BR112014013857A8 - sensor de pressão de fluido e sonda de medição - Google Patents
sensor de pressão de fluido e sonda de mediçãoInfo
- Publication number
- BR112014013857A8 BR112014013857A8 BR112014013857A BR112014013857A BR112014013857A8 BR 112014013857 A8 BR112014013857 A8 BR 112014013857A8 BR 112014013857 A BR112014013857 A BR 112014013857A BR 112014013857 A BR112014013857 A BR 112014013857A BR 112014013857 A8 BR112014013857 A8 BR 112014013857A8
- Authority
- BR
- Brazil
- Prior art keywords
- fluid pressure
- sensitive membrane
- sidewalls
- measuring probe
- pressure sensor
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
Abstract
resumo patente de invenção: "sensor de pressão de fluido e sonda de medição". a presente invenção refere-se a um sensor de medição de pressão de fluido (11) compreendendo um chip de sistema microeletromecânico mems (23). o chip de mems (23) compreende duas paredes laterais (56), uma membrana sensível (49) conectada a ditas paredes laterais (56) e cavidade vedada (9). as superfícies exteriores das paredes laterais (56) e a membrana sensível (49) são expostas à pressão de fluido. as paredes laterais (56) são projetadas para submeter a membrana sensível (49) a uma tensão de compressão transmitida pelas paredes laterais (56) opostas onde ditas paredes laterais (56) são conectadas à membrana sensível (49) de modo que a membrana sensível (49) trabalha em compressão somente. o chip de mems (23) também compreende um circuito de detecção de tensão (31) para medir o estado de compressão da membrana sensível (49) que é proporcional à pressão de fluido.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1161376 | 2011-12-09 | ||
FR1161376A FR2983955B1 (fr) | 2011-12-09 | 2011-12-09 | Capteur de pression pour fluide |
PCT/EP2012/074873 WO2013083821A1 (en) | 2011-12-09 | 2012-12-07 | Fluid pressure sensor and measurement probe |
Publications (3)
Publication Number | Publication Date |
---|---|
BR112014013857A2 BR112014013857A2 (pt) | 2017-06-13 |
BR112014013857A8 true BR112014013857A8 (pt) | 2017-06-13 |
BR112014013857B1 BR112014013857B1 (pt) | 2020-09-29 |
Family
ID=47435906
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112014013857-5A BR112014013857B1 (pt) | 2011-12-09 | 2012-12-07 | Sensor de pressão de fluido e sonda de medição |
Country Status (9)
Country | Link |
---|---|
US (1) | US8931347B2 (pt) |
EP (1) | EP2788732B1 (pt) |
CN (1) | CN104040315B (pt) |
AU (1) | AU2012350278B2 (pt) |
BR (1) | BR112014013857B1 (pt) |
CA (1) | CA2858146C (pt) |
FR (1) | FR2983955B1 (pt) |
MX (1) | MX336698B (pt) |
WO (1) | WO2013083821A1 (pt) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10006823B2 (en) | 2013-06-20 | 2018-06-26 | The Regents Of The University Of Michigan | Microdischarge-based transducer |
CN105408742B (zh) * | 2013-07-26 | 2018-08-24 | 安捷伦科技有限公司 | 用于hplc应用的压力测定 |
CN103604556A (zh) * | 2013-11-26 | 2014-02-26 | 无锡市纳微电子有限公司 | 一种流体压力传感器 |
JP6166185B2 (ja) * | 2014-01-06 | 2017-07-19 | アルプス電気株式会社 | Memsセンサ |
US9902611B2 (en) * | 2014-01-13 | 2018-02-27 | Nextinput, Inc. | Miniaturized and ruggedized wafer level MEMs force sensors |
WO2015142949A1 (en) | 2014-03-17 | 2015-09-24 | The Regents Of The University Of Michigan | Packaged microsystems |
DE102015104410B4 (de) * | 2015-03-24 | 2018-09-13 | Tdk-Micronas Gmbh | Drucksensor |
