BR112013026962A2 - método para prover pulsos sequenciais de potência - Google Patents
método para prover pulsos sequenciais de potênciaInfo
- Publication number
- BR112013026962A2 BR112013026962A2 BR112013026962A BR112013026962A BR112013026962A2 BR 112013026962 A2 BR112013026962 A2 BR 112013026962A2 BR 112013026962 A BR112013026962 A BR 112013026962A BR 112013026962 A BR112013026962 A BR 112013026962A BR 112013026962 A2 BR112013026962 A2 BR 112013026962A2
- Authority
- BR
- Brazil
- Prior art keywords
- power
- sequential pulses
- cathodes
- pulses
- providing sequential
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3485—Sputtering using pulsed power to the target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3492—Variation of parameters during sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3464—Operating strategies
- H01J37/3467—Pulsed operation, e.g. HIPIMS
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Chemical Vapour Deposition (AREA)
- Surgical Instruments (AREA)
- Coating By Spraying Or Casting (AREA)
- Electrostatic Separation (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
Abstract
resumo patente de invenção: "método para prover pulsos sequenciais de potência". a presente invenção refere-se a um método para o suprimento de pulsos de potência para cátodos de pulverização pvd, os quais estão subdivididos em cátodos parciais, sendo que os intervalos de pulsos de potência, atuantes nos cátodos parciais, serão de tal modo selecionados que se sobrepõem, com o que se consegue que a tirada de potência do gerador alimentador do potencial não tenha que ser interrompida.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011018363A DE102011018363A1 (de) | 2011-04-20 | 2011-04-20 | Hochleistungszerstäubungsquelle |
DE102011018363.9 | 2011-04-20 | ||
DE102011117177A DE102011117177A1 (de) | 2011-10-28 | 2011-10-28 | Verfahren zur Bereitstellung sequenzieller Leistungspulse |
DE102011117177.4 | 2011-10-28 | ||
PCT/EP2012/001484 WO2012143091A1 (de) | 2011-04-20 | 2012-04-04 | Verfahren zur bereistellung sequenzieller leistungspulse |
Publications (2)
Publication Number | Publication Date |
---|---|
BR112013026962A2 true BR112013026962A2 (pt) | 2017-01-10 |
BR112013026962B1 BR112013026962B1 (pt) | 2021-02-09 |
Family
ID=46052693
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112013026962-6A BR112013026962B1 (pt) | 2011-04-20 | 2012-04-04 | método para prover pulsos de potência com intervalo de pulso de potência graduável para operar um cátodo de pulverização e método hipims |
Country Status (18)
Country | Link |
---|---|
US (1) | US9267200B2 (pt) |
EP (1) | EP2700083B1 (pt) |
JP (1) | JP5713331B2 (pt) |
KR (1) | KR101537883B1 (pt) |
CN (1) | CN103608893B (pt) |
AR (1) | AR086194A1 (pt) |
BR (1) | BR112013026962B1 (pt) |
CA (1) | CA2833796C (pt) |
ES (1) | ES2543053T3 (pt) |
HU (1) | HUE025643T2 (pt) |
MX (1) | MX346377B (pt) |
MY (1) | MY183993A (pt) |
PL (1) | PL2700083T3 (pt) |
PT (1) | PT2700083E (pt) |
RU (1) | RU2596818C2 (pt) |
SG (1) | SG194568A1 (pt) |
TW (1) | TWI586825B (pt) |
WO (1) | WO2012143091A1 (pt) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2789006B1 (de) | 2011-12-05 | 2018-10-31 | Oerlikon Surface Solutions AG, Pfäffikon | Reaktiver sputterprozess |
DE102012021346A1 (de) * | 2012-11-01 | 2014-08-28 | Oerlikon Trading Ag, Trübbach | Leistungsverteiler zur definierten sequenziellen Leistungsverteilung |
JP6463078B2 (ja) * | 2014-10-24 | 2019-01-30 | 日立金属株式会社 | 被覆工具の製造方法 |
US9812305B2 (en) * | 2015-04-27 | 2017-11-07 | Advanced Energy Industries, Inc. | Rate enhanced pulsed DC sputtering system |
CA3004920C (en) | 2015-11-12 | 2024-01-23 | Oerlikon Surface Solutions Ag, Pfaffikon | Sputtering arrangement and sputtering method for optimized distribution of the energy flow |
US11482404B2 (en) | 2015-12-21 | 2022-10-25 | Ionquest Corp. | Electrically and magnetically enhanced ionized physical vapor deposition unbalanced sputtering source |
US11359274B2 (en) * | 2015-12-21 | 2022-06-14 | IonQuestCorp. | Electrically and magnetically enhanced ionized physical vapor deposition unbalanced sputtering source |
US9951414B2 (en) | 2015-12-21 | 2018-04-24 | IonQuest LLC | Magnetically enhanced high density plasma-chemical vapor deposition plasma source for depositing diamond and diamond-like films |
US11823859B2 (en) | 2016-09-09 | 2023-11-21 | Ionquest Corp. | Sputtering a layer on a substrate using a high-energy density plasma magnetron |
