BR112014001465A2 - composição de resina de epóxi curável - Google Patents

composição de resina de epóxi curável

Info

Publication number
BR112014001465A2
BR112014001465A2 BR112014001465A BR112014001465A BR112014001465A2 BR 112014001465 A2 BR112014001465 A2 BR 112014001465A2 BR 112014001465 A BR112014001465 A BR 112014001465A BR 112014001465 A BR112014001465 A BR 112014001465A BR 112014001465 A2 BR112014001465 A2 BR 112014001465A2
Authority
BR
Brazil
Prior art keywords
epoxy resin
resin composition
curable
curable epoxy
resin component
Prior art date
Application number
BR112014001465A
Other languages
English (en)
Other versions
BR112014001465B1 (pt
Inventor
Ho Chau-Hon
Tzavalas Spiros
Original Assignee
Abb Research Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Research Ltd filed Critical Abb Research Ltd
Publication of BR112014001465A2 publication Critical patent/BR112014001465A2/pt
Publication of BR112014001465B1 publication Critical patent/BR112014001465B1/pt

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/24Di-epoxy compounds carbocyclic
    • C08G59/245Di-epoxy compounds carbocyclic aromatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

resumo patente de invenção: "composição de resina de epóxi curável". a presente invenção refere-se a uma composição de resina de epóxi curável compreendendo um componente de resina de epóxi aromático definido e um sistema de catalisador latente definido, e opcionalmente aditivos adicionais, a dita composição curável sendo uma composição de resina de epóxi única tendo uma vida útil prolongada em uma temperatura de processamento dentro da faixa de 40°c a 70°c, em que: (a) o componente de resina de epóxi é um composto de fórmula (i) em forma monomérica ou em uma forma polimérica baixa do mesmo, ou é uma mistura de tais compostos: o dito componente de resina de epóxi tendo uma viscosidade inerente dentro da faixa de 80 mpas a 300 mpas, medida a uma temperatura de 50°c; (b) o sistema de catalisador latente compreende pelo menos um acetilacetonato de metal e pelo menos um composto fenólico
BR112014001465-5A 2011-07-29 2011-07-29 Composiqao de resina de epoxi curavel, uso da composiqao de resina de epoxi curavel, artigo moldado na forma de um isolador eletrico, artigos eletricos e metodo de produzir uma composiqao de resina de epoxi curavel BR112014001465B1 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2011/063148 WO2013017149A1 (en) 2011-07-29 2011-07-29 Curable epoxy resin composition

Publications (2)

Publication Number Publication Date
BR112014001465A2 true BR112014001465A2 (pt) 2017-02-21
BR112014001465B1 BR112014001465B1 (pt) 2020-11-17

Family

ID=44629262

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014001465-5A BR112014001465B1 (pt) 2011-07-29 2011-07-29 Composiqao de resina de epoxi curavel, uso da composiqao de resina de epoxi curavel, artigo moldado na forma de um isolador eletrico, artigos eletricos e metodo de produzir uma composiqao de resina de epoxi curavel

Country Status (6)

Country Link
US (1) US9418774B2 (pt)
EP (1) EP2736941B9 (pt)
KR (1) KR101807194B1 (pt)
CN (1) CN103703048B (pt)
BR (1) BR112014001465B1 (pt)
WO (1) WO2013017149A1 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10388541B2 (en) 2015-04-20 2019-08-20 Xintec Inc. Wafer coating system and method of manufacturing chip package
DE102015213815A1 (de) * 2015-07-17 2017-01-19 Siemens Aktiengesellschaft Fester Isolationswerkstoff, Verwendung dazu und damit hergestelltes Isolationssystem
WO2017186618A1 (en) * 2016-04-26 2017-11-02 Abb Schweiz Ag Mica tape for insulating an electrical conductor and method for preparing an electrically insulated electrical conductor
CA3091959A1 (en) * 2018-03-16 2019-09-19 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Curable mixtures for use in impregnation of paper bushings
CA3091585A1 (en) 2018-03-16 2019-09-19 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Compositions for use in impregnation of paper bushings
DE102018121012A1 (de) * 2018-08-28 2020-03-05 Alzchem Trostberg Gmbh Verfahren zur Herstellung eines Druckgasbehälters
JP7308799B2 (ja) * 2020-08-31 2023-07-14 東芝三菱電機産業システム株式会社 レジン製造方法及び絶縁構造製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3812214A (en) 1971-10-28 1974-05-21 Gen Electric Hardenable composition consisting of an epoxy resin and a metal acetylacetonate
GB1402899A (en) * 1971-10-28 1975-08-13 Gen Electric Curable epoxy resin compositons
US4160926A (en) * 1975-06-20 1979-07-10 The Epoxylite Corporation Materials and impregnating compositions for insulating electric machines
JPS58500950A (ja) * 1981-06-05 1983-06-09 ゼネラル・エレクトリック・カンパニイ 熱硬化エポキシ組成物
JPS58500898A (ja) * 1981-06-12 1983-06-02 ゼネラル・エレクトリック・カンパニイ 成形コンパウンド
US4603182A (en) 1984-10-05 1986-07-29 General Electric Company Low viscosity epoxy resin compositions
US6800373B2 (en) 2002-10-07 2004-10-05 General Electric Company Epoxy resin compositions, solid state devices encapsulated therewith and method
EP1881033A1 (en) 2006-07-20 2008-01-23 Abb Research Ltd. Diluent free epoxy resin formulation

Also Published As

Publication number Publication date
KR20140056220A (ko) 2014-05-09
BR112014001465B1 (pt) 2020-11-17
KR101807194B1 (ko) 2017-12-08
US20140148529A1 (en) 2014-05-29
WO2013017149A1 (en) 2013-02-07
CN103703048A (zh) 2014-04-02
EP2736941B1 (en) 2016-01-20
EP2736941A1 (en) 2014-06-04
US9418774B2 (en) 2016-08-16
EP2736941B9 (en) 2016-08-10
CN103703048B (zh) 2016-09-21

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B25A Requested transfer of rights approved

Owner name: ABB SCHWEIZ AG (CH)

B25G Requested change of headquarter approved

Owner name: ABB SCHWEIZ AG (CH)

B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 29/07/2011, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 12A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2733 DE 23-05-2023 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.