BR112014013857A2 - sensor de pressão de fluido e sonda de medição - Google Patents

sensor de pressão de fluido e sonda de medição

Info

Publication number
BR112014013857A2
BR112014013857A2 BR112014013857A BR112014013857A BR112014013857A2 BR 112014013857 A2 BR112014013857 A2 BR 112014013857A2 BR 112014013857 A BR112014013857 A BR 112014013857A BR 112014013857 A BR112014013857 A BR 112014013857A BR 112014013857 A2 BR112014013857 A2 BR 112014013857A2
Authority
BR
Brazil
Prior art keywords
fluid pressure
sensitive membrane
sidewalls
measuring probe
pressure sensor
Prior art date
Application number
BR112014013857A
Other languages
English (en)
Other versions
BR112014013857A8 (pt
BR112014013857B1 (pt
Inventor
Tavernier Emmanuel
Donzier Eric
Original Assignee
Openfield
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Openfield filed Critical Openfield
Publication of BR112014013857A8 publication Critical patent/BR112014013857A8/pt
Publication of BR112014013857A2 publication Critical patent/BR112014013857A2/pt
Publication of BR112014013857B1 publication Critical patent/BR112014013857B1/pt

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)

Abstract

resumo patente de invenção: "sensor de pressão de fluido e sonda de medição". a presente invenção refere-se a um sensor de medição de pressão de fluido (11) compreendendo um chip de sistema microeletromecânico mems (23). o chip de mems (23) compreende duas paredes laterais (56), uma membrana sensível (49) conectada a ditas paredes laterais (56) e cavidade vedada (9). as superfícies exteriores das paredes laterais (56) e a membrana sensível (49) são expostas à pressão de fluido. as paredes laterais (56) são projetadas para submeter a membrana sensível (49) a uma tensão de compressão transmitida pelas paredes laterais (56) opostas onde ditas paredes laterais (56) são conectadas à membrana sensível (49) de modo que a membrana sensível (49) trabalha em compressão somente. o chip de mems (23) também compreende um circuito de detecção de tensão (31) para medir o estado de compressão da membrana sensível (49) que é proporcional à pressão de fluido.
BR112014013857-5A 2011-12-09 2012-12-07 Sensor de pressão de fluido e sonda de medição BR112014013857B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1161376 2011-12-09
FR1161376A FR2983955B1 (fr) 2011-12-09 2011-12-09 Capteur de pression pour fluide
PCT/EP2012/074873 WO2013083821A1 (en) 2011-12-09 2012-12-07 Fluid pressure sensor and measurement probe

Publications (3)

Publication Number Publication Date
BR112014013857A8 BR112014013857A8 (pt) 2017-06-13
BR112014013857A2 true BR112014013857A2 (pt) 2017-06-13
BR112014013857B1 BR112014013857B1 (pt) 2020-09-29

Family

ID=47435906

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014013857-5A BR112014013857B1 (pt) 2011-12-09 2012-12-07 Sensor de pressão de fluido e sonda de medição

Country Status (9)

Country Link
US (1) US8931347B2 (pt)
EP (1) EP2788732B1 (pt)
CN (1) CN104040315B (pt)
AU (1) AU2012350278B2 (pt)
BR (1) BR112014013857B1 (pt)
CA (1) CA2858146C (pt)
FR (1) FR2983955B1 (pt)
MX (1) MX336698B (pt)
WO (1) WO2013083821A1 (pt)

