BR112014018456A2 - - Google Patents

Info

Publication number
BR112014018456A2
BR112014018456A2 BR112014018456A BR112014018456A BR112014018456A2 BR 112014018456 A2 BR112014018456 A2 BR 112014018456A2 BR 112014018456 A BR112014018456 A BR 112014018456A BR 112014018456 A BR112014018456 A BR 112014018456A BR 112014018456 A2 BR112014018456 A2 BR 112014018456A2
Authority
BR
Brazil
Application number
BR112014018456A
Other languages
Portuguese (pt)
Other versions
BR112014018456A8 (pt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/358,575 external-priority patent/US9889615B2/en
Application filed filed Critical
Publication of BR112014018456A2 publication Critical patent/BR112014018456A2/pt
Publication of BR112014018456A8 publication Critical patent/BR112014018456A8/pt

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C7/00—Optical parts
    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
    • G02C7/04—Contact lenses for the eyes
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C7/00—Optical parts
    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
    • G02C7/08—Auxiliary lenses; Arrangements for varying focal length
    • G02C7/081—Ophthalmic lenses with variable focal length
    • G02C7/083—Electrooptic lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Eyeglasses (AREA)
  • Prostheses (AREA)
BR112014018456A 2012-01-26 2013-01-25 Elemento de inserção de mídia de componente integrado empilhado para um dispositivo oftálmico BR112014018456A8 (pt)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US13/358,575 US9889615B2 (en) 2011-03-18 2012-01-26 Stacked integrated component media insert for an ophthalmic device
US13/358,577 US9914273B2 (en) 2011-03-18 2012-01-26 Method for using a stacked integrated component media insert in an ophthalmic device
US13/358,571 US9233513B2 (en) 2011-03-18 2012-01-26 Apparatus for manufacturing stacked integrated component media inserts for ophthalmic devices
PCT/US2013/023182 WO2013112862A1 (en) 2012-01-26 2013-01-25 Stacked integrated component media insert for an ophthalmic device

Publications (2)

Publication Number Publication Date
BR112014018456A2 true BR112014018456A2 (enrdf_load_html_response) 2017-06-20
BR112014018456A8 BR112014018456A8 (pt) 2017-07-11

Family

ID=47741261

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014018456A BR112014018456A8 (pt) 2012-01-26 2013-01-25 Elemento de inserção de mídia de componente integrado empilhado para um dispositivo oftálmico

Country Status (12)

Country Link
EP (1) EP2807518A1 (enrdf_load_html_response)
JP (1) JP6312605B2 (enrdf_load_html_response)
KR (1) KR20140117618A (enrdf_load_html_response)
CN (1) CN104204914B (enrdf_load_html_response)
AU (1) AU2013211968B2 (enrdf_load_html_response)
BR (1) BR112014018456A8 (enrdf_load_html_response)
CA (1) CA2862666A1 (enrdf_load_html_response)
HK (1) HK1204680A1 (enrdf_load_html_response)
RU (1) RU2629902C2 (enrdf_load_html_response)
SG (1) SG11201404174SA (enrdf_load_html_response)
TW (1) TWI616325B (enrdf_load_html_response)
WO (1) WO2013112862A1 (enrdf_load_html_response)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102248847B1 (ko) 2015-06-01 2021-05-06 삼성전자주식회사 에너지 수확부를 구비한 콘택트 렌즈
US20170086676A1 (en) * 2015-09-24 2017-03-30 Johnson & Johnson Vision Care, Inc. Quantum-dot spectrometers for use in biomedical devices and methods of use
CN108205207A (zh) * 2016-12-16 2018-06-26 江苏海伦隐形眼镜有限公司 一种智能隐形眼镜的制作方法
SG11202011022VA (en) 2018-05-10 2020-12-30 Acucela Inc Method and apparatus for treating refractive error of the eye
AU2019314262B2 (en) 2018-07-30 2025-04-03 Acucela Inc. An apparatus to treat myopia of an eye
WO2021022193A1 (en) 2019-07-31 2021-02-04 Acucela Inc. Device for projecting images on the retina
US11209672B1 (en) 2021-04-06 2021-12-28 Acucela Inc. Supporting pillars for encapsulating a flexible PCB within a soft hydrogel contact lens
US11366341B1 (en) 2021-05-04 2022-06-21 Acucela Inc. Electronic case for electronic spectacles

