BR7404050D0 - Artigo com substrato de aluminio e placa de impressao litografica, processos e aparelhos de tratamento de aluminio e artigos revestidos de aluminio, e processo e aparelhos de galvanizar e anodizar - Google Patents

Artigo com substrato de aluminio e placa de impressao litografica, processos e aparelhos de tratamento de aluminio e artigos revestidos de aluminio, e processo e aparelhos de galvanizar e anodizar

Info

Publication number
BR7404050D0
BR7404050D0 BR4050/74A BR405074A BR7404050D0 BR 7404050 D0 BR7404050 D0 BR 7404050D0 BR 4050/74 A BR4050/74 A BR 4050/74A BR 405074 A BR405074 A BR 405074A BR 7404050 D0 BR7404050 D0 BR 7404050D0
Authority
BR
Brazil
Prior art keywords
aluminum
appliances
galvanizing
article
printing plate
Prior art date
Application number
BR4050/74A
Other languages
English (en)
Portuguese (pt)
Inventor
H Fromson
Original Assignee
Fromson H A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US361720A external-priority patent/US3865700A/en
Application filed by Fromson H A filed Critical Fromson H A
Publication of BR7404050D0 publication Critical patent/BR7404050D0/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/005—Apparatus specially adapted for electrolytic conversion coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/625—Discontinuous layers, e.g. microcracked layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrochemical Coating By Surface Reaction (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Catalysts (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Chemically Coating (AREA)
BR4050/74A 1973-05-18 1974-05-17 Artigo com substrato de aluminio e placa de impressao litografica, processos e aparelhos de tratamento de aluminio e artigos revestidos de aluminio, e processo e aparelhos de galvanizar e anodizar BR7404050D0 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US361720A US3865700A (en) 1973-05-18 1973-05-18 Process and apparatus for continuously anodizing aluminum
US449162A US3929594A (en) 1973-05-18 1974-03-07 Electroplated anodized aluminum articles

Publications (1)

Publication Number Publication Date
BR7404050D0 true BR7404050D0 (pt) 1974-12-03

Family

ID=27001395

Family Applications (1)

Application Number Title Priority Date Filing Date
BR4050/74A BR7404050D0 (pt) 1973-05-18 1974-05-17 Artigo com substrato de aluminio e placa de impressao litografica, processos e aparelhos de tratamento de aluminio e artigos revestidos de aluminio, e processo e aparelhos de galvanizar e anodizar

Country Status (8)

Country Link
US (1) US3929594A (enExample)
JP (2) JPS5546320B2 (enExample)
BR (1) BR7404050D0 (enExample)
CA (1) CA1035722A (enExample)
DE (4) DE2462450A1 (enExample)
FR (1) FR2248332B1 (enExample)
GB (1) GB1473347A (enExample)
IT (1) IT1011370B (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4021592A (en) * 1974-03-07 1977-05-03 Fromson H A Process of making electroplated anodized aluminum articles and electroless plating
US4014756A (en) * 1976-01-21 1977-03-29 Fromson H A Process for making metal powders
DE2616662C2 (de) * 1976-04-15 1984-02-02 Dornier System Gmbh, 7990 Friedrichshafen Verfahren zur herstellung einer selektiven solarabsorberschicht auf aluminium
JPS53100508A (en) * 1977-02-16 1978-09-02 Hitachi Cable Ltd Rigid trolley
US4371430A (en) * 1979-04-27 1983-02-01 Printing Developments, Inc. Electrodeposition of chromium on metal base lithographic sheet
JPS55176624U (enExample) * 1979-06-01 1980-12-18
US4406757A (en) * 1982-03-29 1983-09-27 Polychrome Corporation Anodization method
US4526671A (en) * 1982-09-24 1985-07-02 Pilot Man-Nen-Hitsu Kabushiki Kaisha Surface treatment of aluminum or aluminum alloys
DE3636129A1 (de) * 1986-10-23 1988-05-05 Man Technologie Gmbh Druckform fuer den flachdruck
US4862799A (en) * 1987-11-13 1989-09-05 Rockwell International Corporation Copper coated anodized aluminum ink metering roller
US5693207A (en) * 1995-07-13 1997-12-02 Howard A. Fromson Catalyst preparation
US6479430B1 (en) * 1995-07-13 2002-11-12 Howard A. Fromson Catalyst preparation
US6083871A (en) * 1999-03-30 2000-07-04 Howard A. Fromson Catalyst structure and method of manufacture
US6214765B1 (en) 1999-11-02 2001-04-10 Howard A. Fromson Catalyst product and method of manufacture
WO2014130453A1 (en) * 2013-02-19 2014-08-28 Alumiplate, Inc. Methods for improving adhesion of aluminum films
US9972877B2 (en) 2014-07-14 2018-05-15 Palo Alto Research Center Incorporated Metamaterial-based phase shifting element and phased array
US10355356B2 (en) 2014-07-14 2019-07-16 Palo Alto Research Center Incorporated Metamaterial-based phase shifting element and phased array
US9871298B2 (en) 2014-12-23 2018-01-16 Palo Alto Research Center Incorporated Rectifying circuit for multiband radio frequency (RF) energy harvesting
US9935370B2 (en) 2014-12-23 2018-04-03 Palo Alto Research Center Incorporated Multiband radio frequency (RF) energy harvesting with scalable antenna
US20160362807A1 (en) * 2015-06-15 2016-12-15 Palo Alto Research Center Incorporated Producing Passive Radiative Cooling Panels And Modules
US10060686B2 (en) 2015-06-15 2018-08-28 Palo Alto Research Center Incorporated Passive radiative dry cooling module/system using metamaterials
US9927188B2 (en) 2015-06-15 2018-03-27 Palo Alto Research Center Incorporated Metamaterials-enhanced passive radiative cooling panel
CN113699573A (zh) * 2020-05-20 2021-11-26 苹果公司 非水性铝阳极化
CN112941514A (zh) * 2021-02-05 2021-06-11 南昌航空大学 一种铜/镍反应性纳米多层膜的制备方法
WO2024197168A1 (en) * 2023-03-22 2024-09-26 General Electric Company Component protected with an array of discrete reactive deposits for regenerative surface treatment

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE606850C (de) * 1930-11-07 1934-12-12 Siemens Ag Verfahren zur Erzeugung festhaftender galvanischer Niederschlaege auf Aluminium und dessen Legierungen
US2798037A (en) * 1953-05-13 1957-07-02 Sprague Electric Co Aluminum oxide films
US2930951A (en) * 1957-07-08 1960-03-29 Gen Electric Electrical capacitor
US2898490A (en) * 1957-12-23 1959-08-04 Gen Electric Target plate
US3099609A (en) * 1961-09-11 1963-07-30 Katayose Kimiyoshi Method of electroplating aluminum or its alloy with porous hard chromium

Also Published As

Publication number Publication date
JPS5041729A (enExample) 1975-04-16
JPS5636879B2 (enExample) 1981-08-27
FR2248332B1 (enExample) 1979-07-27
AU6878374A (en) 1975-11-13
GB1473347A (en) 1977-05-11
JPS54109038A (en) 1979-08-27
CA1035722A (en) 1978-08-01
DE2422918A1 (de) 1974-12-05
DE2422918B2 (de) 1977-12-08
FR2248332A1 (enExample) 1975-05-16
DE2462450A1 (de) 1977-03-31
DE2422918C3 (de) 1978-08-17
JPS5546320B2 (enExample) 1980-11-22
IT1011370B (it) 1977-01-20
DE2462448A1 (de) 1977-03-31
DE2462449A1 (de) 1977-03-31
US3929594A (en) 1975-12-30

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