BR112018009241A2 - dispositivo criptográfico disposto de modo a computar uma cifra de bloco-alvo em uma mensagem de entrada, método criptográfico para computar uma cifra de bloco-alvo em uma mensagem de entrada, programa de computador e mídia legível por computador - Google Patents
dispositivo criptográfico disposto de modo a computar uma cifra de bloco-alvo em uma mensagem de entrada, método criptográfico para computar uma cifra de bloco-alvo em uma mensagem de entrada, programa de computador e mídia legível por computadorInfo
- Publication number
- BR112018009241A2 BR112018009241A2 BR112018009241A BR112018009241A BR112018009241A2 BR 112018009241 A2 BR112018009241 A2 BR 112018009241A2 BR 112018009241 A BR112018009241 A BR 112018009241A BR 112018009241 A BR112018009241 A BR 112018009241A BR 112018009241 A2 BR112018009241 A2 BR 112018009241A2
- Authority
- BR
- Brazil
- Prior art keywords
- block cipher
- target block
- input message
- compute
- cryptographic
- Prior art date
Links
- 238000004590 computer program Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09C—CIPHERING OR DECIPHERING APPARATUS FOR CRYPTOGRAPHIC OR OTHER PURPOSES INVOLVING THE NEED FOR SECRECY
- G09C1/00—Apparatus or methods whereby a given sequence of signs, e.g. an intelligible text, is transformed into an unintelligible sequence of signs by transposing the signs or groups of signs or by replacing them by others according to a predetermined system
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5386—Geometry or layout of the interconnection structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/005—Manufacturing coaxial lines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/06—Coaxial lines
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L9/00—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols
- H04L9/002—Countermeasures against attacks on cryptographic mechanisms
- H04L9/004—Countermeasures against attacks on cryptographic mechanisms for fault attacks
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L9/00—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols
- H04L9/06—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols the encryption apparatus using shift registers or memories for block-wise or stream coding, e.g. DES systems or RC4; Hash functions; Pseudorandom sequence generators
- H04L9/0618—Block ciphers, i.e. encrypting groups of characters of a plain text message using fixed encryption transformation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6616—Vertical connections, e.g. vias
- H01L2223/6622—Coaxial feed-throughs in active or passive substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L2209/00—Additional information or applications relating to cryptographic mechanisms or cryptographic arrangements for secret or secure communication H04L9/00
- H04L2209/16—Obfuscation or hiding, e.g. involving white box
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Security & Cryptography (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Theoretical Computer Science (AREA)
- Ceramic Engineering (AREA)
- Storage Device Security (AREA)
- Input From Keyboards Or The Like (AREA)
- Financial Or Insurance-Related Operations Such As Payment And Settlement (AREA)
- Communication Control (AREA)
Abstract
