BR7505844A - Processo e molde para encapsular componentes eletricos - Google Patents

Processo e molde para encapsular componentes eletricos

Info

Publication number
BR7505844A
BR7505844A BR7505844*A BR7505844A BR7505844A BR 7505844 A BR7505844 A BR 7505844A BR 7505844 A BR7505844 A BR 7505844A BR 7505844 A BR7505844 A BR 7505844A
Authority
BR
Brazil
Prior art keywords
template
electrical components
encapsulating electrical
encapsulating
components
Prior art date
Application number
BR7505844*A
Other languages
English (en)
Portuguese (pt)
Inventor
A Strom
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Publication of BR7505844A publication Critical patent/BR7505844A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/003—Apparatus or processes for encapsulating capacitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Details Of Resistors (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
BR7505844*A 1974-09-19 1975-09-11 Processo e molde para encapsular componentes eletricos BR7505844A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE7411786A SE389991B (sv) 1974-09-19 1974-09-19 Metod for kapsling av elektriska komponenter samt anordning herfor

Publications (1)

Publication Number Publication Date
BR7505844A true BR7505844A (pt) 1976-08-03

Family

ID=20322167

Family Applications (1)

Application Number Title Priority Date Filing Date
BR7505844*A BR7505844A (pt) 1974-09-19 1975-09-11 Processo e molde para encapsular componentes eletricos

Country Status (11)

Country Link
US (1) US4045867A (https=)
JP (1) JPS5914882B2 (https=)
BR (1) BR7505844A (https=)
CA (1) CA1043974A (https=)
CH (1) CH592354A5 (https=)
DE (1) DE2535923C3 (https=)
ES (1) ES440787A1 (https=)
FR (1) FR2285225A1 (https=)
GB (1) GB1509738A (https=)
IT (1) IT1046891B (https=)
SE (1) SE389991B (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4497756A (en) * 1981-10-05 1985-02-05 Gte Products Corporation Method of making a photoflash article using injection molding
FR2518808A1 (fr) * 1981-12-18 1983-06-24 Radiotechnique Compelec Procede et dispositif pour enrober un microassemblage
FR2549291B2 (fr) * 1982-10-29 1986-05-09 Radiotechnique Compelec Procede d'encapsulation de composants electroniques par extrusion de matiere plastique et applications a la fabrication de voyants lumineux et a l'encapsulation de circuits electroniques
IT1180514B (it) * 1984-07-27 1987-09-23 Arcotroniks Italia Spa Procedimento per la realizzazione di involucri protettivi in cui risultano annegati corrispondenti componenti elettrico elettronici
FR2590838B1 (fr) * 1985-12-04 1988-07-08 Plastic Omnium Cie Paniers pour le traitement de composants dans l'industrie des semiconducteurs et procede de fabrication de ces paniers
JPS62133768U (https=) * 1986-02-14 1987-08-22
US4826931A (en) * 1986-10-09 1989-05-02 Mitsubishi Denki Kabushiki Kaisha Tablet for resin-molding semiconductor devices
GB2219960B (en) * 1988-06-21 1992-12-23 Avery Ltd W & T Manufacture of electronic tokens
US5387306A (en) * 1988-06-21 1995-02-07 Gec Avery Limited Manufacturing integrated circuit cards
US4895998A (en) * 1988-08-15 1990-01-23 Mcneil (Ohio) Corporation Encapsulated electrical component and method of making same
US5348475A (en) * 1991-05-08 1994-09-20 Jeneric/Pentron Inc. Trimodal method of curing dental restorative compositions
US5357399A (en) * 1992-09-25 1994-10-18 Avx Corporation Mass production method for the manufacture of surface mount solid state capacitor and resulting capacitor
JP2970338B2 (ja) * 1993-09-22 1999-11-02 住友電装株式会社 電線接続部の自動防水処理装置
US6173490B1 (en) * 1997-08-20 2001-01-16 National Semiconductor Corporation Method for forming a panel of packaged integrated circuits
US7632446B1 (en) * 2008-05-28 2009-12-15 Lincoln Global, Inc. System and method of sealing electrical components in a frame tray
CN105742082B (zh) * 2016-03-30 2019-01-18 安徽诚越电子科技有限公司 一种电容器密封控制系统
CN105826091B (zh) * 2016-03-30 2019-05-17 安徽普和电子有限公司 一种电容器自动组装系统
CN105869928B (zh) * 2016-03-30 2018-10-12 安徽普和电子有限公司 一种电容器壳体和芯体组装控制系统

