BR7100263D0 - Eletrodeposicao de cobre em banhos acidos - Google Patents

Eletrodeposicao de cobre em banhos acidos

Info

Publication number
BR7100263D0
BR7100263D0 BR263/71A BR26371A BR7100263D0 BR 7100263 D0 BR7100263 D0 BR 7100263D0 BR 263/71 A BR263/71 A BR 263/71A BR 26371 A BR26371 A BR 26371A BR 7100263 D0 BR7100263 D0 BR 7100263D0
Authority
BR
Brazil
Prior art keywords
acid baths
copper electrodeposition
electrodeposition
copper
baths
Prior art date
Application number
BR263/71A
Other languages
English (en)
Portuguese (pt)
Inventor
Udylite Corp The
Original Assignee
Udylite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Udylite Corp filed Critical Udylite Corp
Publication of BR7100263D0 publication Critical patent/BR7100263D0/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
BR263/71A 1970-02-12 1971-01-15 Eletrodeposicao de cobre em banhos acidos BR7100263D0 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1102470A 1970-02-12 1970-02-12

Publications (1)

Publication Number Publication Date
BR7100263D0 true BR7100263D0 (pt) 1973-05-24

Family

ID=21748527

Family Applications (1)

Application Number Title Priority Date Filing Date
BR263/71A BR7100263D0 (pt) 1970-02-12 1971-01-15 Eletrodeposicao de cobre em banhos acidos

Country Status (6)

Country Link
JP (1) JPS5118894B1 (de)
BR (1) BR7100263D0 (de)
FR (1) FR2079372B1 (de)
GB (1) GB1313197A (de)
NL (1) NL172085C (de)
ZA (1) ZA708430B (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ZA739310B (en) * 1972-12-14 1974-11-27 M & T Chemicals Inc Electrode position of copper
JPS53114596U (de) * 1977-02-14 1978-09-12
CA1105045A (en) * 1977-05-04 1981-07-14 Hans G. Creutz (Deceased) Electrodeposition of copper
AU559896B2 (en) * 1983-06-10 1987-03-26 Omi International Corp. Electrolytic copper depositing processes
US8002962B2 (en) 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
US7316772B2 (en) 2002-03-05 2008-01-08 Enthone Inc. Defect reduction in electrodeposited copper for semiconductor applications
CN103397354B (zh) * 2013-08-08 2016-10-26 上海新阳半导体材料股份有限公司 一种用于减少硅通孔技术镀铜退火后空洞的添加剂
CN114351195A (zh) * 2022-03-19 2022-04-15 深圳市创智成功科技有限公司 一种脉冲通孔填孔的电镀铜配方及其电镀工艺

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1246347B (de) * 1966-03-08 1967-08-03 Schering Ag Saures galvanisches Kupferbad
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths

Also Published As

Publication number Publication date
ZA708430B (en) 1971-09-29
NL172085C (nl) 1983-07-01
GB1313197A (en) 1973-04-11
JPS5118894B1 (de) 1976-06-14
FR2079372B1 (de) 1974-02-22
DE2105472A1 (de) 1971-08-26
DE2105472B2 (de) 1975-11-20
FR2079372A1 (de) 1971-11-12
NL7100321A (de) 1971-08-16

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