BR8704363A - Processo para deposicao controlada de metal em uma matriz composicao de no minimo duas matrizes separadas - Google Patents

Processo para deposicao controlada de metal em uma matriz composicao de no minimo duas matrizes separadas

Info

Publication number
BR8704363A
BR8704363A BR8704363A BR8704363A BR8704363A BR 8704363 A BR8704363 A BR 8704363A BR 8704363 A BR8704363 A BR 8704363A BR 8704363 A BR8704363 A BR 8704363A BR 8704363 A BR8704363 A BR 8704363A
Authority
BR
Brazil
Prior art keywords
metal
controlled deposition
composition matrix
separate matrices
matrices
Prior art date
Application number
BR8704363A
Other languages
English (en)
Inventor
Moshe Levy
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of BR8704363A publication Critical patent/BR8704363A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
BR8704363A 1986-08-29 1987-08-25 Processo para deposicao controlada de metal em uma matriz composicao de no minimo duas matrizes separadas BR8704363A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/901,770 US4668354A (en) 1986-08-29 1986-08-29 Electrocatalytic deposition of metals in solid polymeric matrices

Publications (1)

Publication Number Publication Date
BR8704363A true BR8704363A (pt) 1988-04-19

Family

ID=25414786

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8704363A BR8704363A (pt) 1986-08-29 1987-08-25 Processo para deposicao controlada de metal em uma matriz composicao de no minimo duas matrizes separadas

Country Status (10)

Country Link
US (1) US4668354A (pt)
EP (1) EP0259126B1 (pt)
JP (1) JPS6369995A (pt)
KR (1) KR900005138B1 (pt)
AU (1) AU597712B2 (pt)
BR (1) BR8704363A (pt)
CA (1) CA1324338C (pt)
DE (1) DE3769403D1 (pt)
HK (1) HK53091A (pt)
SG (1) SG43291G (pt)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4774157A (en) * 1987-05-19 1988-09-27 E. I. Du Pont De Nemours And Company Patterned metal interlayer in a matrix
US5135779A (en) * 1988-12-23 1992-08-04 International Business Machines Corporation Method for conditioning an organic polymeric material
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
US5175399A (en) * 1989-08-29 1992-12-29 Mitsubishi Denki Kabushiki Kaisha Wiring panel including wiring having a surface-reforming layer and method for producing the same
US5133840A (en) * 1990-05-15 1992-07-28 International Business Machines Corporation Surface midification of a polyimide
JP2524436B2 (ja) * 1990-09-18 1996-08-14 インターナショナル・ビジネス・マシーンズ・コーポレイション 表面処理方法
US5318803A (en) * 1990-11-13 1994-06-07 International Business Machines Corporation Conditioning of a substrate for electroless plating thereon
JP2768390B2 (ja) * 1990-12-11 1998-06-25 インターナショナル・ビジネス・マシーンズ・コーポレイション 無電解金属付着のために基体をコンディショニングする方法
JPH11335888A (ja) * 1998-05-25 1999-12-07 Hitachi Ltd めっき液およびめっき方法
US7384533B2 (en) * 2001-07-24 2008-06-10 3M Innovative Properties Company Electrolytic processes with reduced cell voltage and gas formation
ES2524972T3 (es) * 2009-07-27 2014-12-16 F.Hoffmann-La Roche Ag Método y sustancias para la preparación de compuestos de piridinio N-sustituidos
JP5681916B2 (ja) * 2010-11-01 2015-03-11 イーメックス株式会社 高分子電解質複合体の製造方法
JP5938426B2 (ja) * 2014-02-04 2016-06-22 株式会社豊田中央研究所 電気めっきセル、及び、金属皮膜の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4512855A (en) * 1984-07-23 1985-04-23 E. I. Du Pont De Nemours And Company Deposition of metals as interlayers within organic polymeric films

Also Published As

Publication number Publication date
SG43291G (en) 1991-07-26
EP0259126B1 (en) 1991-04-17
US4668354A (en) 1987-05-26
JPH0242914B2 (pt) 1990-09-26
HK53091A (en) 1991-07-19
KR880003035A (ko) 1988-05-13
KR900005138B1 (ko) 1990-07-20
JPS6369995A (ja) 1988-03-30
EP0259126A1 (en) 1988-03-09
CA1324338C (en) 1993-11-16
AU7769787A (en) 1988-03-03
DE3769403D1 (de) 1991-05-23
AU597712B2 (en) 1990-06-07

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Legal Events

Date Code Title Description
FB19 Grant procedure suspended (art. 19)
FA2 Application deemed withdrawn (art. 19(5))