US11542587B2 (en) | 2016-04-22 | 2023-01-03 | Oerlikon Surface Solutions Ag, Pfäffikon | TiCN having reduced growth defects by means of HiPIMS |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6141766A (ja) * | 1984-08-06 | 1986-02-28 | Hitachi Ltd | スパツタリング方法およびスパツタ−装置 |
JPH07116596B2 (ja) * | 1989-02-15 | 1995-12-13 | 株式会社日立製作所 | 薄膜形成方法、及びその装置 |
US5064520A (en) * | 1989-02-15 | 1991-11-12 | Hitachi, Ltd. | Method and apparatus for forming a film |
DE19651615C1 (de) * | 1996-12-12 | 1997-07-10 | Fraunhofer Ges Forschung | Verfahren zum Aufbringen von Kohlenstoffschichten durch reaktives Magnetron-Sputtern |
US20050103620A1 (en) * | 2003-11-19 | 2005-05-19 | Zond, Inc. | Plasma source with segmented magnetron cathode |
EP1580298A1 (fr) * | 2004-03-22 | 2005-09-28 | Materia Nova A.S.B.L | Dépôt par pulverisation cathodique magnétron en régime impulsionnel avec préionisation |
US20060260938A1 (en) * | 2005-05-20 | 2006-11-23 | Petrach Philip M | Module for Coating System and Associated Technology |
DE102006017382A1 (de) * | 2005-11-14 | 2007-05-16 | Itg Induktionsanlagen Gmbh | Verfahren und Vorrichtung zum Beschichten und/oder zur Behandlung von Oberflächen |
US20080197015A1 (en) * | 2007-02-16 | 2008-08-21 | Terry Bluck | Multiple-magnetron sputtering source with plasma confinement |
WO2009132822A2 (de) * | 2008-04-28 | 2009-11-05 | Cemecon Ag | Vorrichtung und verfahren zum vorbehandeln und beschichten von körpern |
DE202010001497U1 (de) * | 2010-01-29 | 2010-04-22 | Hauzer Techno-Coating B.V. | Beschichtungsvorrichtung mit einer HIPIMS-Leistungsquelle |
DE102011018363A1 (de) | 2011-04-20 | 2012-10-25 | Oerlikon Trading Ag, Trübbach | Hochleistungszerstäubungsquelle |
JP7116596B2 (ja) * | 2018-05-31 | 2022-08-10 | 川崎重工業株式会社 | リード線挿入装置およびリード線挿入方法 |
-
2012
- 2012-04-04 CN CN201280030387.4A patent/CN103608893B/zh active Active
- 2012-04-04 BR BR112013026962-6A patent/BR112013026962B1/pt active IP Right Grant
- 2012-04-04 RU RU2013151453/07A patent/RU2596818C2/ru active
- 2012-04-04 SG SG2013078290A patent/SG194568A1/en unknown
- 2012-04-04 WO PCT/EP2012/001484 patent/WO2012143091A1/de active Application Filing
- 2012-04-04 PL PL12720091T patent/PL2700083T3/pl unknown
- 2012-04-04 CA CA2833796A patent/CA2833796C/en active Active
- 2012-04-04 HU HUE12720091A patent/HUE025643T2/en unknown
- 2012-04-04 KR KR1020137027646A patent/KR101537883B1/ko active IP Right Grant
- 2012-04-04 MY MYPI2013003835A patent/MY183993A/en unknown
- 2012-04-04 PT PT127200913T patent/PT2700083E/pt unknown
- 2012-04-04 ES ES12720091.3T patent/ES2543053T3/es active Active
- 2012-04-04 JP JP2014505525A patent/JP5713331B2/ja active Active
- 2012-04-04 EP EP20120720091 patent/EP2700083B1/de active Active
- 2012-04-04 US US14/112,757 patent/US9267200B2/en active Active
- 2012-04-04 MX MX2013012198A patent/MX346377B/es active IP Right Grant
- 2012-04-18 TW TW101113746A patent/TWI586825B/zh not_active IP Right Cessation
- 2012-04-20 AR ARP120101358A patent/AR086194A1/es active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
PT2700083E (pt) | 2015-08-24 |
RU2596818C2 (ru) | 2016-09-10 |
EP2700083A1 (de) | 2014-02-26 |
US20140190819A1 (en) | 2014-07-10 |
JP2014514453A (ja) | 2014-06-19 |
CA2833796C (en) | 2018-07-31 |
JP5713331B2 (ja) | 2015-05-07 |
ES2543053T3 (es) | 2015-08-14 |
WO2012143091A8 (de) | 2013-11-28 |
TWI586825B (zh) | 2017-06-11 |
CN103608893B (zh) | 2016-08-31 |
KR101537883B1 (ko) | 2015-07-17 |
TW201243082A (en) | 2012-11-01 |
MY183993A (en) | 2021-03-17 |
US9267200B2 (en) | 2016-02-23 |
PL2700083T3 (pl) | 2015-10-30 |
AR086194A1 (es) | 2013-11-27 |
CA2833796A1 (en) | 2012-10-26 |
SG194568A1 (en) | 2013-12-30 |
WO2012143091A1 (de) | 2012-10-26 |
HUE025643T2 (en) | 2016-04-28 |
MX346377B (es) | 2017-03-16 |
BR112013026962B1 (pt) | 2021-02-09 |
KR20140019806A (ko) | 2014-02-17 |
RU2013151453A (ru) | 2015-05-27 |
CN103608893A (zh) | 2014-02-26 |
EP2700083B1 (de) | 2015-04-22 |
MX2013012198A (es) | 2014-05-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B06F | Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette] | ||
B06U | Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B25D | Requested change of name of applicant approved |
Owner name: OERLIKON SURFACE SOLUTIONS AG, TRUEBBACH (CH) |
|
B25D | Requested change of name of applicant approved |
Owner name: OERLIKON SURFACE SOLUTIONS AG, PFAEFFIKON (CH) |
|
B25G | Requested change of headquarter approved |
Owner name: OERLIKON SURFACE SOLUTIONS AG, PFAEFFIKON (CH) |
|
B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 04/04/2012, OBSERVADAS AS CONDICOES LEGAIS. |