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0837190A (ja) * 1994-07-22 1996-02-06 Nec Corp 半導体装置
US6217171B1 (en) * 1998-05-26 2001-04-17 Novartis Ag Composite ophthamic lens
JP4172566B2 (ja) * 2000-09-21 2008-10-29 Ｔｄｋ株式会社 セラミック多層基板の表面電極構造及び表面電極の製造方法
AU2003263881A1 (en) * 2002-08-09 2004-02-25 E-Vision, Llc Electro-active contact lens system
EP1760515A3 (en) * 2003-10-03 2011-08-31 Invisia Ltd. Multifocal ophthalmic lens
US20070090869A1 (en) * 2005-10-26 2007-04-26 Motorola, Inc. Combined power source and printed transistor circuit apparatus and method
CN101395520A (zh) * 2006-01-10 2009-03-25 E-视觉有限公司 包含可机械弯曲集成插件的电激活眼镜镜片的改进制造装置和方法
JP5011820B2 (ja) * 2006-05-24 2012-08-29 オムロン株式会社 積層デバイス、およびその製造方法
AR064985A1 (es) * 2007-01-22 2009-05-06 E Vision Llc Lente electroactivo flexible
EP2115519A4 (en) * 2007-02-23 2012-12-05 Pixeloptics Inc DYNAMIC OPHTHALMIC OPENING
US20100076553A1 (en) * 2008-09-22 2010-03-25 Pugh Randall B Energized ophthalmic lens
US9296158B2 (en) * 2008-09-22 2016-03-29 Johnson & Johnson Vision Care, Inc. Binder of energized components in an ophthalmic lens
US9427920B2 (en) * 2008-09-30 2016-08-30 Johnson & Johnson Vision Care, Inc. Energized media for an ophthalmic device
US8348424B2 (en) * 2008-09-30 2013-01-08 Johnson & Johnson Vision Care, Inc. Variable focus ophthalmic device
US9375886B2 (en) * 2008-10-31 2016-06-28 Johnson & Johnson Vision Care Inc. Ophthalmic device with embedded microcontroller
JP5694947B2 (ja) * 2008-12-11 2015-04-01 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 医療用途のための伸張性電子部品を使用する装置
US8137148B2 (en) * 2009-09-30 2012-03-20 General Electric Company Method of manufacturing monolithic parallel interconnect structure
US9259309B2 (en) * 2010-06-20 2016-02-16 Elenza, Inc. Ophthalmic devices and methods with application specific integrated circuits

Also Published As

Publication number Publication date
RU2014134722A (ru) 2016-03-20
WO2013112862A1 (en) 2013-08-01
JP2015510143A (ja) 2015-04-02
RU2629902C2 (ru) 2017-09-04
TWI616325B (zh) 2018-03-01
EP2807518A1 (en) 2014-12-03
SG11201404174SA (en) 2014-10-30
BR112014018456A8 (pt) 2017-07-11
KR20140117618A (ko) 2014-10-07
CN104204914B (zh) 2018-06-15
CN104204914A (zh) 2014-12-10
HK1204680A1 (en) 2015-11-27
JP6312605B2 (ja) 2018-04-18
AU2013211968A1 (en) 2014-09-11
AU2013211968B2 (en) 2016-09-29
CA2862666A1 (en) 2013-08-01
TW201341165A (zh) 2013-10-16

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 7A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2551 DE 26-11-2019 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.