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB712289A (en) * 1951-11-29 1954-07-21 Standard Telephones Cables Ltd Method of coating a plurality of electric impedance elements, such as condensers, and an impedance element coated in accordance with that method
US2758183A (en) * 1952-03-05 1956-08-07 Seci Process for making electric resistors and electric resistors made with that process
US2856639A (en) * 1953-04-13 1958-10-21 Bernard F Forrest Method of encasing electric coils
US2894316A (en) * 1955-01-21 1959-07-14 Chicago Condenser Corp Method of spacing capacitor leads
US2960641A (en) * 1958-06-23 1960-11-15 Sylvania Electric Prod Hermetically sealed semiconductor device and manufacture thereof
US3141049A (en) * 1961-06-05 1964-07-14 Gen Electric Methods for filling electrical apparatus with potting material
DE1439262B2 (de) * 1963-07-23 1972-03-30 Siemens AG, 1000 Berlin u. 8000 München Verfahren zum kontaktieren von halbleiterbauelementen durch thermokompression
US3261902A (en) * 1964-09-08 1966-07-19 Mallory & Co Inc P R Method of making encapsulated capacitor
US3560813A (en) * 1969-03-13 1971-02-02 Fairchild Camera Instr Co Hybridized monolithic array package
US3731371A (en) * 1970-03-02 1973-05-08 Union Carbide Corp Solid electrolytic capacitors and process

Also Published As

Publication number Publication date
CA1043974A (en) 1978-12-12
SE389991B (sv) 1976-11-29
CH592354A5 (https=) 1977-10-31
SE7411786L (sv) 1976-03-22
FR2285225A1 (fr) 1976-04-16
DE2535923B2 (de) 1977-07-14
DE2535923C3 (de) 1980-11-13
JPS5914882B2 (ja) 1984-04-06
US4045867A (en) 1977-09-06
FR2285225B1 (https=) 1979-08-24
JPS5158650A (https=) 1976-05-22
DE2535923A1 (de) 1976-04-01
IT1046891B (it) 1980-07-31
ES440787A1 (es) 1977-04-01
GB1509738A (en) 1978-05-04

Similar Documents

Publication Publication Date Title
BR7505844A (pt) Processo e molde para encapsular componentes eletricos
BR7505255A (pt) Molde e processo de fundicao por revestimento
BR7501148A (pt) Dispositivo e processo untra-sonico
BR7500993A (pt) Aparelho e processo para processamento de condutores eletricos
BR7500739A (pt) Isolador e processo para sua fabricacao
BR7607917A (pt) Processo para a encapsulacao de material em particulas finamente divivido
BR7502931A (pt) Molde e processo para producao de uma dentadura
BR7402645D0 (pt) Processo e aparelho de fabricar equipamento eletrico
BR7506645A (pt) Processo aperfeicoado para a fabricacao de maquinas eletricas e maquina fabricada de acordo com o mesmo
BR7502773A (pt) Aperfeicoamento em processo pra producao de n-metil-nitroftamidas
IT1039819B (it) Fenileteri e processo per la loro prepazazione
BR7504447A (pt) Aperfeicoamentos em processo e aparelho para preparar moldes a base de areia
BR7406675A (pt) Aparelho e processo para a introducao de aditivos dentro de um molde de fundicao
BR7500118A (pt) Aperfeicoamento em terminal eletrico e em processo para fabricar o mesmo
BR7503777A (pt) Dispositivo semicondutor e processo de fabricacao do mesm
BR7503014A (pt) Processo e dispositivo para a fabricacao de continuidade de cintas isolantes
IT1019678B (it) N-6-alchil-iminoalani-oligomerici e processo per la loro preparazione
BR7506530A (pt) Composicoes e processo fungicidas
BR7401345D0 (pt) Aparelho e processo eletrofotograficos
BR7503293A (pt) Interruptor-comutador eletrico e seu processo de montagem
BR7410556D0 (pt) Processo para manufatura de neo-hesperidina di-hidro-calcona
BR7601989A (pt) Processo para ligacao de condutores e ligacao e estrutura de semicondutor resultante
BR7500756A (pt) Aperfeicoamento em processo para a preparacao de diotio-anilina
BR7508650A (pt) Processo para preparacao de 1-nitroantraquinona pura
BR7504250A (pt) Processo para a fabricacao e formacao de etalocianina de cobre

Legal Events

Date Code Title Description
B15K Others concerning applications: alteration of classification

Ipc: H01G 4/224 (2006.01), H01G 13/00 (2013.0