HK53091A - Catalytic deposition of metals in solid matrices - Google Patents

Catalytic deposition of metals in solid matrices

Info

Publication number
HK53091A
HK53091A HK530/91A HK53091A HK53091A HK 53091 A HK53091 A HK 53091A HK 530/91 A HK530/91 A HK 530/91A HK 53091 A HK53091 A HK 53091A HK 53091 A HK53091 A HK 53091A
Authority
HK
Hong Kong
Prior art keywords
metals
solid matrices
catalytic deposition
catalytic
deposition
Prior art date
Application number
HK530/91A
Other languages
English (en)
Inventor
Moshe Levy
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of HK53091A publication Critical patent/HK53091A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Catalysts (AREA)
  • Inert Electrodes (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
HK530/91A 1986-08-29 1991-07-11 Catalytic deposition of metals in solid matrices HK53091A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/901,770 US4668354A (en) 1986-08-29 1986-08-29 Electrocatalytic deposition of metals in solid polymeric matrices

Publications (1)

Publication Number Publication Date
HK53091A true HK53091A (en) 1991-07-19

Family

ID=25414786

Family Applications (1)

Application Number Title Priority Date Filing Date
HK530/91A HK53091A (en) 1986-08-29 1991-07-11 Catalytic deposition of metals in solid matrices

Country Status (10)

Country Link
US (1) US4668354A (xx)
EP (1) EP0259126B1 (xx)
JP (1) JPS6369995A (xx)
KR (1) KR900005138B1 (xx)
AU (1) AU597712B2 (xx)
BR (1) BR8704363A (xx)
CA (1) CA1324338C (xx)
DE (1) DE3769403D1 (xx)
HK (1) HK53091A (xx)
SG (1) SG43291G (xx)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4774157A (en) * 1987-05-19 1988-09-27 E. I. Du Pont De Nemours And Company Patterned metal interlayer in a matrix
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
US5135779A (en) * 1988-12-23 1992-08-04 International Business Machines Corporation Method for conditioning an organic polymeric material
US5175399A (en) * 1989-08-29 1992-12-29 Mitsubishi Denki Kabushiki Kaisha Wiring panel including wiring having a surface-reforming layer and method for producing the same
US5133840A (en) * 1990-05-15 1992-07-28 International Business Machines Corporation Surface midification of a polyimide
JP2524436B2 (ja) * 1990-09-18 1996-08-14 インターナショナル・ビジネス・マシーンズ・コーポレイション 表面処理方法
US5318803A (en) * 1990-11-13 1994-06-07 International Business Machines Corporation Conditioning of a substrate for electroless plating thereon
JP2768390B2 (ja) * 1990-12-11 1998-06-25 インターナショナル・ビジネス・マシーンズ・コーポレイション 無電解金属付着のために基体をコンディショニングする方法
JPH11335888A (ja) * 1998-05-25 1999-12-07 Hitachi Ltd めっき液およびめっき方法
US7384533B2 (en) * 2001-07-24 2008-06-10 3M Innovative Properties Company Electrolytic processes with reduced cell voltage and gas formation
WO2011012271A2 (en) * 2009-07-27 2011-02-03 Roche Diagnostics Gmbh Method and substances for preparation of n-substituted pyridinium compounds
JP5681916B2 (ja) * 2010-11-01 2015-03-11 イーメックス株式会社 高分子電解質複合体の製造方法
JP5938426B2 (ja) * 2014-02-04 2016-06-22 株式会社豊田中央研究所 電気めっきセル、及び、金属皮膜の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4512855A (en) * 1984-07-23 1985-04-23 E. I. Du Pont De Nemours And Company Deposition of metals as interlayers within organic polymeric films

Also Published As

Publication number Publication date
CA1324338C (en) 1993-11-16
AU7769787A (en) 1988-03-03
US4668354A (en) 1987-05-26
JPS6369995A (ja) 1988-03-30
DE3769403D1 (de) 1991-05-23
BR8704363A (pt) 1988-04-19
EP0259126B1 (en) 1991-04-17
KR900005138B1 (ko) 1990-07-20
JPH0242914B2 (xx) 1990-09-26
AU597712B2 (en) 1990-06-07
EP0259126A1 (en) 1988-03-09
KR880003035A (ko) 1988-05-13
SG43291G (en) 1991-07-26

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