BR112018001326A2 - adesivo sensível à pressão termicamente condutivo - Google Patents
adesivo sensível à pressão termicamente condutivoInfo
- Publication number
- BR112018001326A2 BR112018001326A2 BR112018001326A BR112018001326A BR112018001326A2 BR 112018001326 A2 BR112018001326 A2 BR 112018001326A2 BR 112018001326 A BR112018001326 A BR 112018001326A BR 112018001326 A BR112018001326 A BR 112018001326A BR 112018001326 A2 BR112018001326 A2 BR 112018001326A2
- Authority
- BR
- Brazil
- Prior art keywords
- boron nitride
- average
- agglomerates
- size
- type
- Prior art date
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title abstract 4
- 229910052582 BN Inorganic materials 0.000 abstract 7
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 abstract 7
- 239000000203 mixture Substances 0.000 abstract 6
- 239000011164 primary particle Substances 0.000 abstract 5
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 229920000058 polyacrylate Polymers 0.000 abstract 1
- 238000010998 test method Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP15180186.7A EP3127973B1 (en) | 2015-08-07 | 2015-08-07 | Thermally conductive pressure sensitive adhesive |
| PCT/US2016/043045 WO2017027178A1 (en) | 2015-08-07 | 2016-07-20 | Thermally conductive pressure sensitive adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR112018001326A2 true BR112018001326A2 (pt) | 2018-09-11 |
Family
ID=54010849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR112018001326A BR112018001326A2 (pt) | 2015-08-07 | 2016-07-20 | adesivo sensível à pressão termicamente condutivo |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20180215964A1 (https=) |
| EP (1) | EP3127973B1 (https=) |
| JP (1) | JP2018526496A (https=) |
| KR (1) | KR20180039095A (https=) |
| CN (1) | CN107849409B (https=) |
| BR (1) | BR112018001326A2 (https=) |
| TW (1) | TW201718741A (https=) |
| WO (1) | WO2017027178A1 (https=) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3182446B1 (en) * | 2015-12-17 | 2019-06-05 | 3M Innovative Properties Company | Thermal interface material |
| EP3498667A1 (en) * | 2017-12-18 | 2019-06-19 | 3M Innovative Properties Company | Powder composition comprising first and second agglomerates of inorganic particles and polymer composition comprising a polymer and the powder composition |
| CN109868095B (zh) * | 2019-03-28 | 2021-04-27 | 上海西怡新材料科技有限公司 | 原位聚合型具有光扩散功能的有机硅-丙烯酸酯胶粘剂制备方法及其产品和应用 |
| EP3736300A1 (en) | 2019-05-06 | 2020-11-11 | 3M Innovative Properties Company | Curable precursor of a thermally- conductive adhesive composition |
| DE102019209571A1 (de) | 2019-06-28 | 2020-12-31 | Tesa Se | Haftklebmasse mit hohem Füllstoffanteil |
| WO2021176290A1 (en) | 2020-03-03 | 2021-09-10 | 3M Innovative Properties Company | Thermally conductive articles including entangled or aligned fibers, methods of making same, and battery modules |
| US20240026198A1 (en) * | 2021-01-06 | 2024-01-25 | Denka Company Limited | Boron nitride powder, heat dissipation sheet, and method for producing heat dissipation sheet |
| CN117321107A (zh) | 2021-05-21 | 2023-12-29 | 3M创新有限公司 | 粘合剂组合物的可固化前体 |
| EP4092059A1 (en) | 2021-05-21 | 2022-11-23 | 3M Innovative Properties Company | Curable precursor of an adhesive composition |
| EP4389788A1 (en) | 2022-12-21 | 2024-06-26 | 3M Innovative Properties Company | Curable precursor of a composition |
| WO2025084131A1 (ja) * | 2023-10-18 | 2025-04-24 | 株式会社日本触媒 | 電池部材用樹脂組成物 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2093191A1 (en) | 1992-04-15 | 1993-10-16 | Richard J. Webb | Psa containing thermally conductive, electrically insulative particles and a transfer tape from this psa |
| WO1998024860A1 (en) | 1996-12-04 | 1998-06-11 | Nitto Denko Corporation | Thermally conductive pressure-sensitive adhesive, adhesive sheet containing the same, and method for fixing electronic part to heat-radiating member with the same |
| US7744991B2 (en) * | 2003-05-30 | 2010-06-29 | 3M Innovative Properties Company | Thermally conducting foam interface materials |
| US7494635B2 (en) * | 2003-08-21 | 2009-02-24 | Saint-Gobain Ceramics & Plastics, Inc. | Boron nitride agglomerated powder |
| JP2009263542A (ja) | 2008-04-25 | 2009-11-12 | Three M Innovative Properties Co | （メタ）アクリル系粘着性発泡体及びその製造方法 |
| JP4848434B2 (ja) * | 2009-01-30 | 2011-12-28 | 日東電工株式会社 | 熱伝導性粘着剤組成物および熱伝導性粘着シート |
| JP5740103B2 (ja) | 2009-10-19 | 2015-06-24 | 日東電工株式会社 | 熱伝導部材、及びそれを用いた組電池装置 |
| DE102010050900A1 (de) * | 2010-11-10 | 2012-05-10 | Esk Ceramics Gmbh & Co. Kg | Bornitrid-Agglomerate, Verfahren zu deren Herstellung und deren Verwendung |
| JP2013213178A (ja) * | 2012-03-05 | 2013-10-17 | Nitto Denko Corp | 粘着剤原料および熱伝導性粘着シート |
| DE102012104049A1 (de) * | 2012-05-09 | 2013-11-28 | Esk Ceramics Gmbh & Co. Kg | Bornitrid-Agglomerate, Verfahren zu deren Herstellung und deren Verwendung |
| US9434870B2 (en) * | 2012-09-19 | 2016-09-06 | Momentive Performance Materials Inc. | Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics |
-
2015
- 2015-08-07 EP EP15180186.7A patent/EP3127973B1/en active Active
-
2016
- 2016-07-20 WO PCT/US2016/043045 patent/WO2017027178A1/en not_active Ceased
- 2016-07-20 BR BR112018001326A patent/BR112018001326A2/pt not_active IP Right Cessation
- 2016-07-20 CN CN201680044744.0A patent/CN107849409B/zh active Active
- 2016-07-20 JP JP2018506314A patent/JP2018526496A/ja not_active Withdrawn
- 2016-07-20 KR KR1020187006124A patent/KR20180039095A/ko not_active Ceased
- 2016-07-20 US US15/745,531 patent/US20180215964A1/en not_active Abandoned
- 2016-08-05 TW TW105125041A patent/TW201718741A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US20180215964A1 (en) | 2018-08-02 |
| JP2018526496A (ja) | 2018-09-13 |
| EP3127973B1 (en) | 2019-04-03 |
| CN107849409A (zh) | 2018-03-27 |
| KR20180039095A (ko) | 2018-04-17 |
| WO2017027178A1 (en) | 2017-02-16 |
| CN107849409B (zh) | 2021-06-25 |
| TW201718741A (zh) | 2017-06-01 |
| EP3127973A1 (en) | 2017-02-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B06U | Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette] | ||
| B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 5A ANUIDADE. |
|
| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2629 DE 25-05-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |