BR8603692A - Metodos para confeccionar um laminado de superficie nivelada para uma placa de circuito multicamadas - Google Patents

Metodos para confeccionar um laminado de superficie nivelada para uma placa de circuito multicamadas

Info

Publication number
BR8603692A
BR8603692A BR8603692A BR8603692A BR8603692A BR 8603692 A BR8603692 A BR 8603692A BR 8603692 A BR8603692 A BR 8603692A BR 8603692 A BR8603692 A BR 8603692A BR 8603692 A BR8603692 A BR 8603692A
Authority
BR
Brazil
Prior art keywords
making
methods
circuit board
multilayer circuit
surface laminate
Prior art date
Application number
BR8603692A
Other languages
English (en)
Portuguese (pt)
Inventor
Theron Larue Ellis
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of BR8603692A publication Critical patent/BR8603692A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09718—Clearance holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
BR8603692A 1985-08-26 1986-08-05 Metodos para confeccionar um laminado de superficie nivelada para uma placa de circuito multicamadas BR8603692A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US76952485A 1985-08-26 1985-08-26

Publications (1)

Publication Number Publication Date
BR8603692A true BR8603692A (pt) 1987-03-10

Family

ID=25085713

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8603692A BR8603692A (pt) 1985-08-26 1986-08-05 Metodos para confeccionar um laminado de superficie nivelada para uma placa de circuito multicamadas

Country Status (6)

Country Link
EP (1) EP0213336B1 (enExample)
JP (1) JPS6247199A (enExample)
AU (1) AU582251B2 (enExample)
BR (1) BR8603692A (enExample)
CA (1) CA1283591C (enExample)
DE (1) DE3679014D1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02237197A (ja) * 1989-03-10 1990-09-19 Hitachi Ltd 多層回路基板及びその製造方法並びにその用途
US5173150A (en) * 1990-04-23 1992-12-22 Mitsubishi Gas Chemical Co., Ltd. Process for producing printed circuit board
JP3000898B2 (ja) * 1995-07-12 2000-01-17 トヨタ自動車株式会社 自動車の衝撃エネルギ吸収構造
KR100733253B1 (ko) * 2005-11-18 2007-06-27 삼성전기주식회사 고밀도 인쇄회로기판 및 그 제조방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3161945A (en) * 1958-05-21 1964-12-22 Rogers Corp Method of making a printed circuit
NL166171C (nl) * 1971-06-07 1981-01-15 Hollandse Signaalapparaten Bv Werkwijze voor het vervaardigen van, uit meerdere lagen opgebouwde, gedrukte schakelingen en inrichting ter realisering van deze werkwijze.
JPS5029938B2 (enExample) * 1972-07-05 1975-09-27
DE2444698C3 (de) * 1974-09-18 1978-08-24 Siemens Ag, 1000 Berlin Und 8000 Muenchen Einrichtung zum Verpressen großflächiger mehrlagiger Leiterplatten
JPS56105690A (en) * 1980-01-28 1981-08-22 Hitachi Ltd Multilayer substrate
JPS57134987A (en) * 1981-02-16 1982-08-20 Hitachi Ltd Ceramic circuit board
US4354895A (en) * 1981-11-27 1982-10-19 International Business Machines Corporation Method for making laminated multilayer circuit boards

Also Published As

Publication number Publication date
JPH0210596B2 (enExample) 1990-03-08
EP0213336B1 (en) 1991-05-02
AU5949486A (en) 1987-03-05
DE3679014D1 (de) 1991-06-06
EP0213336A1 (en) 1987-03-11
CA1283591C (en) 1991-04-30
JPS6247199A (ja) 1987-02-28
AU582251B2 (en) 1989-03-16

Similar Documents

Publication Publication Date Title
ES539843A0 (es) Una disposicion de placa de circuito impreso para componen- tes electronicos
ES296295Y (es) Una disposicion para la refrigeracion de placas de circuitos impresos
BR8506566A (pt) Placa de circuito impresso em multi-camadas de alta densidade
DK293385A (da) Fleksibelt polyimid-flerlagslaminat
ES535699A0 (es) Procedimiento para la fabricacion de una placa estampada de estratos multiples
ES539841A0 (es) Una instalacion de refrigeracion para un dispositivo de cir-cuitos electronicos que utiliza una placa de circuito impre-so
ES524156A0 (es) Metodo para confeccionar un tablero de circuito impreso
EP0147014A3 (en) Multilayer printed circuit board structure
ES533132A0 (es) Un procedimiento para preparar un panel de circuito impreso
DE3278193D1 (en) Method for fabricating multilayer laminated printed circuit boards
ES283351Y (es) Dispositivo de fijacion para el acoplamiento de un articulo a una placa de circuito impreso.
DE3679627D1 (de) Mehrschichtige gedruckte schaltungsplatte.
BR9007972A (pt) Receptaculo de blindagem para uma area de uma placa de circuitoimpresso
BR8807087A (pt) Pino fixado a uma placa de circuito impresso
BR8801152A (pt) Metodo para metalizar uma pelicula de poliolefina
GB2092830B (en) Multilayer printed circuit board
AU582251B2 (en) Method for making a flush surface laminate for a multilayer circuit board
GB2202094B (en) Multilayer printed circuit board
BR8300788A (pt) Conector de pressao para placas de circuito impresso
ES544405A0 (es) Procedimiento para la fabricacion de placas de circuito impreso de capas multiples.
JPS57118698A (en) Method of laminating multilayer printed board
JPS57143891A (en) Multilayer circuit board
BR8401006A (pt) Configuracao de placa de circuito impresso para um computador pessoal
DE3676822D1 (de) Mehrschichtige gedruckte verdrahtungsplatte.
BR8801234A (pt) Placa de circuito impresso de parede posterior

Legal Events

Date Code Title Description
B21A Expiry acc. art. 78, item i of ipl- expiry of the term of protection

Free format text: PATENTE EXTINTA EM 05/08/2001

B15K Others concerning applications: alteration of classification

Ipc: H05K 3/46 (2006.01), H05K 3/20 (2006.0