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CN103604556A (zh) * 2013-11-26 2014-02-26 无锡市纳微电子有限公司 一种流体压力传感器
JP6166185B2 (ja) * 2014-01-06 2017-07-19 アルプス電気株式会社 Ｍｅｍｓセンサ
CN105934661B (zh) * 2014-01-13 2019-11-05 触控解决方案股份有限公司 微型强化圆片级mems力传感器
WO2015142949A1 (en) 2014-03-17 2015-09-24 The Regents Of The University Of Michigan Packaged microsystems
DE102015104410B4 (de) * 2015-03-24 2018-09-13 Tdk-Micronas Gmbh Drucksensor
DE102015210919A1 (de) * 2015-06-15 2016-12-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. MEMS-Wandler zum Interagieren mit einem Volumenstrom eines Fluids und Verfahren zum Herstellen desselben
CN106313350B (zh) * 2015-07-06 2018-06-29 天津职业技术师范大学 一种多线切割切割区温度测量装置
IT201600118077A1 (it) * 2016-11-22 2018-05-22 Francesco Tondolo Sistema integrato e metodo per la misura della deformazione e/o tensione in elementi monodimensionali.
WO2018148503A1 (en) 2017-02-09 2018-08-16 Nextinput, Inc. Integrated digital force sensors and related methods of manufacture
US11243125B2 (en) 2017-02-09 2022-02-08 Nextinput, Inc. Integrated piezoresistive and piezoelectric fusion force sensor
IT201700071798A1 (it) * 2017-06-27 2018-12-27 St Microelectronics Srl Sensore di forza multiassiale, metodo di fabbricazione del sensore di forza multiassiale, e metodo di funzionamento del sensore di forza multiassiale
US11221263B2 (en) 2017-07-19 2022-01-11 Nextinput, Inc. Microelectromechanical force sensor having a strain transfer layer arranged on the sensor die
US11423686B2 (en) 2017-07-25 2022-08-23 Qorvo Us, Inc. Integrated fingerprint and force sensor
WO2019023552A1 (en) 2017-07-27 2019-01-31 Nextinput, Inc. PIEZORESISTIVE AND PIEZOELECTRIC FORCE SENSOR ON WAFER AND METHODS OF MANUFACTURING THE SAME
US11579028B2 (en) 2017-10-17 2023-02-14 Nextinput, Inc. Temperature coefficient of offset compensation for force sensor and strain gauge
US11385108B2 (en) 2017-11-02 2022-07-12 Nextinput, Inc. Sealed force sensor with etch stop layer
WO2019099821A1 (en) 2017-11-16 2019-05-23 Nextinput, Inc. Force attenuator for force sensor
CN108760140A (zh) * 2018-07-26 2018-11-06 沈阳白云机械有限公司 压力检测仪
US10962427B2 (en) 2019-01-10 2021-03-30 Nextinput, Inc. Slotted MEMS force sensor
WO2020175408A1 (ja) * 2019-02-28 2020-09-03 アルプスアルパイン株式会社 圧力センサ
DE102019129411A1 (de) * 2019-09-12 2021-03-18 Wika Alexander Wiegand Se & Co. Kg Aufnehmerkörper mit einem Messelement und Herstellungsverfahren für einen Aufnehmerkörper
CN110749268A (zh) * 2019-10-28 2020-02-04 江苏厚生新能源科技有限公司 适于检测隔膜弓形的测试装置及其工作方法
US11492255B2 (en) 2020-04-03 2022-11-08 Saudi Arabian Oil Company Steam methane reforming with steam regeneration
US11703408B1 (en) * 2020-04-30 2023-07-18 Senva, Inc. Versatilely mountable pressure sensing apparatus, system, and/or method
US11492254B2 (en) 2020-06-18 2022-11-08 Saudi Arabian Oil Company Hydrogen production with membrane reformer
US11583824B2 (en) 2020-06-18 2023-02-21 Saudi Arabian Oil Company Hydrogen production with membrane reformer
US20220236128A1 (en) * 2021-01-27 2022-07-28 Honeywell International Inc. Pressure sensor components having microfluidic channels
US11578016B1 (en) 2021-08-12 2023-02-14 Saudi Arabian Oil Company Olefin production via dry reforming and olefin synthesis in a vessel
US11787759B2 (en) 2021-08-12 2023-10-17 Saudi Arabian Oil Company Dimethyl ether production via dry reforming and dimethyl ether synthesis in a vessel
US11718575B2 (en) 2021-08-12 2023-08-08 Saudi Arabian Oil Company Methanol production via dry reforming and methanol synthesis in a vessel
US11617981B1 (en) 2022-01-03 2023-04-04 Saudi Arabian Oil Company Method for capturing CO2 with assisted vapor compression
CN115290246A (zh) * 2022-03-25 2022-11-04 西人马联合测控（泉州）科技有限公司 一种交叉耦合的双芯片压力传感器

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Also Published As

Publication number Publication date
CN104040315B (zh) 2016-03-09
WO2013083821A1 (en) 2013-06-13
BR112014013857A8 (pt) 2017-06-13
FR2983955B1 (fr) 2014-10-03
AU2012350278B2 (en) 2015-11-26
CN104040315A (zh) 2014-09-10
AU2012350278A1 (en) 2014-06-26
MX336698B (es) 2016-01-28
FR2983955A1 (fr) 2013-06-14
EP2788732A1 (en) 2014-10-15
BR112014013857B1 (pt) 2020-09-29
US20130145853A1 (en) 2013-06-13
CA2858146C (en) 2019-02-12
CA2858146A1 (en) 2013-06-13
MX2014006922A (es) 2015-01-22
US8931347B2 (en) 2015-01-13
EP2788732B1 (en) 2021-02-24

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 07/12/2012, OBSERVADAS AS CONDICOES LEGAIS.