BR112013029413A2 - circuit bonding material, circuit element bonding structure and method of manufacturing circuit element bonding structure - Google Patents

circuit bonding material, circuit element bonding structure and method of manufacturing circuit element bonding structure

Info

Publication number
BR112013029413A2
BR112013029413A2 BR112013029413A BR112013029413A BR112013029413A2 BR 112013029413 A2 BR112013029413 A2 BR 112013029413A2 BR 112013029413 A BR112013029413 A BR 112013029413A BR 112013029413 A BR112013029413 A BR 112013029413A BR 112013029413 A2 BR112013029413 A2 BR 112013029413A2
Authority
BR
Brazil
Prior art keywords
circuit
circuit element
bonding structure
element bonding
manufacturing
Prior art date
Application number
BR112013029413A
Other languages
Portuguese (pt)
Other versions
BR112013029413B1 (en
Inventor
Takemura Kenzou
Nakazawa Takashi
Fujinawa Tohru
Iijima Yuusuke
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of BR112013029413A2 publication Critical patent/BR112013029413A2/en
Publication of BR112013029413B1 publication Critical patent/BR112013029413B1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector

Abstract

resumo patente de invenção: "material de ligação de circuito, estrutura de ligação de elementos de circuito e método de fabricação de estrutura de ligação de elementos de circuito". a presente invenção refere-se a um material de ligação de circuitos para ligar eletricamente eletrodos de circuito opostos, compreendendo uma composição adesiva e partículas condutoras, em que a partícula condutora é um aglomerado de partículas, em que o diâmetro médio das partículas é de 5 a 20 µm, que possui um núcleo que compreende um metal com uma dureza vickers entre 300 e 1.000 ou níquel e uma camada mais externa que compreende um metal precioso que cobre o núcleo, e irregularidades são formadas na superfície da partícula condutora.patent summary: "circuit bonding material, circuit element bonding structure and method of manufacturing circuit element bonding structure". The present invention relates to a circuit bonding material for electrically bonding opposite circuit electrodes, comprising an adhesive composition and conductive particles, wherein the conductive particle is a particle agglomerate, wherein the average particle diameter is 5 µm. at 20 µm, having a core comprising a metal having a vickers hardness between 300 and 1,000 or nickel and an outer layer comprising a precious metal covering the core, and irregularities are formed on the surface of the conductive particle.

BR112013029413-2A 2011-05-18 2012-04-10 CIRCUIT CONNECTION MATERIAL, CIRCUIT ELEMENT CONNECTION STRUCTURE AND CIRCUIT ELEMENT CONNECTION STRUCTURE MANUFACTURING METHOD BR112013029413B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011111831 2011-05-18
JP2011-111831 2011-05-18
PCT/JP2012/059804 WO2012157375A1 (en) 2011-05-18 2012-04-10 Circuit connection material, circuit member connection structure, and circuit member connection structure manufacturing method

Publications (2)

Publication Number Publication Date
BR112013029413A2 true BR112013029413A2 (en) 2017-01-31
BR112013029413B1 BR112013029413B1 (en) 2021-08-10

Family

ID=47176716

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112013029413-2A BR112013029413B1 (en) 2011-05-18 2012-04-10 CIRCUIT CONNECTION MATERIAL, CIRCUIT ELEMENT CONNECTION STRUCTURE AND CIRCUIT ELEMENT CONNECTION STRUCTURE MANUFACTURING METHOD

Country Status (5)

Country Link
JP (2) JP6146302B2 (en)
KR (1) KR101899185B1 (en)
CN (2) CN103548207B (en)
BR (1) BR112013029413B1 (en)
WO (1) WO2012157375A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6330346B2 (en) * 2014-01-29 2018-05-30 日立化成株式会社 Adhesive composition, electronic member using adhesive composition, and method for manufacturing semiconductor device
WO2018042701A1 (en) 2016-08-30 2018-03-08 日立化成株式会社 Adhesive composition
KR102309135B1 (en) * 2017-03-06 2021-10-07 데쿠세리아루즈 가부시키가이샤 Resin composition, manufacturing method of resin composition, and structure
JP7180615B2 (en) * 2017-12-28 2022-11-30 昭和電工マテリアルズ株式会社 Manufacturing method of rare earth metal bonded magnet and rare earth metal bonded magnet
KR20200103043A (en) 2017-12-28 2020-09-01 히타치가세이가부시끼가이샤 Connection structure and manufacturing method thereof
WO2019142791A1 (en) * 2018-01-17 2019-07-25 日立化成株式会社 Adhesive composition, connection structure and method for producing same

