-04-09 1986-05-06 Amp Incorporated High density mother/daughter circuit board connector
US4677527A (en) * 1984-07-09 1987-06-30 International Business Machines Corp. Compact electrical connection and distribution system for pluggable modular devices
JPS6151539U (pt) * 1984-09-03 1986-04-07
US4868712A (en) * 1987-02-04 1989-09-19 Woodman John K Three dimensional integrated circuit package
JPH01100227U (pt) * 1987-12-22 1989-07-05
US5058053A (en) * 1988-03-31 1991-10-15 International Business Machines Corporation High performance computer system with unidirectional information flow
US5008496A (en) * 1988-09-15 1991-04-16 Siemens Aktiengesellschaft Three-dimensional printed circuit board
US4902236A (en) * 1988-11-14 1990-02-20 E. I. Du Pont De Nemours And Company Flex circuit and cable assembly
US4976626A (en) * 1988-12-21 1990-12-11 International Business Machines Corporation Connector for connecting flexible film circuit carrier to board or card
JPH0334186U (pt) * 1989-08-08 1991-04-03
JPH0377393A (ja) * 1989-08-21 1991-04-02 Ok Print:Kk 配線基板装置
US5001604A (en) * 1989-10-26 1991-03-19 Lusby W Randolph Embedded testing circuit and method for fabricating same
US4997377A (en) * 1990-02-22 1991-03-05 Amp Incorporated Adaptor for computers
US5050039A (en) * 1990-06-26 1991-09-17 Digital Equipment Corporation Multiple circuit chip mounting and cooling arrangement
JP2875076B2 (ja) * 1990-11-29 1999-03-24 三井化学株式会社 フレキシブル配線基板

Also Published As

Publication number Publication date
JP2582527B2 (ja) 1997-02-19
JPH06250763A (ja) 1994-09-09
US5363275A (en) 1994-11-08

Similar Documents

Publication Publication Date Title
BR9400335A (pt) Componente modular de sistema de computador e método para produzir um sistema de computador com tal componente
DE69617171D1 (de) Rechneranordnung und Verfahren, um Systemdeltas zusammenzufügen
NO962333D0 (no) System og fremgangsmåte for celluloseinjeksjon
BR9200692A (pt) Estrutura de etiqueta,metodo de formacao de uma etiqueta impressa protegida e etiqueta
EP0532333A3 (en) A system and method for preventing deadlock in a multiprocessor environment
DE69424610D1 (de) Datenverarbeitungs-anlage und -verfahren
DE69421511T2 (de) Matrixanzeigesysteme und verfahren zu deren steuerung
DE59305898D1 (de) Optoelektronisches Bauelement und Verfahren zu dessen Herstellung
BR9101650A (pt) Metodo e sistema para geracao de uma representacao visual
GB9300942D0 (en) Parallel computer system
DE69423076D1 (de) Verteiltes Datenbankverarbeitungssystem
EP0483987A3 (en) Method and system for benchmarking computers
EP0523337A3 (en) Self-scheduling parallel computer system and method
EP0604052A3 (en) A method and system for locating objects with less than pixel accuracy.
BR9404783A (pt) Sistema submarino e processo para estender um sistema submarino
SE9400037D0 (sv) A device and method for forming a coating by pyrolysis
BR9406957A (pt) Sistema e processo para modelagem geométrica parameétrica aperfeiçoada
FI972494A0 (fi) Järjestelmiä ja menetelmiä biologista hajottamista varten
FI962103A (fi) Höyrystyslaite ja menetelmä
BR9300739A (pt) Processo hidrometalurgico para a obtencao de tantalo e niobio
BR9403467A (pt) Método e aparelho para a usinagem de peças temperadas
EP0614140A3 (en) System and method for avoiding a dead end in a computer.
BR9406340A (pt) Processo e sistema para selecionar um enlace livre
FI941414A (fi) Menetelmä ja laitteisto bioproteiinien valmistamiseksi
BR9206791A (pt) Processo e meio para realizar e manter um ambiente microbiologicalmente limpo em ambientes fechados

Legal Events

Date Code Title Description
FA10 Dismissal: dismissal - article 33 of industrial property law
HKFN Application deemed withdrawn (deleted)
FA7 Application withdrawn (art. 18 par. 1 of law 5772/71) - being contrary to morals, good customs and public security, order and health