DE102015210919A1 (de) * | 2015-06-15 | 2016-12-15 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | MEMS-Wandler zum Interagieren mit einem Volumenstrom eines Fluids und Verfahren zum Herstellen desselben |
CN106313350B (zh) * | 2015-07-06 | 2018-06-29 | 天津职业技术师范大学 | 一种多线切割切割区温度测量装置 |
IT201600118077A1 (it) * | 2016-11-22 | 2018-05-22 | Francesco Tondolo | Sistema integrato e metodo per la misura della deformazione e/o tensione in elementi monodimensionali. |
WO2018148510A1 (en) | 2017-02-09 | 2018-08-16 | Nextinput, Inc. | Integrated piezoresistive and piezoelectric fusion force sensor |
CN116907693A (zh) | 2017-02-09 | 2023-10-20 | 触控解决方案股份有限公司 | 集成数字力传感器和相关制造方法 |
IT201700071798A1 (it) * | 2017-06-27 | 2018-12-27 | St Microelectronics Srl | Sensore di forza multiassiale, metodo di fabbricazione del sensore di forza multiassiale, e metodo di funzionamento del sensore di forza multiassiale |
CN111448446B (zh) | 2017-07-19 | 2022-08-30 | 触控解决方案股份有限公司 | 在mems力传感器中的应变传递堆叠 |
US11423686B2 (en) | 2017-07-25 | 2022-08-23 | Qorvo Us, Inc. | Integrated fingerprint and force sensor |
WO2019023552A1 (en) | 2017-07-27 | 2019-01-31 | Nextinput, Inc. | PIEZORESISTIVE AND PIEZOELECTRIC FORCE SENSOR ON WAFER AND METHODS OF MANUFACTURING THE SAME |
US11579028B2 (en) | 2017-10-17 | 2023-02-14 | Nextinput, Inc. | Temperature coefficient of offset compensation for force sensor and strain gauge |
WO2019090057A1 (en) | 2017-11-02 | 2019-05-09 | Nextinput, Inc. | Sealed force sensor with etch stop layer |
WO2019099821A1 (en) | 2017-11-16 | 2019-05-23 | Nextinput, Inc. | Force attenuator for force sensor |
CN108760140A (zh) * | 2018-07-26 | 2018-11-06 | 沈阳白云机械有限公司 | 压力检测仪 |
US10962427B2 (en) | 2019-01-10 | 2021-03-30 | Nextinput, Inc. | Slotted MEMS force sensor |
CN113348348B (zh) * | 2019-02-28 | 2023-11-17 | 阿尔卑斯阿尔派株式会社 | 压力传感器 |
DE102019129411A1 (de) * | 2019-09-12 | 2021-03-18 | Wika Alexander Wiegand Se & Co. Kg | Aufnehmerkörper mit einem Messelement und Herstellungsverfahren für einen Aufnehmerkörper |
CN110749268A (zh) * | 2019-10-28 | 2020-02-04 | 江苏厚生新能源科技有限公司 | 适于检测隔膜弓形的测试装置及其工作方法 |
US11492255B2 (en) | 2020-04-03 | 2022-11-08 | Saudi Arabian Oil Company | Steam methane reforming with steam regeneration |
US11703408B1 (en) * | 2020-04-30 | 2023-07-18 | Senva, Inc. | Versatilely mountable pressure sensing apparatus, system, and/or method |
WO2021240197A1 (en) | 2020-05-26 | 2021-12-02 | Saudi Arabian Oil Company | Geosteering in directional drilling |
EP4158154A1 (en) | 2020-05-26 | 2023-04-05 | Saudi Arabian Oil Company | Water detection for geosteering in directional drilling |
US11583824B2 (en) | 2020-06-18 | 2023-02-21 | Saudi Arabian Oil Company | Hydrogen production with membrane reformer |
US11492254B2 (en) | 2020-06-18 | 2022-11-08 | Saudi Arabian Oil Company | Hydrogen production with membrane reformer |
US11999619B2 (en) | 2020-06-18 | 2024-06-04 | Saudi Arabian Oil Company | Hydrogen production with membrane reactor |
US20220236128A1 (en) * | 2021-01-27 | 2022-07-28 | Honeywell International Inc. | Pressure sensor components having microfluidic channels |
US11787759B2 (en) | 2021-08-12 | 2023-10-17 | Saudi Arabian Oil Company | Dimethyl ether production via dry reforming and dimethyl ether synthesis in a vessel |
US11578016B1 (en) | 2021-08-12 | 2023-02-14 | Saudi Arabian Oil Company | Olefin production via dry reforming and olefin synthesis in a vessel |