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JPS63308880A (en) * 1987-06-11 1988-12-16 Sony Chem Corp Anisotropic conductive adhesive
JP2610900B2 (en) 1987-10-27 1997-05-14 ソニーケミカル 株式会社 Thermosetting anisotropic conductive adhesive sheet and method for producing the same
JP4289319B2 (en) 1997-03-31 2009-07-01 日立化成工業株式会社 Circuit connection material, circuit terminal connection structure and connection method
JPH10273626A (en) * 1997-03-31 1998-10-13 Hitachi Chem Co Ltd Circuit connecting material and production of circuit board
EP0979854B1 (en) 1997-03-31 2006-10-04 Hitachi Chemical Company, Ltd. Circuit connecting material, and structure and method of connecting circuit terminal
JP2000182691A (en) * 1998-12-17 2000-06-30 Hitachi Chem Co Ltd Circuit connecting member and connection method using therewith
JP4590732B2 (en) 2000-12-28 2010-12-01 日立化成工業株式会社 Circuit connection material, circuit board manufacturing method using the same, and circuit board
US6548175B2 (en) * 2001-01-11 2003-04-15 International Business Machines Corporation Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof
JP4860163B2 (en) * 2005-02-15 2012-01-25 積水化学工業株式会社 Method for producing conductive fine particles
JP2006245453A (en) * 2005-03-07 2006-09-14 Three M Innovative Properties Co Method of connecting flexible printed circuit board to other circuit board
CN101529574A (en) * 2006-10-31 2009-09-09 日立化成工业株式会社 Circuit connection structure
JP4217271B2 (en) * 2007-02-26 2009-01-28 積水化学工業株式会社 Conductive fine particles and anisotropic conductive materials
JP4872949B2 (en) * 2007-10-12 2012-02-08 日立化成工業株式会社 Circuit connection material and circuit member connection structure using the same
WO2009054386A1 (en) * 2007-10-22 2009-04-30 Nippon Chemical Industrial Co., Ltd. Coated conductive powder and conductive adhesive using the same
WO2009057612A1 (en) * 2007-10-31 2009-05-07 Hitachi Chemical Company, Ltd. Circuit connecting material and connecting structure for circuit member
KR20090054198A (en) * 2007-11-26 2009-05-29 쓰리엠 이노베이티브 프로퍼티즈 캄파니 Method for preparing adhesive sheet and adhesive sheet thereby
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CN102396038B (en) * 2009-04-28 2014-03-12 日立化成株式会社 Anisotropic conductive particles

Also Published As

Publication number Publication date
CN107254264B (en) 2019-07-09
JP6146302B2 (en) 2017-06-14
CN103548207A (en) 2014-01-29
JP2017073386A (en) 2017-04-13
WO2012157375A1 (en) 2012-11-22
BR112013029413B1 (en) 2021-08-10
JPWO2012157375A1 (en) 2014-07-31
CN107254264A (en) 2017-10-17
KR20140019380A (en) 2014-02-14
KR101899185B1 (en) 2018-09-14
CN103548207B (en) 2017-10-27

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 10/04/2012, OBSERVADAS AS CONDICOES LEGAIS.

B25D Requested change of name of applicant approved

Owner name: SHOWA DENKO MATERIALS CO., LTD. (JP)

B25D Requested change of name of applicant approved

Owner name: RESONAC CORPORATION (JP)

B25G Requested change of headquarter approved

Owner name: RESONAC CORPORATION (JP)