BR8500476A - Processo para a preparacao de resinas epoxi curadas dotadas de excelente resistencia a fragmentacao,a umidade e ao choque termico - Google Patents

Processo para a preparacao de resinas epoxi curadas dotadas de excelente resistencia a fragmentacao,a umidade e ao choque termico

Info

Publication number
BR8500476A
BR8500476A BR8500476A BR8500476A BR8500476A BR 8500476 A BR8500476 A BR 8500476A BR 8500476 A BR8500476 A BR 8500476A BR 8500476 A BR8500476 A BR 8500476A BR 8500476 A BR8500476 A BR 8500476A
Authority
BR
Brazil
Prior art keywords
fragmentation
moisture
preparation
epoxy resins
thermal shock
Prior art date
Application number
BR8500476A
Other languages
English (en)
Inventor
David Helfand
Kevin J Cheetham
Original Assignee
Ciba Geigy Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy Ag filed Critical Ciba Geigy Ag
Publication of BR8500476A publication Critical patent/BR8500476A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
BR8500476A 1984-02-03 1985-02-01 Processo para a preparacao de resinas epoxi curadas dotadas de excelente resistencia a fragmentacao,a umidade e ao choque termico BR8500476A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US57669884A 1984-02-03 1984-02-03

Publications (1)

Publication Number Publication Date
BR8500476A true BR8500476A (pt) 1985-09-17

Family

ID=24305595

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8500476A BR8500476A (pt) 1984-02-03 1985-02-01 Processo para a preparacao de resinas epoxi curadas dotadas de excelente resistencia a fragmentacao,a umidade e ao choque termico

Country Status (4)

Country Link
EP (1) EP0151553A3 (pt)
JP (1) JPS60181120A (pt)
BR (1) BR8500476A (pt)
ES (1) ES8605834A1 (pt)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0694499B2 (ja) * 1985-04-25 1994-11-24 住友化学工業株式会社 エポキシ樹脂組成物
JPH0662740B2 (ja) * 1985-06-05 1994-08-17 三井石油化学工業株式会社 成形品の製造法
JPS6220555A (ja) * 1985-07-18 1987-01-29 Mitsubishi Electric Corp エポキシ樹脂組成物
JPS6234949A (ja) * 1985-08-08 1987-02-14 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
NL9402233A (nl) * 1994-12-29 1996-08-01 3P Licensing Bv Werkwijze voor het omhullen van een elektronische component, een aldus omhulde elektronische component en daarvoor bestemd kunststofmateriaal.
CN102796346A (zh) * 2011-06-01 2012-11-28 深圳光启高等理工研究院 改性环氧树脂和基于改性环氧树脂制备基材的方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3383433A (en) * 1964-09-22 1968-05-14 Union Carbide Corp Epoxide resins cured with phenolic novolacs and triazoles or tetrazoles
GB1169613A (en) * 1967-02-21 1969-11-05 Ciba Ltd Epoxide Resin Compositions
GB1306231A (pt) * 1969-10-24 1973-02-07

Also Published As

Publication number Publication date
EP0151553A2 (de) 1985-08-14
ES540045A0 (es) 1986-04-01
JPS60181120A (ja) 1985-09-14
ES8605834A1 (es) 1986-04-01
EP0151553A3 (de) 1987-05-27

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