é apresentado um dispositivo criptográfico (100) disposto de modo a computar uma cifra de bloco-alvo (bt) em uma mensagem de entrada (110), sendo que o dispositivo compreende uma primeira e uma segunda unidades de cifra de bloco (121, 122) dispostas de modo a computar a cifra de bloco-alvo (bt) na mensagem de entrada, e uma primeira unidade de controle (130) disposta de modo a tomar o primeiro resultado da cifra de bloco e o segundo resultado da cifra de bloco como entrada, e para produzir o primeiro resultado da cifra de bloco somente se os resultados da cifra de bloco forem iguais.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL2015745A NL2015745B1 (en) | 2015-11-09 | 2015-11-09 | A cryptographic device arranged to compute a target block cipher. |
PCT/EP2016/075145 WO2017080769A1 (en) | 2015-11-09 | 2016-10-20 | A cryptographic device arranged to compute a target block cipher |
Publications (2)
Publication Number | Publication Date |
---|---|
BR112018009241A2 true BR112018009241A2 (pt) | 2018-11-06 |
BR112018009241A8 BR112018009241A8 (pt) | 2019-02-26 |
Family
ID=55697422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112018009241A BR112018009241A8 (pt) | 2015-11-09 | 2016-10-20 | dispositivo criptográfico disposto de modo a computar uma cifra de bloco-alvo em uma mensagem de entrada, método criptográfico para computar uma cifra de bloco-alvo em uma mensagem de entrada, programa de computador e mídia legível por computador |
Country Status (9)
Country | Link |
---|---|
US (2) | US10841077B2 (pt) |
EP (1) | EP3375128B1 (pt) |
JP (1) | JP6517438B2 (pt) |
CN (1) | CN108352981B (pt) |
BR (1) | BR112018009241A8 (pt) |
NL (1) | NL2015745B1 (pt) |
RU (1) | RU2711193C2 (pt) |
TR (1) | TR201910624T4 (pt) |
WO (1) | WO2017080769A1 (pt) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3407528A1 (en) | 2017-05-24 | 2018-11-28 | Koninklijke Philips N.V. | Cryptographic device and method |
EP3413500A1 (en) | 2017-06-09 | 2018-12-12 | Koninklijke Philips N.V. | Device and method to compute a block cipher |
EP3419005A1 (en) * | 2017-06-22 | 2018-12-26 | Gemalto Sa | Computing device processing expanded data |
AU2018320434B2 (en) * | 2017-08-22 | 2020-12-17 | Nippon Telegraph And Telephone Corporation | Secure computation device, secure computation method, program, and recording medium |
FR3074323B1 (fr) * | 2017-11-30 | 2019-12-06 | Idemia France | Procede et dispositif de traitement cryptographique de donnees |
CN108574566A (zh) * | 2018-02-13 | 2018-09-25 | 北京梆梆安全科技有限公司 | 一种白盒加解密方法、装置及存储介质 |
FR3078464A1 (fr) * | 2018-02-26 | 2019-08-30 | Stmicroelectronics (Rousset) Sas | Procede et circuit de mise en oeuvre d'une table de substitution |
FR3078463A1 (fr) * | 2018-02-26 | 2019-08-30 | Stmicroelectronics (Rousset) Sas | Procede et dispositif de realisation d'operations en table de substitution |
US11218291B2 (en) * | 2018-02-26 | 2022-01-04 | Stmicroelectronics (Rousset) Sas | Method and circuit for performing a substitution operation |
CN109088721B (zh) * | 2018-10-02 | 2022-01-28 | 复旦大学 | 一种可委托揭序加密方法 |
EP3664359A1 (en) * | 2018-12-07 | 2020-06-10 | Koninklijke Philips N.V. | A computation device using shared shares |
EP3672139A1 (en) | 2018-12-19 | 2020-06-24 | Koninklijke Philips N.V. | A circuit compiling device and circuit evaluation device |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH10154976A (ja) * | 1996-11-22 | 1998-06-09 | Toshiba Corp | タンパーフリー装置 |
IL139935A (en) * | 1998-06-03 | 2005-06-19 | Cryptography Res Inc | Des and other cryptographic processes with leak minimization for smartcards and other cryptosystems |
CA2327911A1 (en) | 2000-12-08 | 2002-06-08 | Cloakware Corporation | Obscuring functions in computer software |
FR2829331B1 (fr) | 2001-09-04 | 2004-09-10 | St Microelectronics Sa | Procede de securisation d'une quantite secrete |
EP1387519A3 (fr) * | 2002-07-09 | 2004-02-18 | Cp8 | Procédé de sécurisation d'un ensemble électronique contre des attaques par introduction d'erreurs |