US11718575B2 (en) | 2021-08-12 | 2023-08-08 | Saudi Arabian Oil Company | Methanol production via dry reforming and methanol synthesis in a vessel |
US20230175905A1 (en) * | 2021-12-02 | 2023-06-08 | Goodrich Corporation | Pressure monitoring systems and methods for pressure bottle |
US11617981B1 (en) | 2022-01-03 | 2023-04-04 | Saudi Arabian Oil Company | Method for capturing CO2 with assisted vapor compression |
CN115290246B (zh) * | 2022-03-25 | 2024-07-19 | 西人马联合测控(泉州)科技有限公司 | 一种交叉耦合的双芯片压力传感器 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010001550A1 (en) * | 1998-11-12 | 2001-05-24 | Janusz Bryzek | Integral stress isolation apparatus and technique for semiconductor devices |
US6120458A (en) * | 1999-01-07 | 2000-09-19 | Welch Allyn, Inc. | Low profile pressure measure device |
FR2792070B1 (fr) * | 1999-04-06 | 2001-06-08 | Suez Lyonnaise Des Eaux | Appareil pour la mesure et l'enregistrement de la pression d'un reseau de distribution d'eau |
US6601452B2 (en) * | 2000-06-05 | 2003-08-05 | Denso Corporation | Semiconductor pressure sensor having rounded corner portion of diaphragm |
US6928879B2 (en) | 2003-02-26 | 2005-08-16 | Robert Bosch Gmbh | Episeal pressure sensor and method for making an episeal pressure sensor |
US6988412B1 (en) * | 2004-11-30 | 2006-01-24 | Endevco Corporation | Piezoresistive strain concentrator |
US7334484B2 (en) * | 2005-05-27 | 2008-02-26 | Rosemount Inc. | Line pressure measurement using differential pressure sensor |
JP4291394B1 (ja) * | 2008-03-12 | 2009-07-08 | ファナック株式会社 | 接触式計測装置 |
AT511330B1 (de) * | 2011-06-03 | 2012-11-15 | Piezocryst Advanced Sensorics | Sensor für die messung von druck und/oder kraft |
SG188777A1 (en) * | 2011-09-28 | 2013-04-30 | Agency Science Tech & Res | A sensor device |
-
2011
- 2011-12-09 FR FR1161376A patent/FR2983955B1/fr not_active Expired - Fee Related
-
2012
- 2012-12-07 CA CA2858146A patent/CA2858146C/en active Active
- 2012-12-07 BR BR112014013857-5A patent/BR112014013857B1/pt active IP Right Grant
- 2012-12-07 MX MX2014006922A patent/MX336698B/es unknown
- 2012-12-07 EP EP12806393.0A patent/EP2788732B1/en active Active
- 2012-12-07 US US13/707,802 patent/US8931347B2/en active Active
- 2012-12-07 CN CN201280067062.3A patent/CN104040315B/zh not_active Expired - Fee Related
- 2012-12-07 WO PCT/EP2012/074873 patent/WO2013083821A1/en active Application Filing
- 2012-12-07 AU AU2012350278A patent/AU2012350278B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
FR2983955A1 (fr) | 2013-06-14 |
BR112014013857A2 (pt) | 2017-06-13 |
CN104040315B (zh) | 2016-03-09 |
WO2013083821A1 (en) | 2013-06-13 |
US8931347B2 (en) | 2015-01-13 |
BR112014013857B1 (pt) | 2020-09-29 |
CN104040315A (zh) | 2014-09-10 |
CA2858146A1 (en) | 2013-06-13 |
MX336698B (es) | 2016-01-28 |
MX2014006922A (es) | 2015-01-22 |
US20130145853A1 (en) | 2013-06-13 |
CA2858146C (en) | 2019-02-12 |
FR2983955B1 (fr) | 2014-10-03 |
AU2012350278B2 (en) | 2015-11-26 |
EP2788732B1 (en) | 2021-02-24 |
AU2012350278A1 (en) | 2014-06-26 |
EP2788732A1 (en) | 2014-10-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B06F | Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette] | ||
B06U | Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 07/12/2012, OBSERVADAS AS CONDICOES LEGAIS. |