FR2867635B1 (fr) | 2004-03-11 | 2006-09-22 | Oberthur Card Syst Sa | Procede de traitement de donnees securise, base notamment sur un algorithme cryptographique |
FR2871969B1 (fr) * | 2004-06-18 | 2006-12-01 | Sagem | Procede et dispositif d'execution d'un calcul cryptographique |
US8065532B2 (en) * | 2004-06-08 | 2011-11-22 | Hrl Laboratories, Llc | Cryptographic architecture with random instruction masking to thwart differential power analysis |
EP1997265B1 (en) * | 2006-03-10 | 2020-08-05 | Irdeto B.V. | Integrity of a data processing system using white-box for digital content protection |
JP5261088B2 (ja) * | 2008-09-09 | 2013-08-14 | 富士通株式会社 | 不正操作検知回路、不正操作検知回路を備えた装置、及び不正操作検知方法 |
US8971526B2 (en) * | 2011-07-26 | 2015-03-03 | Crocus-Technology Sa | Method of counter-measuring against side-channel attacks |
MX345372B (es) * | 2012-11-07 | 2017-01-27 | Koninklijke Philips Nv | Dispositivo de computo que almacena tablas de consulta para calculo de una funcion. |
BR112015014946A2 (pt) * | 2012-12-21 | 2017-07-11 | Koninklijke Philips Nv | dispositivo de computação, compilador, método eletrônico para computar uma função de dados e programa de computador |
US10142099B2 (en) * | 2013-01-11 | 2018-11-27 | Qualcomm Incorporated | Method and apparatus for a computable, large, variable and secure substitution box |
CN105359450B (zh) * | 2013-03-27 | 2020-08-07 | 爱迪德技术有限公司 | 防篡改密码算法实现 |
CN104657244A (zh) * | 2015-02-10 | 2015-05-27 | 上海创景计算机系统有限公司 | 嵌入式设备cpu总线故障注入测试系统及测试方法 |
US9473941B1 (en) * | 2015-06-16 | 2016-10-18 | Nokia Technologies Oy | Method, apparatus, and computer program product for creating an authenticated relationship between wireless devices |
EP3217307B1 (en) * | 2016-02-22 | 2018-11-07 | Eshard | Method of testing the resistance of a circuit to a side channel analysis of second order or more |
EP3300291A1 (en) * | 2016-09-27 | 2018-03-28 | Gemalto SA | Method to counter dca attacks of order 2 and higher |
US10673616B2 (en) * | 2017-01-11 | 2020-06-02 | Qualcomm Incorporated | Lightweight mitigation against first-order probing side-channel attacks on block ciphers |
EP3413500A1 (en) * | 2017-06-09 | 2018-12-12 | Koninklijke Philips N.V. | Device and method to compute a block cipher |
EP3584991A1 (en) * | 2018-06-18 | 2019-12-25 | Koninklijke Philips N.V. | Device for data encryption and integrity |
-
2015
- 2015-11-09 NL NL2015745A patent/NL2015745B1/en active
-
2016
- 2016-10-20 TR TR2019/10624T patent/TR201910624T4/tr unknown
- 2016-10-20 WO PCT/EP2016/075145 patent/WO2017080769A1/en active Application Filing
- 2016-10-20 BR BR112018009241A patent/BR112018009241A8/pt not_active Application Discontinuation
- 2016-10-20 EP EP16784190.7A patent/EP3375128B1/en active Active
- 2016-10-20 RU RU2018121280A patent/RU2711193C2/ru active
- 2016-10-20 JP JP2018523414A patent/JP6517438B2/ja active Active
- 2016-10-20 CN CN201680065372.XA patent/CN108352981B/zh active Active
- 2016-10-20 US US15/774,859 patent/US10841077B2/en active Active
-
2020
- 2020-10-28 US US17/082,414 patent/US11362802B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN108352981A (zh) | 2018-07-31 |
EP3375128B1 (en) | 2019-05-15 |
US20180331820A1 (en) | 2018-11-15 |
RU2711193C2 (ru) | 2020-01-15 |
CN108352981B (zh) | 2021-06-29 |
US20210050313A1 (en) | 2021-02-18 |
RU2018121280A (ru) | 2019-12-12 |
TR201910624T4 (tr) | 2019-08-21 |
NL2015745B1 (en) | 2017-05-26 |
BR112018009241A8 (pt) | 2019-02-26 |
EP3375128A1 (en) | 2018-09-19 |
WO2017080769A1 (en) | 2017-05-18 |
RU2018121280A3 (pt) | 2019-12-12 |
US10841077B2 (en) | 2020-11-17 |
JP2018533312A (ja) | 2018-11-08 |
JP6517438B2 (ja) | 2019-05-22 |
US11362802B2 (en) | 2022-06-14 |
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